H5ANAG8NCMR-VKI - 16Gb DDR4 SDRAM 2666Mbps x8 | SK Hynix
부품 번호: H5ANAG8NCMR-VKI ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
H5ANAG8NCMR-VKI 개요
DDR4 SDRAM is the fourth generation of Double Data Rate synchronous DRAM, a class of volatile memory that transfers data on both rising and falling edges of the clock, doubling effective bandwidth compared to SDR DRAM. In the system memory hierarchy, DDR4 sits below LPDDR4/DDR5 in power optimization but above DDR3 in speed and density, making it the dominant main-memory technology for servers, workstations, and embedded compute platforms from roughly 2014 to the present DDR5 transition.
Key features of the H5ANAG8NCMR-VKI include fully synchronous operation referenced to both rising and falling edges of the clock, differential clock inputs (CK/CK#) for improved signal integrity, and on-die termination (ODT) that reduces reflections on high-speed address, command, and data buses. The 16Gb density in a single x8 component allows designers to populate 8GB with only four devices, reducing BOM count and PCB area compared to lower-density generations.
Technically, the device uses a bank-group architecture with multiple internal banks, supporting commands such as ACTIVATE, READ, WRITE, and PRECHARGE per the JEDEC DDR4 specification, with programmable CAS latency and burst length for system tuning. The -VKI speed grade supports 2666 Mbps operation with JEDEC-standard 1.2V VDD signaling, enabling lower power than DDR3's 1.5V interface at substantially higher bandwidth.
Typical applications include server and workstation main memory DIMMs, industrial embedded computing modules, networking equipment line-card buffers, and FPGA-based processing systems that require gigabyte-scale working memory with high sustained bandwidth.
When designing with this device, pay close attention to DDR4 fly-by routing, VREF training, and ZQ calibration requirements, which differ significantly from DDR3 layouts and are critical for signal integrity at 2666 Mbps.
This page synthesizes distributor stock data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving buyers and engineers a single decision-ready reference.
드롭인 대체품: H5ANAG8NCMR-VKI — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: H5ANAG8NCMR-VKI (동일 폼 팩터 및 풋프린트) — 차이점: Data Rate, Memory Type, Package, Memory Size, Memory Organization.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
H5ANAG8NCMR-XNI
✅ 드롭인✓ 재고 있음
$4.15 / 개
데이터시트 보기 →H5ANAG8NCMR-VKC
✅ 드롭인✓ 재고 있음
$8.05 / 개
데이터시트 보기 →H5ANAG8NCR-VKC
✅ 드롭인✓ 재고 있음
$28.13 / 개
데이터시트 보기 →H5ANAG8NAMR-UHC
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2.15 / 개
데이터시트 보기 →MT40A2G8AG-062E
✅ 드롭인✓ 재고 있음
$9.75 / 개
데이터시트 보기 →H5ANAG8NCMR-VKI 최대 정격 & 전기적 특성
| 메모리 유형 | DDR4 SDRAM |
| 메모리 크기 | 16 Gb |
| Memory Organization | x8 |
| 데이터 속도 | 2666 Mbps per pin |
| Technology | CMOS, volatile DRAM |
| 실장 유형 | Surface Mount (BGA) |
| Product Status | Active |
| Clocking | Differential clock (CK / CK#), fully synchronous |
| On-Die Termination | Yes (ODT) |
H5ANAG8NCMR-VKI standard 핀 구성 가이드
H5ANAG8NCMR-VKI(standard 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: H5ANAG8NCMR-VKI.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
H5ANAG8NCMR-VKI 적합 용도: 6 애플리케이션s: Server and Workstation Main Memory, Embedded Computing and COM Express Modules, Networking Line Cards and Packet Buffers, FPGA-Based Processing and Prototyping Systems, Industrial Gateways and Edge AI Systems, Medical Imaging and Instrumentation.
Server and Workstation Main Memory
The H5ANAG8NCMR-VKI is a natural fit for server and workstation main memory because its 16Gb density and 2666 Mbps data rate deliver maximum capacity per component and high sustained bandwidth. Four x8 devices populate a single-rank 8GB ECC UDIMM or RDIMM byte lane, while sixteen devices build a dual-rank 32GB module. DDR4 bank-group architecture interleaves activations for higher effective bandwidth than DDR3 at the same clock. Placed on a standard JEDEC DIMM with fly-by address/command routing and per-pin ODT, the -VKI speed grade sustains 2666 MT/s under the controller's trained read/write leveling. Compared with populating 8Gb parts, halving IC count reduces placement cost, power, and failure points in volume server builds.
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Embedded Computing and COM Express Modules
Embedded x86 and ARM compute modules (COM Express, SMARC, ATX daughterboards) use the H5ANAG8NCMR-VKI to provide multi-gigabyte system memory in a small footprint. Two to four 16Gb x8 components give 4-8GB of soldered-down memory, eliminating SO-DIMM connectors and improving vibration resistance in industrial and transportation environments. The 2666 Mbps rate matches Intel and AMD embedded controller memory references, and the 1.2V-class DDR4 interface keeps memory power low for fanless designs. Designers should run full read/write training at the target frequency and budget soldered-down memory as non-upgradable, selecting the 16Gb density upfront since it is the only way to reach 8GB with just four devices on a compact module.
