10AS048K4F35E3SG - Arria 10 SX 480K SoC FPGA | Intel | 1152-FBGA
MPN: 10AS048K4F35E3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3850 | $3,850.00 |
| 10 | $3620 | $36,200.00 |
| 25 | $3480 | $87,000.00 |
| 100 | $3180 | $318,000.00 |
| 250 | $2890 | $722,500.00 |
Drop-in alternatives for 10AS048K4F35E3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS048K4F35E3LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3975 / Unit
View Datasheet →10AS048K3F35E3SG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AS048K2F35E3SG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AS048K4F35I3SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3690 / Unit
View Datasheet →10AS048H4F34I3SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2580 / Unit
View Datasheet →10AS032K4F35I3SG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AS048K4F35E3SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 SX |
| Product Type | FPGA - Field Programmable Gate Array (SoC) |
| Logic Elements | 480K |
| Number of Logic Elements | 480000 |
| Voltage - Supply | 0.87 V to 0.97 V core, 1.2 V/1.5 V/1.8 V/2.5 V/3.3 V I/O |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +100C (E3 industrial) |
| Package / Case | 1152-FBGA, FC (Flip-Chip, 35 mm x 35 mm) |
| Supplier Device Package | 1152-FBGA |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Frequency | 1.5 GHz capable |
| Process Technology | 20 nm |
| Transceiver Data Rate | Up to 14.3 Gbps (family-level) |
| DSP Blocks | Variable-precision, integer and floating-point |
| Memory Interface | DDR3/DDR4 with ECC (hard controller) |
| Configuration | Partial reconfiguration supported |
| RoHS Status | Compliant (per Intel product page) |
| MSL Level | MSL3 (per FCBGA package family) |
10AS048K4F35E3SG 1152-fbga Pin Configuration Guide
Complete pinout information for 10AS048K4F35E3SG (1152-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048K4F35E3SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048K4F35E3SG is suitable for 6 applications: Software-Defined Radio (SDR) Baseband, 5G NR Baseband and Beamforming, Military Radar and Electronic Warfare, Industrial Machine Vision and Inspection, Test and Measurement Instrumentation, Broadcast Video Processing and Encoding.
Software-Defined Radio (SDR) Baseband
The 10AS048K4F35E3SG is an ideal software-defined radio baseband processor, combining 480K logic elements for parallel FFT/fir/decimation pipelines with a dual ARM Cortex-A9 HPS at 1.5 GHz for protocol stack execution. Per Intel Arria 10 SX documentation, the HPS-to-FPGA coherent interconnect allows the ARM cores to operate on shared SDRAM buffer data with the FPGA fabric without DMA round-trips, cutting latency in LTE/5G receiver chains. The 14.3 Gbps transceivers connect directly to RF ADC/DAC front-ends such as AD9361, making the part a single-chip SDR platform. Engineers typically pair it with the AD9361 wideband transceiver for sub-6 GHz SDR designs.
Recommended
5G NR Baseband and Beamforming
The 10AS048K4F35E3SG handles 5G New Radio physical-layer processing with its variable-precision DSP blocks supporting LTE and 5G NR channel estimation, LDPC decoding, and massive-MIMO beamforming weight calculations. The Arria 10 SX family integrates hardened CPRI/OBSAI interfaces and supports JESD204B/C to high-speed RF DACs, making the 10AS048K4F35E3SG well-suited for sub-6 GHz small-cell base stations. The dual ARM Cortex-A9 cores run the L2/L3 stack and OAM software while the FPGA fabric handles L1 PHY in real time. Reference designs from Intel include complete 5G PHY pipelines with verified timing closure.
Recommended
Military Radar and Electronic Warfare
Military phased-array radar and electronic-warfare systems leverage the 10AS048K4F35E3SG's 480K logic elements for pulse compression, MTI filtering, and digital beamforming across thousands of antenna elements. The Arria 10 SX architecture's hardened memory controller with ECC supports long coherent integration windows critical for radar detection sensitivity. The -40C to 100C industrial temperature range supports ruggedized MIL-STD-810 deployments. Defense contractors typically combine the SX SoC with high-speed ADCs such as the AD9081 or AD9082 for direct-RF sampling at L/S/C bands.
Recommended
Industrial Machine Vision and Inspection
High-speed industrial machine vision systems use the 10AS048K4F35E3SG to process 4K and 8K image sensor streams in real time, applying Sobel, Canny, and CNN-based defect detection algorithms. The 14.3 Gbps transceivers accept MIPI CSI-2, SLVS-EC, or sub-LVDS streams from Sony Pregius or Gpixel sensors, while the FPGA fabric runs convolutional neural networks for AI-assisted quality inspection. The Cortex-A9 HPS executes Linux-based factory automation protocols (EtherCAT, PROFINET) and HMI rendering. Reference designs from Intel include verified MIPI CSI-2 RX IP cores for sub-1 us latency vision pipelines.
