10AS048K4F35E3SG - Arria 10 SX 480K SoC FPGA | Intel | 1152-FBGA
부품 번호: 10AS048K4F35E3SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3850 | $3,850.00 |
| 10 | $3620 | $36,200.00 |
| 25 | $3480 | $87,000.00 |
| 100 | $3180 | $318,000.00 |
| 250 | $2890 | $722,500.00 |
10AS048K4F35E3SG 개요
A System-on-Chip (SoC) FPGA is an integrated circuit that fuses a general-purpose processor subsystem with field-programmable logic on a single die. The Arria 10 SX family escalates this concept with a dual-core 32-bit ARM Cortex-A9 MPCore hardened subsystem that includes NEON media engine, FPU, L1/L2 caches, CoreSight debug, ECC-protected SDRAM controllers, and a rich set of peripherals (USB, Ethernet MAC, I2C, SPI, UART, NAND/NOR flash controllers). This architecture removes the latency and bandwidth bottleneck between CPU and FPGA fabric that discrete CPU+FPGA boards suffer, enabling deterministic hardware-software co-design in military radar, 5G baseband, medical imaging, and industrial vision.
Key features of the 10AS048K4F35E3SG include 480K logic elements, transceiver capability via the SX family, adaptive logic modules (ALMs), and variable-precision DSP blocks for floating-point or fixed-point signal processing. The hard memory controller supports DDR3/DDR4 with ECC, and the partial reconfiguration flow allows live logic swaps without halting the ARM cores. The Industrial temperature-grade variant (suffix E3 with I) supports extended ambient deployments.
Technically, Arria 10 SX is built on TSMC's 20 nm process with a 14.3 Gbps-capable transceiver layer and a 72-bit wide hardened memory interface. The HPS bridges to the FPGA fabric via ARM CoreLink CCI-400 coherent interconnect, allowing CPU and FPGA accelerators to share cached memory coherently - critical for software-defined radio and protocol stack acceleration.
Typical applications include software-defined radio (SDR), 5G baseband processing, military radar, industrial machine vision, test and measurement equipment, and broadcast video infrastructure. Designers use the SX family when they need both firmware-driven control flow on Cortex-A9 and parallel DSP/FFT pipelines in FPGA fabric. For purely logic-only or logic+transceiver-only designs, the Arria 10 GX or GT variants are preferred over the SX.
When designing with the 10AS048K4F35E3SG, ensure proper power sequencing, thermal management of the 35x35 mm FC-FBGA, and use the Quartus Prime development environment with the SoC EDS toolchain. Reference designs from Intel provide verified pin assignments, BSDL files, and reference HPS bootloader configurations. Power consumption depends on transceiver count, logic utilization, and HPS activity - budget for at least 20-30 W typical in worst-case corner.
This page synthesizes Intel Arria 10 SX specifications, verified distributor inventory, drop-in same-package alternatives from the Arria 10 family, and practical design considerations not available on the manufacturer datasheet alone.
드롭인 대체품: 10AS048K4F35E3SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS048K4F35E3SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature Grade, Family, Logic Elements, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS048K4F35E3LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3975 / 개
데이터시트 보기 →10AS048K3F35E3SG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AS048K2F35E3SG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AS048K4F35I3SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3690 / 개
데이터시트 보기 →10AS048H4F34I3SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2580 / 개
데이터시트 보기 →10AS032K4F35I3SG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AS048K4F35E3SG 최대 정격 & 전기적 특성
| Series | Arria 10 SX |
| Product Type | FPGA - Field Programmable Gate Array (SoC) |
| Logic Elements | 480K |
| Number of Logic Elements | 480000 |
| Voltage - Supply | 0.87 V to 0.97 V core, 1.2 V/1.5 V/1.8 V/2.5 V/3.3 V I/O |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +100C (E3 industrial) |
| 패키지 / 케이스 | 1152-FBGA, FC (Flip-Chip, 35 mm x 35 mm) |
| Supplier Device Package | 1152-FBGA |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Frequency | 1.5 GHz capable |
| Process Technology | 20 nm |
| Transceiver Data Rate | Up to 14.3 Gbps (family-level) |
| DSP Blocks | Variable-precision, integer and floating-point |
| Memory Interface | DDR3/DDR4 with ECC (hard controller) |
| Configuration | Partial reconfiguration supported |
| RoHS 상태 | Compliant (per Intel product page) |
| MSL 레벨 | MSL3 (per FCBGA package family) |
10AS048K4F35E3SG 1152-fbga 핀 구성 가이드
10AS048K4F35E3SG(1152-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS048K4F35E3SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS048K4F35E3SG 적합 용도: 6 애플리케이션s: Software-Defined Radio (SDR) Baseband, 5G NR Baseband and Beamforming, Military Radar and Electronic Warfare, Industrial Machine Vision and Inspection, Test and Measurement Instrumentation, Broadcast Video Processing and Encoding.
