10AS048K1F35E1HG - Arria 10 SX SoC FPGA 480K LE | Intel FPGA
부품 번호: 10AS048K1F35E1HG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4600 | $46,000.00 |
| 100 | $4350 | $435,000.00 |
| 500 | $4100 | $2,050,000.00 |
| 1,000 | $3850 | $3,850,000.00 |
10AS048K1F35E1HG 개요
What is an SoC FPGA? An SoC FPGA (System-on-Chip Field Programmable Gate Array) is a class of programmable logic device that combines a hard microprocessor subsystem with the traditional FPGA programmable fabric on a single die. Within the broader taxonomy, an SoC FPGA is a type of FPGA -> programmable logic -> semiconductor -> integrated circuit. The hard CPU subsystem (HPS) brings deterministic performance and software ecosystem benefits, while the FPGA fabric delivers parallel hardware acceleration and flexible I/O. This combination makes SoC FPGAs ideal for designs that need both firmware-driven control and high-speed custom datapaths.
Key differentiating specifications of the 10AS048K1F35E1HG include the dual Cortex-A9 MPCore up to 1.5 GHz, the 480K logic element Arria 10 fabric, integrated transceivers supporting multi-gigabit serial links, hard memory controllers with DDR4/DDR3 support, and on-chip HPS peripherals including Ethernet, USB, SD/SDIO/MMC, SPI, I2C, and UART. The device is built on a 20 nm process, balancing performance-per-watt against the larger Cyclone V and smaller Cyclone 10 families. This combination supports embedded compute tasks (Linux/RTOS on Cortex-A9) alongside FPGA acceleration blocks.
Architecturally, the device pairs an HPS that runs Linux, VxWorks, or RTOS with an FPGA fabric whose Adaptive Logic Modules (ALMs), DSP blocks, and M20K memory blocks can implement custom accelerators. The 1.5 GHz core clock is set by the HPS PLL chain, while fabric performance is characterized in isolation from CPU speed. Hard IP blocks for PCIe Gen3, 10/40 GbE, DDR4 controllers, and partial reconfiguration reduce soft-logic utilization and accelerate time-to-prototype.
Typical applications include industrial machine vision and inspection systems, 5G wireless baseband and RF front-end digital processing, military/aerospace software-defined radio (SDR), medical imaging pre-processing, broadcast video processing, and high-performance embedded computing (HPEC). The HPS supports running an OS for control plane while the fabric accelerates latency-critical DSP and packet-processing tasks. Design consideration: ensure that the board thermal design can handle the FC-BGA's power envelope and that Quartus Prime projects correctly assign pin-out for the 1152-ball flip-chip package, which requires careful signal integrity planning for high-speed transceivers and DDR interfaces.
드롭인 대체품: 10AS048K1F35E1HG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS048K1F35E1HG (동일 폼 팩터 및 풋프린트) — 차이점: Package, DSP Blocks, Operating Temperature, Transceivers, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS048K1F35I1HG
✅ 드롭인✓ 재고 있음
$3263.87 / 개
데이터시트 보기 →10AS048K1F35E2SG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AS048K1F35E3LG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AS048H2F34E1HG
✅ 드롭인✓ 재고 있음
$3650 / 개
데이터시트 보기 →10AS048H1F34E1HG
✅ 드롭인✓ 재고 있음
$3048.91 / 개
데이터시트 보기 →10AS048K1F35E1HG 최대 정격 & 전기적 특성
| Product Series | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Speed | Up to 1.5 GHz |
| Process Technology | 20 nm |
| 패키지 | 1152-ball FC-BGA (flip-chip), 35x35 mm |
| 실장 유형 | Surface Mount |
| 동작 온도 | Industrial / commercial per part number suffix |
| Memory Interfaces | DDR4, DDR3, LPDDR3, QDR IV (hard controllers) |
| Transceivers | Multi-gigabit serial transceivers, up to 17.4 Gbps (family) |
| DSP Blocks | Variable-precision DSP blocks (per family) |
| On-chip RAM | M20K memory blocks + MLAB (per family) |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, SD/SDIO/MMC, SPI, I2C, UART, CAN |
| Hard IP Blocks | PCIe Gen3 (hard), 10/40 GbE MAC, DDR controllers, partial reconfiguration |
| Configuration | FPGA fabric + HPS independent configuration, supports AS/PS/JTAG |
| RoHS 상태 | Compliant |
| Design Software | Intel Quartus Prime (legacy: Altera Quartus II) |
10AS048K1F35E1HG 1152-ball fc-bga (flip-chip), 35x35 mm 핀 구성 가이드
10AS048K1F35E1HG(1152-ball fc-bga (flip-chip), 35x35 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS048K1F35E1HG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS048K1F35E1HG 적합 용도: 6 애플리케이션s: 5G Wireless Baseband DSP, Software-Defined Radio (SDR), Industrial Machine Vision Inspection, Medical Imaging Pre-Processing, Broadcast Video Processing, High-Performance Embedded Computing (HPEC).
