EPM570GF256C3 vs EPM570GF256C4 비교
다음의 상세 나란히 비교: EPM570GF256C3 제조: Altera 및 EPM570GF256C4 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EPM570GF256C3 | EPM570GF256C4 |
|---|---|---|
| 브랜드 | Altera | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $10.40 | $29.85 |
| Family | MAX II | MAX II |
| Device Model | EPM570 | — |
| Logic Elements (LE) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User I/Os (max, FBGA-256) | 212 | — |
| User Flash Memory (UFM) | 8 Kbit | — |
| Propagation Delay tPD1 | 8.7 ns (C3 speed grade) | — |
| Internal Performance fMAX | 300 MHz | — |
| Process Technology | 0.18 um 6-layer-metal flash | 0.18 µm CMOS, flash-based configuration |
| Supply Voltage VCCINT | 1.8 V (core, MultiVolt) | 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) |
| 패키지 | FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free | 256-ball FBGA (FineLine BGA) |
| Operating Temperature (commercial) | -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C) | — |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | — |
| RoHS 상태 | Compliant (lead-free) | Lead-free, RoHS compliant |
| MSL 레벨 | 3 (per JEDEC J-STD-020, typical for FBGA) | — |
| Vertical Migration Within FBGA-256 | Supported across EPM570 / EPM1270 / EPM2210 | — |
| Logic Elements (LEs) | — | 570 |
| Macrocells | — | 440 |
| Maximum User I/Os | — | 212 |
| Pin-to-Pin Delay (tPD) | — | 5.4 ns |
| 동작 온도 | — | 0 °C to +85 °C (commercial) |
| Ball Pitch | — | 1.0 mm |
| 실장 유형 | — | Surface Mount |
| JTAG Support | — | IEEE 1149.1 boundary-scan + ISP |
| Configuration Memory | — | Non-volatile flash (instant-on, no boot PROM) |