Software-Defined Radio (SDR) Baseband
The 10AS048K4F35E3SG is an ideal software-defined radio baseband processor, combining 480K logic elements for parallel FFT/fir/decimation pipelines with a dual ARM Cortex-A9 HPS at 1.5 GHz for protocol stack execution. Per Intel Arria 10 SX documentation, the HPS-to-FPGA coherent interconnect allows the ARM cores to operate on shared SDRAM buffer data with the FPGA fabric without DMA round-trips, cutting latency in LTE/5G receiver chains. The 14.3 Gbps transceivers connect directly to RF ADC/DAC front-ends such as AD9361, making the part a single-chip SDR platform. Engineers typically pair it with the AD9361 wideband transceiver for sub-6 GHz SDR designs.
추천
5G NR Baseband and Beamforming
The 10AS048K4F35E3SG handles 5G New Radio physical-layer processing with its variable-precision DSP blocks supporting LTE and 5G NR channel estimation, LDPC decoding, and massive-MIMO beamforming weight calculations. The Arria 10 SX family integrates hardened CPRI/OBSAI interfaces and supports JESD204B/C to high-speed RF DACs, making the 10AS048K4F35E3SG well-suited for sub-6 GHz small-cell base stations. The dual ARM Cortex-A9 cores run the L2/L3 stack and OAM software while the FPGA fabric handles L1 PHY in real time. Reference designs from Intel include complete 5G PHY pipelines with verified timing closure.
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Military Radar and Electronic Warfare
Military phased-array radar and electronic-warfare systems leverage the 10AS048K4F35E3SG's 480K logic elements for pulse compression, MTI filtering, and digital beamforming across thousands of antenna elements. The Arria 10 SX architecture's hardened memory controller with ECC supports long coherent integration windows critical for radar detection sensitivity. The -40C to 100C industrial temperature range supports ruggedized MIL-STD-810 deployments. Defense contractors typically combine the SX SoC with high-speed ADCs such as the AD9081 or AD9082 for direct-RF sampling at L/S/C bands.
추천
Industrial Machine Vision and Inspection
High-speed industrial machine vision systems use the 10AS048K4F35E3SG to process 4K and 8K image sensor streams in real time, applying Sobel, Canny, and CNN-based defect detection algorithms. The 14.3 Gbps transceivers accept MIPI CSI-2, SLVS-EC, or sub-LVDS streams from Sony Pregius or Gpixel sensors, while the FPGA fabric runs convolutional neural networks for AI-assisted quality inspection. The Cortex-A9 HPS executes Linux-based factory automation protocols (EtherCAT, PROFINET) and HMI rendering. Reference designs from Intel include verified MIPI CSI-2 RX IP cores for sub-1 us latency vision pipelines.
추천
Test and Measurement Instrumentation
Test and measurement equipment designers use the 10AS048K4F35E3SG as a real-time DSP engine for arbitrary waveform generators, oscilloscopes, and protocol analyzers. The Arria 10 SX variable-precision DSP blocks support high-sample-rate FFT, I/Q modulation, and protocol-decode acceleration in the fabric, while the ARM Cortex-A9 subsystem runs the user interface and remote control stack. The DDR4 controller with ECC enables deep acquisition memory for digitizer cards. Major T&M vendors including Keysight and Rohde & Schwarz have shipped Arria 10 SX-based instruments for 5G and aerospace test.
