10AS048E2F29I1HG - Arria 10 SX SoC FPGA, 480K LE, Dual ARM Cortex-A9 | Intel
부품 번호: 10AS048E2F29I1HG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2475 | $247,500.00 |
| 500 | $2290 | $1,145,000.00 |
| 1,000 | $2120 | $2,120,000.00 |
10AS048E2F29I1HG 개요
A SoC FPGA is a system-on-chip that combines a general-purpose processor (typically ARM Cortex-A) with programmable FPGA fabric on a single die. The Arria 10 SX sits in the hierarchy: SoC -> SoC FPGA -> Arria 10 family -> SX (processor + FPGA) variant. This integration eliminates the latency and bandwidth bottleneck of processor-to-FPGA chip-to-chip links, making the architecture well-suited for compute-intensive pipelines where the FPGA accelerates custom algorithms while the ARM cores handle control-plane tasks, OS scheduling, and networking stacks.
Key features include 480K logic elements, 28.6 Mbits of embedded memory, integrated HPS with dual ARM Cortex-A9 cores, hardware floating-point unit, CoreSight debug, and a coherent fabric interconnect. The 20nm process technology gives the device a power-efficient profile relative to previous-generation 28nm Arria V/VII SoC FPGAs, while the 29x29 FC-FBGA package supports high-speed transceiver channels and multiple I/O banks. Per the manufacturer datasheet, the part operates across industrial temperature grades.
Typical applications include wireless baseband processing, radar and electronic warfare subsystems, broadcast and professional video processing, industrial machine vision, and test & measurement equipment. The HPS provides deterministic Ethernet, USB, and DDR controller capability for OS-driven workloads while the FPGA fabric handles real-time DSP and packet processing.
When designing with this device, plan PCB power delivery carefully: the 0.9V core rail requires low-noise regulator topology, and decoupling must follow the manufacturer pin-out guide for the FC-FBGA-780. JTAG and configuration pin selection (MSEL) must match the desired configuration scheme (AS, PS, JTAG, FPP) at board bring-up. This page synthesizes distributor pricing, same-package alternatives, and design guidance not consolidated on the manufacturer datasheet.
드롭인 대체품: 10AS048E2F29I1HG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS048E2F29I1HG (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Logic Elements, Mounting Type, Package Code.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS048E2F29E2SG
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →10AS048E2F29E2LG
✅ 드롭인✓ 재고 있음
$1995 / 개
데이터시트 보기 →10AS048E2F29E1HG
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →10AS048E1F29I1HG
✅ 드롭인✓ 재고 있음
$1920 / 개
데이터시트 보기 →10AS048E2F29I1HG 최대 정격 & 전기적 특성
| Family | Arria 10 SX |
| Device Variant | 10AS048 |
| Logic Elements | 480000 |
| Maximum Core Frequency | 1.5 GHz |
| Processor Cores | Dual ARM Cortex-A9 MPCore |
| HPS Debug | CoreSight |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| 패키지 | 780-FBGA, FC (29x29 mm) |
| Package Type | Flip Chip Fine-Pitch BGA |
| 실장 유형 | Surface Mount |
| Operating Temperature Grade | Industrial |
| RoHS 상태 | Compliant |
| Configuration | FPGA + Hard Processor System (SoC) |
10AS048E2F29I1HG flip chip fine-pitch bga 핀 구성 가이드
10AS048E2F29I1HG(flip chip fine-pitch bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS048E2F29I1HG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS048E2F29I1HG 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Radar and Electronic Warfare, Broadcast and Professional Video, Industrial Machine Vision, Test and Measurement Instrumentation, Medical Imaging Systems.
Wireless Baseband Processing
The 10AS048E2F29I1HG's 480K logic elements and dual ARM Cortex-A9 HPS make it ideal for 4G/5G baseband signal processing where the FPGA fabric accelerates FFT, channel estimation, and crest-factor reduction while the HPS runs the MAC scheduler and real-time OS. At 1.5 GHz HPS clock and the high-bandwidth FPGA-to-HPS coherent bridge, latency between custom DSP and control plane is minimized to sub-microsecond levels. 28.6 Mbits of embedded memory holds multi-symbol buffers for LTE/NR numerologies, reducing external DDR pressure. Compared with discrete FPGA+CPU boards, the SoC integration cuts board area roughly 40% and lowers BOM cost in remote-radio-head and small-cell designs where thermals and footprint dominate.
추천
Radar and Electronic Warfare
Defense radar and EW subsystems rely on the 10AS048E2F29I1HG for real-time pulse compression, beamforming, and adaptive-threat detection. The 480K LE fabric implements thousands of FIR filters and FFT butterflies at full rate, while the Cortex-A9 HPS hosts the tracker, classifier, and Ethernet-based control links. Industrial temperature grade (-40C to +100C) supports ground-mobile and naval platforms. The 28.6 Mbits embedded memory absorbs radar-pulse returns at gigasample-per-second rates, and the HPS DDR controller sustains high-bandwidth data egress to system recorders. Pin-compatible Arria 10 SX variants at higher LE counts (10AS066, 10AS115) scale up channel counts without PCB redesign.
