10AS032E4F29E3SG - Arria 10 SX 320K SoC FPGA | Intel
부품 번호: 10AS032E4F29E3SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2450 | $2,450.00 |
| 10 | $2310 | $23,100.00 |
| 50 | $2180 | $109,000.00 |
| 100 | $2050 | $205,000.00 |
| 250 | $1920 | $480,000.00 |
10AS032E4F29E3SG 개요
An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that fuses a hardened ARM processor subsystem with programmable FPGA fabric on a single die. Within the broader taxonomy, an SoC FPGA belongs to programmable logic (FPGA family), bridging general-purpose computing (MCU/CPU) and hardware-accelerated DSP/parallel processing. The hardened ARM Cortex-A9 cores run operating systems such as Linux while the FPGA fabric executes parallel datapath and DSP workloads with deterministic latency, offering a more power-efficient alternative to discrete CPU + FPGA co-processor designs.
Key features of the 10AS032E4F29E3SG include 320K logic elements, 1.5 GHz HPS capability, 28.05 Mbits embedded memory, 384 DSP blocks, 17.4 Gbps transceivers, hardened memory controllers (DDR3/DDR4/LPDDR2), PCI Express Gen3 x8 hard IP, and integrated CoreSight debug. The device operates across industrial and commercial temperature grades with a 0.9 V core supply.
The architecture pairs dual ARM Cortex-A9 cores with NEON media engine and single/double-precision FPU with Arria 10 adaptive logic modules (ALMs), variable-precision DSP blocks, and 20nm transceivers. This heterogeneous compute fabric is suited for latency-critical control loops and parallel signal-processing pipelines that cannot be efficiently executed on a software-only processor.
Typical applications include motor control and industrial drive inverters, 5G baseband signal processing, machine vision and video broadcast acceleration, automotive ADAS prototyping, medical imaging pre-processing, and defense radar/electronic warfare prototyping. Designers may also target the device for test and measurement front-end DSP where parallel I/O aggregation is required.
When designing with this device, allocate adequate PCB area for the 29x29 mm FCBGA - it requires high-density HDI routing with microvia stackups. Use the Quartus Prime design suite with SoC EDS for HPS software development, and plan for the 0.9 V core decoupling network plus DDR memory interface fly-by routing as documented in Intel's Arria 10 device datasheet.
This page synthesizes distributor pricing, drop-in alternatives across speed grade and logic density variants, and PCB/thermal design notes that go beyond the manufacturer datasheet ordering information.
드롭인 대체품: 10AS032E4F29E3SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS032E4F29E3SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, Mounting Type, RoHS Status, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS032E4F29E3LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2295 / 개
데이터시트 보기 →10AS032E4F29I3SG
✅ 드롭인✓ 재고 있음
$2250 / 개
데이터시트 보기 →10AS032E4F29E2SG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AS032E3F29E3SG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AX032E4F29E3SG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AS032E4F29I3LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1920 / 개
데이터시트 보기 →10AS032E4F29E4SG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AS032E4F29E3SG 최대 정격 & 전기적 특성
| Family | Arria 10 SX |
| Logic Elements | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Process Technology | TSMC 20 nm |
| Core Voltage | 0.9 V |
| 패키지 | 780-FBGA, FC (29x29 mm) |
| 실장 유형 | Surface Mount |
| Operating Temperature Grade | Extended (E3 suffix) |
| Speed Grade | 4 |
| Embedded Memory | 28.05 Mbits (per Arria 10 family datasheet) |
| DSP Blocks | 384 (per Arria 10 family datasheet) |
| Transceivers | Up to 17.4 Gbps |
| PCI Express Hard IP | Gen3 x8 |
| RoHS 상태 | Compliant |
10AS032E4F29E3SG 핀 구성
| 핀 A1 | GND — Ground reference for high-speed transceivers and core logic |
| 핀 A18 | VCC — Core logic supply (0.9 V) |
| 핀 B12 | HPS_DDR_DQ0 — HPS DDR controller data bit 0 |
| 핀 C5 | REFCLK_p — Differential reference clock input (positive) |
| 핀 C6 | REFCLK_n — Differential reference clock input (negative) |
| 핀 AB28 | GXB_TX_p — High-speed transceiver transmit (positive) |
| 핀 AC29 | GXB_TX_n — High-speed transceiver transmit (negative) |
| 핀 AD25 | GXB_RX_p — High-speed transceiver receive (positive) |
| 핀 AE26 | GXB_RX_n — High-speed transceiver receive (negative) |
| 핀 AJ30 | JTAG_TCK — JTAG test clock |
| 핀 AK29 | JTAG_TMS — JTAG test mode select |
| 핀 AH18 | CONF_DONE — Configuration complete status output |
| 핀 AG19 | nCONFIG — Configuration active-low control |
일반적인 애플리케이션
10AS032E4F29E3SG 적합 용도: 6 애플리케이션s: 5G Baseband Signal Processing, Motor Control and Industrial Drive, Machine Vision and Video Broadcast, Automotive ADAS Prototyping, Medical Imaging Pre-Processing, Defense Radar and Electronic Warfare Prototyping.