추천
Broadcast Video Processing and Encoding
Broadcast video infrastructure uses the 10AS048K4F35E3SG for SDI/HDMI aggregation, HEVC/H.265 encoding, and color-space conversion at 4K60 and 8K resolutions. The FPGA fabric implements multi-stream HEVC encoder cores, while the dual ARM Cortex-A9 HPS runs Linux for control-plane network interfaces (SMPTE 2022, NDI, SMPTE 2110). The hardened DDR4 controller provides frame-buffer bandwidth for multi-channel encoding pipelines. Reference designs from Intel demonstrate verified 4K60 HEVC main-profile encoding at 6 Gbps input rates with sub-frame latency.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS048K4F35E3SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS048K4F35E3LG | 10AS048K3F35E3SG | 10AS048K2F35E3SG | 10AS048K4F35I3SG |
|---|---|---|---|---|---|
| Package | 1152-FBGA, FC (35x35) | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same |
| Series | Arria 10 SX | Arria 10 SX - same | Arria 10 SX - same | Arria 10 SX - same | Arria 10 SX - same |
| Logic Elements | 480K | 480K | Reduced tier K3 (slightly lower density) | Lower density K2 tier | 480K |
| HPS Core | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same |
| Operating Temperature | 0C to +100C (E3 industrial) | 0C to +100C (E3 industrial) | 0C to +100C (E3 industrial) | 0C to +100C (E3 industrial) | -40C to +100C (I3 industrial) |
| Process Technology | 20 nm | 20 nm - same | 20 nm - same | 20 nm - same | 20 nm - same |
| Transceiver Data Rate | Up to 14.3 Gbps | Up to 14.3 Gbps | Up to 14.3 Gbps | Up to 14.3 Gbps | Up to 14.3 Gbps |
| Configuration Method | Partial reconfiguration supported | Partial reconfiguration supported | Partial reconfiguration supported | Partial reconfiguration supported | Partial reconfiguration supported |
주요 차별점
- Integrated dual-core ARM Cortex-A9 HPS at 1.5 GHz with coherent cache interconnect (vs Arria 10 GX (10AX-series))
- 480K logic elements at 20 nm process for high-density DSP (vs Cyclone V SoC (5CSXFC6))
- Hardened DDR3/DDR4 controller with ECC on HPS (vs Arria V SoC (5ASXFB5))
설계 노트
Estimated: At 480K logic elements utilization with HPS active and transceivers running, the 10AS048K4F35E3SG consumes approximately 20-30 W depending on clock and toggle rate. Design the power supply with 0.87 V to 0.97 V core rails at 30 A peak, plus 1.2 V/1.8 V/2.5 V/3.3 V I/O rails. Use Intel's PowerPlay Early Power Estimator (EPE) spreadsheet with worst-case toggle rates and junction temperature inputs to validate the power tree before PCB layout. Add bulk capacitance of at least 1000 uF low-ESR ceramic near the FC-BGA power balls.
The 1152-ball FC-FBGA 35 mm x 35 mm package at 1 mm ball pitch requires via-in-pad PCB technology with laser-drilled microvias. Use an 8-12 layer stackup with continuous GND and PWR planes on adjacent layers to provide return-path references for the 14.3 Gbps transceivers. Length-match the DDR4 signals from the HPS controller to within 5 mils per byte lane and follow the Intel pin connection guidelines for unused pins and pin-strapping. Use JEDEC-standard JESD21-C solder paste and a reflow profile with 245C peak temperature for lead-free assembly.
Estimated: With 20-30 W typical dissipation across the 35 mm x 35 mm FC-BGA, the junction-to-ambient thermal resistance theta_JA is approximately 8-12 C/W with a properly designed 6-layer PCB and thermal vias under the exposed die. Without thermal management, junction temperature will exceed 125C at ambient 85C. Implement a thermal via array (at least 100 thermal vias under the BGA thermal pad) and consider a low-profile heatsink or heat spreader for industrial and military temperature grades.
Common pitfalls when designing with the 10AS048K4F35E3SG include: (1) ignoring HPS boot configuration - the ARM Cortex-A9 subsystem requires a valid boot ROM image in SPI or NAND flash; (2) not assigning MSEL pins correctly for the desired configuration scheme (AS, PS, FPP, JTAG); (3) forgetting to connect all GND balls to the ground plane; (4) not verifying transceiver reference clock jitter meets the Arria 10 SX requirements for 14.3 Gbps operation; (5) mismatched IO standards on the HPS peripheral pins.
규정 준수 정보
RoHS compliance per Intel Arria 10 SX product page material attributes. Lead-free reflow profile supported. Not AEC-Q100 qualified - choose 10AS048K4F35I3SG variant for industrial temperature grade deployments.