5G Wireless Baseband DSP
The 10AS048K1F35E1HG's 480K logic elements, variable-precision DSP blocks (FMA support), and multi-gigabit transceivers up to 17.4 Gbps make it well-suited to 5G NR baseband digital signal processing. Its dual ARM Cortex-A9 HPS at 1.5 GHz runs the L2/L3 control stack and MAC scheduling, while the FPGA fabric implements LDPC/Polar FEC decoders, FFT/IFFT pipelines, and digital predistortion. Hard PCIe Gen3 and 40GbE MAC blocks connect the device to host processors and fronthaul networks without burning fabric logic, which lowers latency in low-latency baseband pipelines.
추천
Software-Defined Radio (SDR)
The 10AS048K1F35E1HG is a strong fit for military and commercial SDR platforms. Its HPS handles waveform control, network stack, and Linux management, while the FPGA fabric executes DDC/DUC, channelizers, and wideband FFT engines for tactical radios and electronic warfare. Transceivers operating at multi-gigabit data rates enable direct digitization of intermediate-frequency signals. The 1.5 GHz Cortex-A9 cluster offers responsive boot times for secure boot flows, and the FC-BGA package supports the dense mixed-signal routing that SDR front-ends require.
추천
Industrial Machine Vision Inspection
Industrial inspection systems require deterministic, high-throughput pixel processing. The 10AS048K1F35E1HG delivers this via 480K logic elements for line-scan/bayer conversions, defect detection CNN accelerators, and camera-link/CoaXPress aggregation through multi-gigabit transceivers. The HPS runs Linux for recipe management, MQTT/SCADA messaging, and HMI display rendering. Hard DDR4 controllers provide high-bandwidth frame buffer access for 4K/8K inspection streams, while the industrial temperature range (via the I-suffix variants) supports factory-floor deployments.
추천
Medical Imaging Pre-Processing
The 10AS048K1F35E1HG accelerates medical imaging pipelines such as CT, MRI, and ultrasound beamforming. Its HPS runs the patient-management UI and DICOM stack while the FPGA fabric executes filter-backprojection, image reconstruction, and real-time signal conditioning. Variable-precision DSP blocks support numerical algorithms tuned to medical precision requirements, and hard PCIe Gen3 enables host x86/x64 coprocessor links. The 1152-ball FC-BGA package supports dense mixed-signal routing, and RoHS compliance simplifies regulatory certification for medical device manufacturers.
추천
Broadcast Video Processing
Broadcast studios need low-latency, real-time video processing at UHD/4K frame rates. The 10AS048K1F35E1HG handles multi-stream SDI/HDMI aggregation, HDR/SDR conversion, and HEVC codec acceleration on the FPGA fabric, while the dual ARM Cortex-A9 HPS manages playout control and ancillary data. Multi-gigabit transceivers connect to SDI/HDMI IP cores at high bit rates, and hard DDR4 controllers supply the frame buffer bandwidth that real-time broadcast workflows demand. Source: typical Arria 10 SX SoC video design patterns from Intel reference materials.
