10AS048E2F29I2LG - Arria 10 SX SoC FPGA, 480K LE, Dual A9 | Intel
부품 번호: 10AS048E2F29I2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2720 | $27,200.00 |
| 100 | $2580 | $258,000.00 |
| 500 | $2440 | $1,220,000.00 |
| 1,000 | $2295 | $2,295,000.00 |
10AS048E2F29I2LG 개요
A System-on-Chip (SoC) FPGA is a heterogeneous compute device that combines a general-purpose ARM Cortex processor subsystem (HPS) with a programmable FPGA fabric on a single silicon die, communicating through a high-bandwidth coherent bus. In the broader device taxonomy, the 10AS048E2F29I2LG sits within: SoC FPGA -> FPGA -> programmable logic -> semiconductor IC. This integration reduces BOM count, board area, and latency between processor and fabric compared with using a discrete FPGA + external MPU.
Key features of the 10AS048E2F29I2LG include up to 480K logic elements, embedded DSP blocks for fixed- and floating-point signal processing, integrated transceivers up to 12.5 Gbps, a 32-bit DDR3/DDR4 hard memory controller in the HPS, and CoreSight debug for multi-core trace. The 'E2' speed grade balances -2 speed performance against dynamic power, while the 'I' industrial temperature rating suits outdoor, factory-floor, and aerospace embedded deployments.
The 20 nm TSMC process enables a high logic density to power ratio, with hardened peripherals (PCIe Gen2/Gen3, EMAC, USB 2.0 OTG) and partial reconfiguration support, allowing the fabric to be reprogrammed on-the-fly while the HPS continues to execute. Typical applications include wireless baseband processing, radar and SIGINT front ends, industrial machine vision, and avionics LRUs.
When designing with the 10AS048E2F29I2LG, plan the HPS-to-Fabric AXI bridge bandwidth, place decoupling for the 0.9 V core supply within 100 mils of the BGA balls, and use the Quartus Prime SoC Edition toolchain. RoHS and REACH compliance must be verified against the device-specific material declaration.
This page synthesizes distributor inventory, pin-compatible drop-in variants in the Arria 10 family, and practical PCB/thermal design notes not collected in the manufacturer datasheet.
드롭인 대체품: 10AS048E2F29I2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS048E2F29I2LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Product Type, Logic Elements, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS048E2F29I1HG
✅ 드롭인✓ 재고 있음
$2120 / 개
데이터시트 보기 →10AS048E2F29E2LG
✅ 드롭인✓ 재고 있음
$1995 / 개
데이터시트 보기 →10AS048E2F29E2SG
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →10AS048E2F29E1HG
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →10AS048E1F29I1HG
✅ 드롭인✓ 재고 있음
$1920 / 개
데이터시트 보기 →10AS048E2F29I2LG 최대 정격 & 전기적 특성
| Product Type | SoC FPGA (System-on-Chip with ARM Cortex-A9 HPS) |
| Family | Arria 10 SX |
| Device Designator | 10AS048 |
| Logic Elements | 480,000 |
| HPS Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Supply Voltage | 0.9 V |
| 동작 온도 | -40C to +100C (Industrial) |
| 패키지 | 780-pin FC-FBGA, 29 x 29 mm |
| Speed Grade | -2 |
| RoHS 상태 | Compliant (per manufacturer ordering page) |
| 실장 유형 | Surface Mount (BGA) |
| Maximum Fabric Frequency | 1.5 GHz (core fabric performance per distributor description) |
| Hard Memory Controller | DDR3/DDR4 (HPS) |
10AS048E2F29I2LG 780-pin fc-fbga, 29 x 29 mm 핀 구성 가이드
10AS048E2F29I2LG(780-pin fc-fbga, 29 x 29 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS048E2F29I2LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS048E2F29I2LG 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Radar and SIGINT Front-End Processing, Industrial Machine Vision, Avionics and Defense LRUs, Medical Imaging Equipment, High-Performance Embedded Computing.
Wireless Baseband Processing
The 10AS048E2F29I2LG is well suited to wireless baseband processing where a programmable RF data path and a Linux-capable host processor are co-located. Its 480K logic elements and hardened DSP blocks deliver the gate density required for LTE/5G NR PHY channel coding, FFT/iFFT, and digital pre-distortion loops, while the dual-core ARM Cortex-A9 HPS runs the MAC scheduler and OAM stack over DDR3/DDR4. The industrial -40C to +100C temperature range lets the same part serve outdoor small-cell enclosures, and the 0.9 V core rail keeps dynamic power within the budget of a fanless chassis.
추천
Radar and SIGINT Front-End Processing
The 10AS048E2F29I2LG is widely deployed in defense and SIGINT signal pipelines where wideband ADC data must be decimated, pulse-compressed, and Doppler-processed in real time. The Arria 10 SX 480K-LE fabric delivers the FFT and vector-matrix throughput required by phased-array radar, while the HPS runs Linux + RFNoC-style drivers to push detection events upstream. Industrial temperature screening and a 20 nm low-power process keep thermal envelopes manageable for ruggedized enclosures.
