EPF10K130EFC484-3N vs EPF10K130EFC484-3 Comparison
Detailed side-by-side comparison of EPF10K130EFC484-3N by Intel and EPF10K130EFC484-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K130EFC484-3N | EPF10K130EFC484-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | NRND |
| Series | FLEX-10KE | — |
| Number of Logic Elements / Cells | 6656 | — |
| Total RAM Bits | 65536 | — |
| Typical Gate Count | 130000 | 130,000 system gates |
| Number of I/O | 369 | — |
| Number of LABs/CLBs | 832 | — |
| Number of Embedded Array Blocks (EABs) | 72 | — |
| Speed Grade | -3 (faster timing bin) | -3 |
| Operating Temperature Grade | Commercial (0C to +70C) | — |
| Core Voltage | 2.5 V | — |
| Process Technology | 0.22 µm CMOS | — |
| Package Type | 484-BBGA (FineLine BGA) | — |
| Package Dimensions | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Configuration Memory | SRAM-based (volatile, requires config device) | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Configuration Interface | JTAG / PS / PPS / Altera serial | — |
| Family | — | FLEX 10KE |
| Logic Elements (LEs) | — | 6,656 |
| Logic Array Blocks (LABs) | — | 832 |
| Embedded Memory (EABs) | — | 16 x 4,096 bits (65,536 bits total) |
| Maximum User I/O | — | 369 |
| Supply Voltage (Core) | — | 3.3 V |
| I/O Voltage Support | — | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) |
| Propagation Delay | — | 0.6 ns (per LE) |
| Operating Temperature | — | 0 C to +70 C (commercial) |
| Package | — | 484-pin FBGA (FineLine BGA) |
| Configuration Method | — | SRAM-based, serial or parallel, requires external configuration device |
| Logic Family | — | CMOS (SRAM-based) |