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Networking Line Cards and Packet Buffers
Routers, switches, and network appliances need large, fast packet buffers and flow tables; the H5ANAG8NCMR-VKI's 16Gb density and 2666 Mbps bandwidth address both requirements. An x8 organization maps cleanly onto 64-bit control-plane memory buses using eight devices, while on-die termination supports the heavily loaded multi-drop address/command nets typical of line-card layouts. DDR4 bank groups allow concurrent activation streams that keep queue-management engines fed at line rate. Because networking systems often run 24/7 at elevated ambient temperatures, verify the device's approved operating temperature range and derate speed accordingly. Using a common footprint also lets one line-card PCB accept multiple SK Hynix speed bins based on cost and availability.
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FPGA-Based Processing and Prototyping Systems
FPGA designs for image processing, test instrumentation, and acceleration frequently require gigabyte-scale working memory; the H5ANAG8NCMR-VKI connects directly to FPGA hard DDR4 memory controllers. The x8 organization simplifies data-bus mapping to 72-bit ECC interfaces (eight devices plus one ECC device), and 2666 Mbps matches the validated upper-rate operating points of common FPGA DDR4 PHYs. During bring-up, engineers must execute the full DDR4 training sequence - write leveling, read centering, write/read DQS gating, and VREF training - which the on-die termination and differential clocking of this device support. The 16Gb density allows an 8GB buffer bank with only nine components, keeping the FPGA board layout compact and routing lengths matched.
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Industrial Gateways and Edge AI Systems
Edge AI gateways running vision inference and data logging benefit from the H5ANAG8NCMR-VKI's combination of 16Gb density and DDR4 bandwidth, which supports frame buffers for multiple camera streams and model weight storage in DRAM. Four soldered-down x8 components provide 8GB with low memory power draw, important for passively cooled edge enclosures. The 2666 Mbps rate supplies the headroom needed for real-time pre-processing pipelines, while bank-group parallelism smooths bursty DMA traffic from capture and accelerator IPs. Designers should validate sustained bandwidth under mixed read/write loads and confirm temperature ratings for the deployment environment. Choosing DDR4 components like this part also keeps the design on a mature, multi-source supply chain rather than scarce DDR5.
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Medical Imaging and Instrumentation
Medical imaging systems such as ultrasound, digital radiography, and lab analyzers require large image buffers with reliable, low-jitter memory; the H5ANAG8NCMR-VKI's 16Gb x8 DDR4 at 2666 Mbps fills this role with a small footprint. Eight devices form a 64-bit plus ECC data path that protects long image acquisitions against soft errors, and on-die termination maintains signal integrity on the dense multi-drop command bus typical of instrument backplanes. DDR4's lower operating voltage reduces memory subsystem heat, easing thermal design in enclosed benchtop instruments. Because medical programs have long lifecycles, the JEDEC-standard DDR4 footprint allows second-sourcing across SK Hynix grades and Micron equivalents without PCB redesign over the product's service life.
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추천 제품 요약
엔지니어링 참조 데이터: H5ANAG8NCMR-VKI — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | H5ANAG8NCMR-XNI | H5ANAG8NCR-VKC | MT40A2G8AG-062E |
|---|---|---|---|---|
| Brand | SK Hynix | SK Hynix | SK Hynix | Micron Technology |
| Package | FBGA (DDR4 x8, JEDEC standard ballout) | FBGA - same footprint | FBGA - same footprint | FBGA - same JEDEC footprint |
| Memory Size | 16 Gb | 16 Gb | 16 Gb | 16 Gb |
| Organization | x8 | x8 | x8 | x8 |
| Technology | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM |
| Speed Grade | -VKI (2666 Mbps class) | -XNI (2666-class bin) | -VKC (2666-class bin) | -062E (2666-class bin) |
| Lifecycle Status | Active | Active | Active | Active |
주요 차별점
- 16Gb density halves IC count per gigabyte (vs H5AN8G8NCJR-VKI)
- Multi-bin same-footprint family for cost/supply tuning (vs H5ANAG8NCMR-XNI)
- JEDEC-standard cross-brand second source (vs MT40A2G8AG-062E)
설계 노트
At 2666 Mbps, DDR4 signal integrity depends on fly-by address/command routing with per-DIMM or per-device ODT, matched-length data groups (skew within controller spec, typically a few picoseconds per mm rule of thumb), and solid reference planes. Route each byte lane over an unbroken ground reference, and terminate VTT with bulk plus high-frequency decoupling near the termination rail. Run the full training sequence (write leveling, read centering, VREF training) at the target frequency rather than assuming datasheet timings alone guarantee margin.
DDR4 operates from separate VDD, VDDQ, and VPP rails with VTT termination at VDDQ/2. Estimate per-device current from the controller's bandwidth profile - 16Gb x8 at 2666 Mbps can draw appreciable peak current during bank-group interleaved bursts, so size the VTT regulator and bulk capacitance for worst-case simultaneous read/write patterns, not average throughput. Verify actual VDD/VDDQ values and current figures against the SK Hynix datasheet before finalizing the power tree; the retrieved data did not include explicit rail specifications.
Soldered-down DDR4 is not upgradeable: choose the 16Gb H5ANAG8NCMR-VKI upfront if there is any chance of needing 8GB from four chips. Second, speed-bin suffixes (V/X/U/R codes) encode both speed and temperature/grade attributes - never substitute a lower bin and assume the same operating frequency. Finally, when qualifying the Micron MT40A2G8AG-062E cross-brand, re-verify output driver strength, ODT settings, and AC timings against both vendors' datasheets, since JEDEC pin compatibility does not guarantee identical electrical behavior.
규정 준수 정보
Compliance status not stated in retrieved distributor snippets; request RoHS/REACH certificates from SK Hynix or distributor before compliance-critical use.
