K3LK4L40DM-BGCT vs K3KL1L10GM-JGCT 비교
다음의 상세 나란히 비교: K3LK4L40DM-BGCT 제조: Samsung Electronics 및 K3KL1L10GM-JGCT 제조: Samsung Electronics. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Samsung Electronics
K3LK4L40DM-BGCT - Samsung DRAM Memory IC | Samsung Electronics
K3LK4L40DM-BGCT ✓ 활성
사양 비교
| 파라미터 | K3LK4L40DM-BGCT | K3KL1L10GM-JGCT |
|---|---|---|
| 브랜드 | Samsung Electronics | Samsung Electronics |
| 카테고리 | DRAM | DRAM |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $40.50 | $30.90 |
| 메모리 유형 | DRAM (SDRAM component) | LPDDR5X DRAM (SDRAM) |
| Manufacturer | Samsung Electronics | — |
| Density | [DATA_NEEDED: Density] | 32 Gb (4 GB) |
| Organization (x-width) | [DATA_NEEDED: Organization] | — |
| 데이터 속도 | [DATA_NEEDED: Data Rate] | LPDDR5X-7500 (up to 7500 MT/s) |
| Supply Voltage Class | [DATA_NEEDED: Supply Voltage] | — |
| CAS 레이턴시 | [DATA_NEEDED: CAS Latency] | — |
| Package Type | BGA (per -BGC ordering-code suffix) | — |
| Package Ball Count | [DATA_NEEDED: Ball Count] | — |
| 실장 유형 | Surface Mount | Surface Mount (soldered-down BGA) |
| 동작 온도 | [DATA_NEEDED: Operating Temperature Range] | [DATA_NEEDED: operating temperature range] |
| Refresh Rate | [DATA_NEEDED: Refresh Interval] | [DATA_NEEDED: refresh specification] |
| RoHS 상태 | [DATA_NEEDED: RoHS Status] | unknown |
| Lead Free | [DATA_NEEDED: Lead-Free Status] | — |
| MSL 레벨 | [DATA_NEEDED: Moisture Sensitivity Level] | [DATA_NEEDED: moisture sensitivity level] |
| Packaging | Tape & Reel (per -T-style suffix convention) [DATA_NEEDED: confirmed packaging] | — |
| Interface Organization | — | x64 |
| Generation | — | LPDDR5X (premium low-power DRAM) |
| Speed vs Previous Generation | — | Up to 1.25x faster than LPDDR5 |
| Power Efficiency vs Previous Generation | — | Approximately 25% better than LPDDR5 |
| 패키지 | — | 441-ball FBGA |
| Application Class | — | AI edge devices, in-vehicle devices, flagship mobile |
| 공급 전압 | — | [DATA_NEEDED: VDD/VDDQ supply voltage] |
| Access Latency | — | [DATA_NEEDED: CAS latency / tRCD / tRP timings] |