추천
Broadcast and Professional Video
The 10AS048E2F29I1HG supports 4K/UHD video pipelines at 60 fps where the FPGA fabric performs real-time deinterlacing, scaling, color-space conversion, and HDR tone mapping, while the ARM Cortex-A9 HPS runs Linux with FFmpeg or vendor SDKs for file-based transcoding. 12G-SDI and DisplayPort interfaces use the FPGA's high-speed transceivers, and the integrated HPS removes the need for an external media processor - reducing latency for live broadcast. Industrial temp grade suits studio-to-outside-broadcast deployments. Compared to ASIC + MCU architectures, the SoC FPGA enables single-chip encoder/decoder pipelines that reprogram per codec standard.
추천
Industrial Machine Vision
Factory-floor machine-vision systems use the 10AS048E2F29I1HG to accelerate image preprocessing, feature extraction, and CNN inference in the FPGA fabric while the Cortex-A9 HPS runs GigE Vision / USB3 Vision stack and PLC communication (EtherCAT, PROFINET). The 480K LE fabric supports parallel pipelines for multi-camera inspection at >1 Gbps per channel, and 28.6 Mbits embedded memory holds intermediate frame buffers. Industrial temperature grade tolerates factory enclosures. Compared with GPU + CPU boards, the Arria 10 SX SoC delivers deterministic low-latency inference at lower power (~25 W envelope), critical for high-speed defect-detection lines.
추천
Test and Measurement Instrumentation
High-end oscilloscopes, signal analyzers, and protocol testers leverage the 10AS048E2F29I1HG to implement multi-gigasample-per-second acquisition paths with real-time triggering, FFT spectrum analysis, and protocol decoding in the FPGA fabric. The HPS runs Linux for touchscreen UI, USB/LAN connectivity, and SCPI command processing. With 28.6 Mbits embedded memory and 1.5 GHz HPS clock, designers can implement deep acquisition memories plus responsive UI without separate DSP and MPU chips. Industrial temp grade supports lab-to-field portable instruments. Pin-compatible higher-density variants (10AS066, 10AS115) scale channel count for higher-end platforms.
추천
Medical Imaging Systems
Ultrasound, CT, and endoscopy platforms use the 10AS048E2F29I1HG for beamforming, image reconstruction, and real-time filtering in the FPGA fabric while the Cortex-A9 HPS runs the patient-interface software, DICOM stack, and touchscreen UI. The integrated SoC reduces board space in cart-based and portable units where size, weight, and power matter. Industrial temperature grade supports clinical environments. 28.6 Mbits embedded memory accommodates channel-processing buffers for 64-256 element ultrasound probes, and the HPS DDR4 controller sustains image-stream throughput to display pipelines. Pin-compatible Arria 10 SX variants scale probe channel counts without PCB rework.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS048E2F29I1HG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS048E2F29E2SG | 10AS048E2F29E2LG | 10AS048E2F29E1HG | 10AS048E1F29I1HG |
|---|---|---|---|---|---|
| Package | 780-FBGA, FC (29x29 mm) | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same | 780-FBGA, FC (29x29 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 480000 | 480000 | 480000 | 480000 | 480000 |
| Speed Grade | E2 (faster) | E2 (same) | E2 (same) | E1 (standard) | E1 (standard) |
| Processor Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Maximum HPS Clock | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Embedded Memory | 28.6 Mbits | 28.6 Mbits | 28.6 Mbits | 28.6 Mbits | 28.6 Mbits |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
주요 차별점
- E2 speed grade supports higher fMAX for fabric and HPS (vs 10AS048E2F29E1HG)
- Industrial temperature grade across the operating range (vs 10AS048E2F29E2SG)
- Same-package LE density as pin-compatible variants (vs 10AS066 (different LE count))
설계 노트
The 10AS048E2F29I1HG requires multiple low-voltage rails: 0.9V core, 1.1V/1.35V transceiver, and 1.8V/3.3V I/O. Use a sequenced power architecture with a controller that ramps rails in dependency order (3.3V -> 1.8V -> 1.1V -> 0.9V) and keeps monotonicity within the manufacturer's datasheet specification. Estimated: at full fabric utilization with 50% toggle rate, the 0.9V core can draw 5-10 A; pair it with low-impedance PCB power planes and abundant ceramic decoupling (10 uF + 0.1 uF + 1 uF per rail) within 5 mm of BGA balls.
The 780-FBGA F29 package demands an FC-BGA PCB footprint with microvia stack-ups (typically 8-12 layers, 0.4 mm pitch escape). Use a 1-2-1 or 1-2-1-2 HDI stack-up and follow the manufacturer's recommended land pattern and via-in-pad rules. Length-match high-speed transceiver pairs to within the data sheet tolerance, and keep impedance-controlled differential pairs referenced to a solid ground plane. Thermal vias under the exposed die region reduce theta_JA.
Do not confuse OPN suffixes: the trailing characters encode speed grade (E1/E2), package (F29), operating temperature (I=industrial), and screening (-HG, -SG, -LG). Designers ordering -HG when -SG is required, or E1 when E2 is required, may receive parts with insufficient fMAX margin or wrong qualification. Cross-check every OPN against the Arria 10 ordering guide before placement in BOM tools. The E2 speed grade offers ~10-15% higher fMAX than E1 and is required for 1.5 GHz HPS operation at aggressive timing margins.
규정 준수 정보
RoHS compliant per Intel product page. Industrial temperature grade -40C to +100C. AEC-Q100 not applicable for FPGAs; industrial-grade OPNs (I-suffixed) are suitable for automotive non-safety applications but not AEC-Q100-qualified. Verify halogen-free status against the manufacturer declaration if required.