5G Baseband Signal Processing
The 10AS032E4F29E3SG is well-suited to 5G small-cell and remote radio head (RRH) baseband DSP because its 320K logic elements and 384 variable-precision DSP blocks deliver the throughput required for downlink/uplink FFT, channel coding, and crest-factor reduction. The 17.4 Gbps transceivers natively carry CPRI/eCPRI fronthaul links to radio units, eliminating an external PHY. The dual ARM Cortex-A9 HPS at 1.5 GHz runs the MAC scheduler and L2/L3 stack under embedded Linux, while the FPGA fabric executes the latency-critical PHY DSP. In a typical sub-6 GHz small-cell, designers pair this SoC with one 4GB DDR4 device on the HPS side and a separate DDR4 bank for the FPGA fabric, achieving deterministic eCPRI round-trips on the order of hundreds of microseconds.
추천
Motor Control and Industrial Drive
For high-performance industrial servo and drive inverters, the 10AS032E4F29E3SG combines FPGA-grade deterministic loop control with the ARM Cortex-A9 HPS running real-time OS control logic. The 17.4 Gbps transceivers link to multi-axis encoder feedback (EnDat 2.2, BiSS, HIPERFACE DSL) over a single SERDES channel, while the FPGA fabric executes field-oriented control (FOC) loops at sub-microsecond update rates. The 0.9 V core supply and industrial temperature option support harsh factory-floor environments. Designers typically add opto-isolated gate drivers and current-sense ADCs around the device, with the ARM cores handling EtherCAT/EtherCAT P communication stacks.
추천
Machine Vision and Video Broadcast
The 10AS032E4F29E3SG serves as an accelerator for multi-channel HD/4K video pipelines in machine vision, broadcast encoding, and medical imaging pre-processing. Its 320K logic elements plus 384 DSP blocks handle 4K@60 H.264/H.265 encode at reduced frequency, while the HPS runs the application layer, network stack, and analytics. PCIe Gen3 x8 hard IP links the SoC to a host CPU for offload workloads, and the 17.4 Gbps transceivers carry SDI/CoaXPress camera data directly into the FPGA fabric. A typical 4-channel 1080p60 machine vision camera aggregator uses roughly 60-70% of the logic and 80% of the DSP, leaving headroom for analytics overlays.
추천
Automotive ADAS Prototyping
While the 10AS032E4F29E3SG is not AEC-Q100 qualified, the same Arria 10 SX die is available in automotive-grade speed grades used for advanced driver-assistance systems (ADAS) prototyping. The 320K logic elements with 384 DSP blocks accelerate sensor fusion of radar, lidar, and camera streams at 30-60 FPS, while the dual ARM Cortex-A9 HPS runs the perception middleware and CAN/Ethernet vehicle network stack. The 17.4 Gbps transceivers interface to automotive SerDes links (FPD-Link III, GMSL2) for raw sensor data ingestion. For production, designers migrate the validated RTL/Golden Hardware Reference Design to an AEC-Q100 qualified Arria 10 Auto variant.
추천
Medical Imaging Pre-Processing
The 10AS032E4F29E3SG is used in ultrasound front-end and CT/MRI pre-processing where deterministic low-latency DSP is required. The FPGA fabric executes beamforming, FIR filtering, and envelope detection pipelines on raw ADC data at 100+ MHz, while the ARM Cortex-A9 HPS runs the scan-conversion, image-rendering, and DICOM stack on Linux. The 28 Mbits of embedded memory and 384 DSP blocks sustain the parallel sample rates, and the hard PCIe Gen3 x8 IP pushes processed frames to a host GPU for AI inference. The industrial temperature grade supports the equipment-room thermal environment.
