EPM570GF256C3 vs EPM570GF256C4 Comparison

Detailed side-by-side comparison of EPM570GF256C3 by Altera and EPM570GF256C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPM570GF256C3 EPM570GF256C4
Brand Altera Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $10.40 $29.85
Family MAX II MAX II
Device Model EPM570 β€”
Logic Elements (LE) 570 β€”
Equivalent Macrocells 440 β€”
User I/Os (max, FBGA-256) 212 β€”
User Flash Memory (UFM) 8 Kbit β€”
Propagation Delay tPD1 8.7 ns (C3 speed grade) β€”
Internal Performance fMAX 300 MHz β€”
Process Technology 0.18 um 6-layer-metal flash 0.18 Β΅m CMOS, flash-based configuration
Supply Voltage VCCINT 1.8 V (core, MultiVolt) 1.71 V to 1.89 V (core, derived from 2.5/3.3 V)
I/O Bank Voltage VCCIO 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL)
Package FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free 256-ball FBGA (FineLine BGA)
Operating Temperature (commercial) -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C) β€”
Programming Interface JTAG (IEEE 1149.1) / ISP β€”
RoHS Status Compliant (lead-free) Lead-free, RoHS compliant
MSL Level 3 (per JEDEC J-STD-020, typical for FBGA) β€”
Vertical Migration Within FBGA-256 Supported across EPM570 / EPM1270 / EPM2210 β€”
Logic Elements (LEs) β€” 570
Macrocells β€” 440
Maximum User I/Os β€” 212
Pin-to-Pin Delay (tPD) β€” 5.4 ns
Operating Temperature β€” 0 Β°C to +85 Β°C (commercial)
Ball Pitch β€” 1.0 mm
Mounting Type β€” Surface Mount
JTAG Support β€” IEEE 1149.1 boundary-scan + ISP
Configuration Memory β€” Non-volatile flash (instant-on, no boot PROM)

Datasheets & Resources

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