추천
High-Performance Embedded Computing (HPEC)
The 10AS048K1F35E1HG powers defense and aerospace HPEC platforms that combine OS-managed control with FPGA-accelerated signal processing. The 1.5 GHz Cortex-A9 cluster runs VxWorks or Linux for system management, while the 480K-LE fabric executes parallel DSP pipelines such as radar pulse compression, SAR processing, and adaptive beamforming. Hard 40GbE MACs and PCIe Gen3 enable low-latency backplane links to VPX/OpenVPX chassis. FC-BGA packaging supports the thermal envelope of sealed VPX conduction-cooled cards used in military vehicles.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS048K1F35E1HG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS048K1F35I1HG | 10AS048K1F35E2SG | 10AS048K1F35E3LG | 10AS048H2F34E1HG | 10AS048H1F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, FC (35x35) | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (34x34) - smaller | 1152-FBGA, FC (34x34) - smaller |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| HPS Architecture | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| HPS Clock | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz |
| Speed Grade | E1 (commercial, fast) | I1 (industrial) | E2 (commercial, slower) | E3 (commercial, slowest) | E1 | E1 |
| Operating Temperature | Commercial (0C to +85C, per E1 suffix) | Industrial (-40C to +100C) | Commercial | Commercial | Commercial | Commercial |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- Arria 10 SX SoC FPGA with integrated 1.5 GHz dual Cortex-A9 HPS (vs 10AS032H4F35I3SG)
- Hard PCIe Gen3 and 40GbE IP blocks reduce fabric utilization (vs Cyclone V SoC FPGAs)
- Multi-gigabit transceivers up to 17.4 Gbps for direct fronthaul interfaces (vs Cyclone 10 SoC family)
설계 노트
The Arria 10 SX SoC FPGA in the FC-BGA (35x35 mm) package can dissipate significant power under heavy HPS + fabric load. Use the Arria 10 thermal model and conduct a board thermal simulation in Quartus Prime PowerPlay / Thermal Analysis before committing to the PCB stack-up. Estimated: at 85C ambient with all 480K LEs active and 1.5 GHz HPS utilization, junction-to-ambient thermal resistance (theta_JA) is approximately 5-7 C/W with proper heatsink/cold-plate attachment. Provide at least 1 oz copper inner layers under the BGA for heat spreading.
The 1152-ball FC-BGA requires a high-density PCB stack-up: microvias (laser-drilled), 0.8 mm or 1.0 mm ball pitch, and matched-length routing for high-speed transceivers. Use the Arria 10 SX pin-out file from Intel and run HyperLynx or Ansys SIwave for signal integrity on DDR4 channels. Estimated: HPS DDR4 controller supports up to 2400 Mbps per lane; layout must meet length-matching tolerance of +/- 0.25 mm on byte lanes to avoid read/write training failures.
Do not assume that different speed-grade suffixes (E1 vs E2 vs E3) within the same Arria 10 SX family have the same fabric Fmax - slower grades reduce achievable clock frequency and may fail timing closure. Quartus Prime reports the grade-specific Fmax; verify your RTL meets timing with the actual device suffix before tape-out. Also verify the package footprint suffix (F35 vs F34) against your PCB land pattern, as they differ in BGA dimension.
Separate analog/digital ground domains using a star-ground connection near the FPGA. The HPS and FPGA fabric share a common GND but noisy switching returns must not couple into sensitive transceiver analog supply pins. Place decoupling capacitors (10 uF bulk + 100 nF per power pin) within 3 mm of each supply ball per Arria 10 SX hardware reference design. Estimated: per Arria 10 SX pin-power map, expect ~40-60 decoupling positions for the HPS supply island.
규정 준수 정보
RoHS compliance per WWDParts listing for the 10AS048K1F35E1HG. REACH compliance, halogen-free status, and conflict-mineral disclosures not stated in verified web data; refer to Intel product declarations for authoritative statements.
