10AS048K1F35I1HG - Arria 10 SX SoC FPGA 480K LE | Intel
부품 번호: 10AS048K1F35I1HG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5099.79 | $5,099.79 |
| 10 | $4589.81 | $45,898.10 |
| 100 | $4079.83 | $407,983.00 |
| 500 | $3671.85 | $1,835,925.00 |
| 1,000 | $3263.87 | $3,263,870.00 |
10AS048K1F35I1HG 개요
A System-on-Chip FPGA is an integrated circuit that merges a general-purpose microprocessor subsystem (typically ARM Cortex-A class) with programmable FPGA logic, external memory controller, and peripheral IP in a single device. Within the broader IC hierarchy, an SoC FPGA sits above traditional MCUs and standalone FPGAs by providing both deterministic hardware parallelism and software programmability on one die, simplifying board design and reducing BOM count in embedded systems.
Key features of the 10AS048K1F35I1HG include 480K logic elements, integrated dual-core ARM Cortex-A9 MPCore with CoreSight running up to 1.5 GHz, 396 user I/O pins, 20 nm process technology, and support for high-bandwidth DDR memory interfaces through the HPS (Hard Processor System) and FPGA fabric. The Arria 10 SX architecture is engineered for mid-range performance-per-watt applications where transceiver throughput, DSP throughput, and embedded processing must coexist on one chip.
The SoC integrates transceivers capable of multi-gigabit serial connectivity, variable-precision DSP blocks for signal processing, and a rich peripheral set including USB, Ethernet, PCIe, and UART inside the HPS. Designers can partition workloads between the HPS for control-plane tasks and the FPGA fabric for data-plane acceleration, leveraging a coherent interconnect between the two domains.
Typical applications include wireless baseband processing, radar and electronic warfare signal processing, broadcast video infrastructure, industrial machine vision, military communications, and medical imaging. The device's combination of ARM Cortex-A9 control plus high-density FPGA logic suits systems requiring flexible hardware acceleration under software supervision.
When designing with this part, allocate sufficient PCB area for the 35x35 mm FCBGA package and follow Intel's recommended ball-out, decoupling, and power-rail sequencing guidelines. The HPS and FPGA core can boot independently or in coordination, so designers must plan configuration source selection early. Thermal management is critical: at full utilization, expect 15-30 W dissipation depending on transceiver and logic activity.
This page synthesizes distributor pricing, same-family Arria 10 alternatives with the same F35 1152-FCBGA footprint, and design notes drawn from Intel's published Arria 10 device family datasheet and application notes.
드롭인 대체품: 10AS048K1F35I1HG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS048K1F35I1HG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Logic Elements, Process Technology, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS048K1F35E1HG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3850 / 개
데이터시트 보기 →10AS048H4F34I3SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2580 / 개
데이터시트 보기 →10AS048H4F34I3LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3920 / 개
데이터시트 보기 →10AS048H2F34I1HG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2520 / 개
데이터시트 보기 →10AS048H1F34I1HG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2650 / 개
데이터시트 보기 →10AS048K1F35I1HG 최대 정격 & 전기적 특성
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Processor Subsystem | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | 1.5 GHz |
| User I/O Count | 396 |
| 패키지 | 1152-ball FCBGA (35x35 mm) |
| Process Technology | 20 nm |
| Device Variant | 10AS048 (480K LE) |
| Speed Grade | K1 |
| 동작 온도 | -40C to +100C (Industrial) |
| Package Code | F35 |
| 실장 유형 | Surface Mount (Flip-Chip BGA) |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| Supply Voltage (Core) | 0.9 V typical (multi-rail) |
10AS048K1F35I1HG f35 핀 구성 가이드
10AS048K1F35I1HG(f35 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS048K1F35I1HG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS048K1F35I1HG 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Radar and Electronic Warfare Signal Processing, Industrial Machine Vision Systems, Broadcast Video Infrastructure, Military Communications and Tactical Radio, Medical Imaging Systems.
Wireless Baseband Processing
The 10AS048K1F35I1HG's combination of 480K programmable logic elements and an integrated dual-core ARM Cortex-A9 MPCore HPS at 1.5 GHz makes it well suited for 4G/5G small-cell baseband processing, where the FPGA fabric accelerates FFT/iFFT and channel-correction blocks while the HPS runs the MAC scheduler and OAM stack. The 396 user I/O and 20 nm process deliver high DSP throughput at moderate power; the HPS-FPGA coherent interconnect enables low-latency data hand-off. For a 20 MHz LTE sector, expect 15-25 W dissipation at full load.
추천
Radar and Electronic Warfare Signal Processing
Arria 10 SX SoC FPGAs are widely deployed in radar front-end and electronic-warfare subsystems, where the FPGA fabric's variable-precision DSP blocks perform pulse compression, MTI filtering, and beamforming while the dual-core ARM Cortex-A9 HPS handles mode control and target tracking. The 1.5 GHz HPS frequency provides ample headroom for control-plane software, and the 1152-ball FCBGA F35 package supports the high transceiver lane count typical of phased-array radar. Designers typically partition the FFT onto FPGA fabric and run tracking filters on the HPS Cortex-A9 cores.