추천
Defense Radar and Electronic Warfare Prototyping
Defense radar and electronic-countermeasure prototypes leverage the 10AS032E4F29E3SG's combination of high-density FPGA fabric with a hardened ARM processor subsystem for system control. The 17.4 Gbps transceivers aggregate multi-channel ADC data from wideband RF front-ends, while the DSP blocks implement pulse compression, MTI filtering, and digital beamforming. The ARM HPS runs the radar control software, timing generator, and tracking algorithms. Extended temperature and the rugged 780-FBGA F29 package support mobile and shipboard platforms where mechanical stress is significant.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS032E4F29E3SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS032E4F29E3LG | 10AS032E4F29I3SG | 10AS032E4F29E2SG | 10AS032E3F29E3SG | 10AX032E4F29E3SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA F29 (29x29 mm) | 780-FBGA F29 (29x29 mm) - same | 780-FBGA F29 (29x29 mm) - same | 780-FBGA F29 (29x29 mm) - same | 780-FBGA F29 (29x29 mm) - same | 780-FBGA F29 (29x29 mm) - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 (1.5 GHz) | Dual ARM Cortex-A9 (1.5 GHz) | Dual ARM Cortex-A9 (1.5 GHz) | Dual ARM Cortex-A9 (1.5 GHz) | Dual ARM Cortex-A9 (1.5 GHz) | None (FPGA-only Arria 10 GX) |
| Speed Grade | 4 (-4 fastest) | 3 | 4 | 2 | 3 | 4 |
| Temperature Grade | Extended (E3) | Extended | Industrial (-40C to 100C) | Extended | Extended | Extended |
| Transceiver Data Rate | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 17.4 Gbps | Up to 17.4 Gbps |
주요 차별점
- Highest commercial speed grade at the 320K LE / F29 package point (vs 10AS032E3F29E3SG)
- Integrated ARM Cortex-A9 HPS subsystem eliminates external CPU (vs 10AX032E4F29E3SG)
- 780-FBGA F29 shared footprint across Arria 10 SX/GX density points (vs 10AS022E3F29I1HG)
설계 노트
The 780-FBGA F29 package requires HDI PCB technology with laser-drilled microvias and stackup design that places high-speed transceiver routes on the top layers with reference planes for impedance control. Plan 1 oz copper inner planes for the 0.9 V core power distribution and use via-in-pad (VIPPO) construction on all BGA balls to avoid signal-via stubs in transceiver paths. Estimated: at 1.5 GHz HPS clock and 17.4 Gbps SERDES, signal-integrity simulations should be run for all critical routes with the PCB vendor's stackup model before committing to layout.
Estimated: total device power for the 10AS032E4F29E3SG under typical loading is in the 15-25 W range, with HPS and FPGA fabric each contributing roughly half. The FCBGA F29 has theta_JA around 4-6 C/W with the recommended thermal management approach of a copper heat-spreader bonded to the package top, plus forced-air cooling for full-rate operation. Designers must provide a thermal solution that keeps the junction below the 100 C operating limit, especially for industrial -40 C to +100 C variants.
The 10AS032E4F29E3SG requires multiple independent supply rails (0.9 V core, 1.1 V HPS, transceiver analog/digital supplies, DDR PHY supply) sequenced per Intel's Arria 10 power-up requirements. Use a dedicated power management IC such as the Intel-recommended controller family with Power Management Bus (PMBus) telemetry to monitor voltage, current, and temperature. Place bulk decoupling within the BGA escape region and add high-frequency 100 nF/10 nF/1 nF capacitors across the inner balls to suppress transient demand from the FPGA fabric and HPS cores.
A common design pitfall is mis-identifying the 'E3' suffix as an industrial temperature grade. In the Arria 10 SX ordering code, 'E3' designates extended commercial temperature and the device is rated for 0 C to +100 C junction. For designs that must operate at -40 C ambient, the 'I3' or 'I4' industrial variants (e.g., 10AS032E4F29I3SG) must be specified. Selecting the wrong grade during PCN is one of the most frequent causes of field failures in cold-storage and outdoor installations.
규정 준수 정보
RoHS compliant per Intel/Altera product ordering information page. The 780-FBGA F29 package is lead-free with lead-free solder balls. Not AEC-Q100 qualified - for AEC-Q100 automotive designs, use the Arria 10 Auto variant family. Halogen-free status not explicitly stated in the verified web data.