Recommended
Test and Measurement Instrumentation
Test and measurement equipment designers use the 10AS048K4F35E3SG as a real-time DSP engine for arbitrary waveform generators, oscilloscopes, and protocol analyzers. The Arria 10 SX variable-precision DSP blocks support high-sample-rate FFT, I/Q modulation, and protocol-decode acceleration in the fabric, while the ARM Cortex-A9 subsystem runs the user interface and remote control stack. The DDR4 controller with ECC enables deep acquisition memory for digitizer cards. Major T&M vendors including Keysight and Rohde & Schwarz have shipped Arria 10 SX-based instruments for 5G and aerospace test.
Recommended
Broadcast Video Processing and Encoding
Broadcast video infrastructure uses the 10AS048K4F35E3SG for SDI/HDMI aggregation, HEVC/H.265 encoding, and color-space conversion at 4K60 and 8K resolutions. The FPGA fabric implements multi-stream HEVC encoder cores, while the dual ARM Cortex-A9 HPS runs Linux for control-plane network interfaces (SMPTE 2022, NDI, SMPTE 2110). The hardened DDR4 controller provides frame-buffer bandwidth for multi-channel encoding pipelines. Reference designs from Intel demonstrate verified 4K60 HEVC main-profile encoding at 6 Gbps input rates with sub-frame latency.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048K4F35E3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048K4F35E3LG | 10AS048K3F35E3SG | 10AS048K2F35E3SG | 10AS048K4F35I3SG |
|---|---|---|---|---|---|
| Package | 1152-FBGA, FC (35x35) | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same |
| Series | Arria 10 SX | Arria 10 SX - same | Arria 10 SX - same | Arria 10 SX - same | Arria 10 SX - same |
| Logic Elements | 480K | 480K | Reduced tier K3 (slightly lower density) | Lower density K2 tier | 480K |
| HPS Core | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same | Dual ARM Cortex-A9 MPCore - same |
| Operating Temperature | 0C to +100C (E3 industrial) | 0C to +100C (E3 industrial) | 0C to +100C (E3 industrial) | 0C to +100C (E3 industrial) | -40C to +100C (I3 industrial) |
| Process Technology | 20 nm | 20 nm - same | 20 nm - same | 20 nm - same | 20 nm - same |
| Transceiver Data Rate | Up to 14.3 Gbps | Up to 14.3 Gbps | Up to 14.3 Gbps | Up to 14.3 Gbps | Up to 14.3 Gbps |
| Configuration Method | Partial reconfiguration supported | Partial reconfiguration supported | Partial reconfiguration supported | Partial reconfiguration supported | Partial reconfiguration supported |
Key Differentiators
- Integrated dual-core ARM Cortex-A9 HPS at 1.5 GHz with coherent cache interconnect (vs Arria 10 GX (10AX-series))
- 480K logic elements at 20 nm process for high-density DSP (vs Cyclone V SoC (5CSXFC6))
- Hardened DDR3/DDR4 controller with ECC on HPS (vs Arria V SoC (5ASXFB5))
Design Notes
Estimated: At 480K logic elements utilization with HPS active and transceivers running, the 10AS048K4F35E3SG consumes approximately 20-30 W depending on clock and toggle rate. Design the power supply with 0.87 V to 0.97 V core rails at 30 A peak, plus 1.2 V/1.8 V/2.5 V/3.3 V I/O rails. Use Intel's PowerPlay Early Power Estimator (EPE) spreadsheet with worst-case toggle rates and junction temperature inputs to validate the power tree before PCB layout. Add bulk capacitance of at least 1000 uF low-ESR ceramic near the FC-BGA power balls.
The 1152-ball FC-FBGA 35 mm x 35 mm package at 1 mm ball pitch requires via-in-pad PCB technology with laser-drilled microvias. Use an 8-12 layer stackup with continuous GND and PWR planes on adjacent layers to provide return-path references for the 14.3 Gbps transceivers. Length-match the DDR4 signals from the HPS controller to within 5 mils per byte lane and follow the Intel pin connection guidelines for unused pins and pin-strapping. Use JEDEC-standard JESD21-C solder paste and a reflow profile with 245C peak temperature for lead-free assembly.
Estimated: With 20-30 W typical dissipation across the 35 mm x 35 mm FC-BGA, the junction-to-ambient thermal resistance theta_JA is approximately 8-12 C/W with a properly designed 6-layer PCB and thermal vias under the exposed die. Without thermal management, junction temperature will exceed 125C at ambient 85C. Implement a thermal via array (at least 100 thermal vias under the BGA thermal pad) and consider a low-profile heatsink or heat spreader for industrial and military temperature grades.
Common pitfalls when designing with the 10AS048K4F35E3SG include: (1) ignoring HPS boot configuration - the ARM Cortex-A9 subsystem requires a valid boot ROM image in SPI or NAND flash; (2) not assigning MSEL pins correctly for the desired configuration scheme (AS, PS, FPP, JTAG); (3) forgetting to connect all GND balls to the ground plane; (4) not verifying transceiver reference clock jitter meets the Arria 10 SX requirements for 14.3 Gbps operation; (5) mismatched IO standards on the HPS peripheral pins.
Compliance Information
RoHS compliance per Intel Arria 10 SX product page material attributes. Lead-free reflow profile supported. Not AEC-Q100 qualified - choose 10AS048K4F35I3SG variant for industrial temperature grade deployments.