추천
Industrial Machine Vision Systems
The 10AS048K1F35I1HG's high-density FPGA fabric (480K LEs) enables real-time image pre-processing - filtering, color-space conversion, and feature extraction - at multi-megapixel sensor rates, while the dual-core ARM Cortex-A9 MPCore at 1.5 GHz runs the inspection classifier and PLC communication stack. The 1152-FCBGA F35 package supports multiple MIPI CSI-2 or GigE Vision sensor interfaces via FPGA fabric transceivers. Industrial temperature grade (-40C to +100C) suits factory-floor deployment without additional ruggedization.
추천
Broadcast Video Infrastructure
The 10AS048K1F35I1HG is well matched to broadcast video encoder/decoder and video-routing infrastructure where the FPGA fabric handles multi-stream HEVC/H.264 encoding pipelines and the dual-core ARM Cortex-A9 HPS runs the control and network-management plane. The 396 user I/O and high transceiver count (via the F35 1152-FCBGA package) accommodate SMPTE 2022, 2110 IP-video, and 12G-SDI interfaces simultaneously. The SoC integration reduces board area versus discrete FPGA-plus-CPU designs by approximately 30-40%.
추천
Military Communications and Tactical Radio
Arria 10 SX 480K LE SoC FPGAs serve tactical radio and secure communications platforms, where the FPGA fabric implements modem waveforms (LINK-16, SINCGARS, HAVE QUICK) and the dual-core ARM Cortex-A9 HPS at 1.5 GHz runs crypto and routing stacks under a security-hardened OS. The industrial temperature grade and Intel's Anti-Tamper design support defense-aerospace requirements. The 1152-ball FCBGA F35 footprint enables compact, ruggedized board layouts.
추천
Medical Imaging Systems
The 10AS048K1F35I1HG's combination of 480K logic elements, dual-core ARM Cortex-A9 HPS at 1.5 GHz, and high transceiver bandwidth suits CT, MRI, and ultrasound imaging systems, where the FPGA fabric executes beamforming and image reconstruction while the HPS handles the user interface, DICOM stack, and clinician workflow. Industrial temperature grade is adequate for controlled clinical environments; for portable or field-imaging equipment, consider the E (extended) temperature variant. SoC integration reduces BOM and simplifies IEC 60601 compliance verification.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS048K1F35I1HG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS048K1F35E1HG | 10AS048H4F34I3SG | 10AS048H4F34I3LG | 10AS048H2F34I1HG | 10AS048H1F34I1HG |
|---|---|---|---|---|---|---|
| Package | 1152-FCBGA F35 (35x35 mm) | 1152-FCBGA F35 (35x35 mm) | 1152-FCBGA F35 (35x35 mm) | 1152-FCBGA F35 (35x35 mm) | 1152-FCBGA F35 (35x35 mm) | 1152-FCBGA F35 (35x35 mm) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 480K | 480K | 480K | 480K | 480K | 480K |
| Speed Grade | K1 | K1 | H4 | H4 | H2 | H1 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +100C (Extended) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| HPS Maximum Clock Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| User I/O Count | 396 | 396 | 396 | 396 | 396 | 396 |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Highest HPS clock frequency tier in the Arria 10 SX family (vs 10AS048H2F34I1HG)
- Industrial temperature grade (-40C to +100C) (vs 10AS048K1F35E1HG)
- F35 (35x35 mm) 1152-ball FCBGA package - largest Arria 10 SX BGA option (vs 10AS048H4F34I3SG)
설계 노트
At typical utilization (60-70% logic, 50% DSP, HPS active), the 10AS048K1F35I1HG dissipates approximately 15-25 W. The 35x35 mm F35 FCBGA package requires a high-performance PCB thermal solution: at least 8 thermal vias in the central ball-grid array under the die, connected to inner-plane copper or a heatsink. Without adequate thermal relief, junction temperature can exceed 100C in still air. Estimated: 20 W dissipation at 0.9 V core with theta-JA around 8-12 C/W on a 12-layer PCB. Always run Intel's Arria 10 PowerPlay early estimator before committing to a board stack-up.
The 1152-ball FCBGA F35 (35x35 mm) requires a 1.0 mm or 0.8 mm ball pitch escape routing pattern. Use Intel's recommended land pattern and follow IPC-7352 / IPC-7093 for BGA fanout. Decoupling: place 0402 0.1 uF and 0201 0.01 uF capacitors on every power pin within 2 mm trace length; add bulk 47-100 uF polymer capacitors near each power-rail entry point. Use a 12-layer or 14-layer stack-up with dedicated ground and power planes. Signal-integrity simulations are mandatory for transceiver lanes above 10 Gbps.
Do not assume F34 and F35 packages share the same ball-out - the part numbering decodes F35 as the 35x35 mm FCBGA package, but the F34 (different Arria 10 SX 1152-ball FCBGA option) has a different ball map. Always cross-check the Intel Quartus Prime .pcf pinout file for the exact OPN before PCB layout. Another common pitfall: attempting to migrate between speed grades (K1, H1, H2, H4) without re-running timing closure - higher speed grades (lower number suffix) may not meet timing for your design. Finally, ensure configuration source selection (MSEL pins) is correctly set for your boot mode (AS, PS, JTAG, or FPP).
규정 준수 정보
RoHS, REACH, lead-free, halogen-free, and conflict-minerals compliance per Intel product environmental documentation for Arria 10 SX devices. AEC-Q100 qualification not applicable - Arria 10 SX is industrial/military grade, not automotive AEC-Q100.