추천
Industrial Machine Vision
The 10AS048E2F29I2LG suits high-frame-rate industrial machine vision systems where MIPI or GigE Vision cameras must be aggregated, undistorted, and inspected with CNN-style classifiers in real time. The dual ARM Cortex-A9 HPS handles Ethernet protocols and HMI/PLC integration, while the FPGA fabric accelerates Bayer demosaicing, lens correction, and ROI cropping. The 780-pin FC-FBGA footprint supports the high I/O count needed for multi-camera aggregation.
추천
Avionics and Defense LRUs
The 10AS048E2F29I2LG is used in avionics Line Replaceable Units (LRUs) where DO-254 design assurance and MIL-STD-810 environmental screening are required. The industrial -40C to +100C temperature range supports non-pressurized sections, the Arria 10 SX fabric provides SEU-mitigation through partial reconfiguration and scrubbing, and the HPS runs ARINC 653 / VxWorks or a DAL-B Linux profile. The 780-pin FC-FBGA package integrates cleanly into conduction-cooled chassis.
추천
Medical Imaging Equipment
The 10AS048E2F29I2LG is well matched to ultrasound, endoscopy, and MRI gradient-control systems where deterministic real-time DSP and a managed Linux application plane coexist. The FPGA fabric delivers beamforming and front-end filtering for ultrasound channels, while the dual-core ARM HPS handles the user interface, DICOM, and PACS integration. The industrial temperature screening supports portable cart-side equipment.
추천
High-Performance Embedded Computing
The 10AS048E2F29I2LG serves as the core of HPEC nodes where one FPGA must accelerate a single workload (compression, crypto, AI inference) while the HPS orchestrates data ingest and dispatch. The 480K-LE fabric holds multi-lane PCIe Gen2/Gen3 hard IP, and the dual-core ARM Cortex-A9 cluster runs Linux user-plane stacks. Industrial temperature and the F29 FC-FBGA footprint make it drop-in compatible with many existing Arria 10 SX carrier designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS048E2F29I2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS048E2F29I1HG | 10AS048E2F29E2LG | 10AS048E2F29E2SG | 10AS048E2F29E1HG | 10AS048E1F29I1HG |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-pin FC-FBGA (F29, 29x29 mm) | 780-pin FC-FBGA (F29, 29x29 mm) - same | 780-pin FC-FBGA (F29, 29x29 mm) - same | 780-pin FC-FBGA (F29, 29x29 mm) - same | 780-pin FC-FBGA (F29, 29x29 mm) - same | 780-pin FC-FBGA (F29, 29x29 mm) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Speed Grade | -2 | -1 | -2 | -2 | -1 | -1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| HPS Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Parametric Match to This Part | 100% (baseline) | 90% | 90% | 90% | 80% | 80% |
주요 차별점
- Highest speed grade available in the 10AS048 F29 family (vs 10AS048E2F29I1HG (E1))
- Industrial -40C to +100C temperature screening (vs 10AS048E2F29E2LG (E temperature))
- Full HPS + 480K-LE SoC FPGA integration (vs 10AS048E2F29I1HG)
설계 노트
The Arria 10 SX core rail is 0.9 V nominal and can transient-load into the 20-40 A range when the FPGA fabric toggles high-utilization DSP blocks. Use a multi-phase buck regulator (e.g. TPS53681 or LTC3877) with at least 4 phases and place 4-6 x 22 uF polymer bulk capacitors plus 0.1 uF / 1 nF high-frequency ceramics within 100 mils of the BGA core power balls. Ensure the regulator's per-phase inductor saturates above the worst-case peak current; the 0.9 V rail droop during GHRD burst writes must stay inside +/- 3% for HPS reset to remain asserted.
The 780-pin FC-FBGA exposes the die through internal thermal vias. For industrial-temperature deployments, attach a heat spreader or low-profile heat sink with thermal interface material of <= 0.2 C/W. At -2 speed grade and >85% LUT utilization, design-time junction-to-ambient thermal resistance should target <= 1.5 C/W to keep Tj under 100C at 100C ambient. Derate by 10% margin for altitude derating above 15,000 ft in avionics enclosures.
Use a 1.0 mm pitch BGA PCB land pattern with via-in-pad filled and capped per IPC-7093. Match all differential pairs (transceiver lanes, HPS DDR3/DDR4) to a 100 ohm +/-10% differential impedance with intra-pair skew < 1.5 ps. Length-match the HPS DDR4 byte lanes to within 5 mils and the transceiver TX/RX pairs to within 0.05 mm to avoid bit-error-rate degradation above 10 Gbps.
Do not populate HPS boot mode strapping resistors inconsistently - the HPS boots from QSPI, NAND, SD, or eMMC based on boot pin sampling at cold-boot. If the QSPI flash is left disconnected, the HPS may stall and appear 'dead' even though the FPGA fabric loads correctly. Also confirm the FPGA configuration source matches the Quartus Programming File Generator output (.sof + .jic for ASx4 configuration). Mixed pull-ups/pull-downs on CFG pins cause intermittent configuration failure.
규정 준수 정보
RoHS compliance and lead-free finish confirmed per the Intel/Altera ordering page for 10AS048E2F29I2LG. REACH, halogen-free, and conflict-minerals status require the device-specific Material Declaration (MDDS) from Intel; not present in the verified web data.
