10AS057K3F35E2LG - 570K LE Arria 10 SX SoC FPGA | Intel
부품 번호: 10AS057K3F35E2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3850 | $3,850.00 |
| 10 | $3650 | $36,500.00 |
| 100 | $3420 | $342,000.00 |
| 500 | $3190 | $1,595,000.00 |
| 1,000 | $2950 | $2,950,000.00 |
10AS057K3F35E2LG 개요
An SoC FPGA is a heterogeneous compute device that pairs a general-purpose hard processor system (HPS) with a programmable logic fabric, allowing designers to offload latency-critical or parallel DSP tasks to the FPGA while running OS, control-plane, and I/O stacks on the ARM cores. Within the broader taxonomy, the Arria 10 SX family sits between mid-range Cyclone V/10 and high-end Stratix 10 SoCs, targeting mid-to-high bandwidth applications such as wireless radio, industrial vision, and medical imaging.
Key features for the 10AS057K3F35E2LG include the dual ARM Cortex-A9 MPCore with NEON media engine, CoreSight debug and trace, an integrated Arria 10 FPGA with 570K logic elements, hardened memory controllers, PCI Express Gen2/Gen3 hard IP blocks, and multi-gigabit transceivers. The HPS provides L1/L2 caches, MMU, and a rich peripheral set including USB, Gigabit Ethernet, UART, SPI, I2C, SD/eMMC, and NAND flash controllers, simplifying system design by eliminating external processor + glue logic.
The device is fabricated on TSMC's 20 nm process and uses a 0.9 V core supply with separate rails for HPS, FPGA fabric, and transceivers. Power management is handled through the Arria 10 Smart Voltage ID (SmartVID) interface and dedicated PMBus-controlled voltage regulators. The 1152-ball FCBGA F35 package provides the highest I/O count and full transceiver bandwidth, while K3 indicates the device's speed grade and E2 indicates a specific PLL/transceiver configuration per Altera/Intel ordering information.
Typical applications include wireless base-station digital front-end, medical imaging accelerators, broadcast video processing, industrial motor control, and high-speed test and measurement. In each case, the FPGA fabric accelerates DSP/parallel tasks while the ARM cores handle control-plane networking and protocol stacks.
When designing, ensure the 35x35 mm FCBGA thermal envelope is properly managed with a multi-layer PCB, controlled-impedance transceiver lanes, and a SmartVID-compliant power tree. This page synthesizes distributor pricing, drop-in package-identical alternatives, and selection guidance not consolidated in the manufacturer datasheet.
드롭인 대체품: 10AS057K3F35E2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS057K3F35E2LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, Speed Grade, Operating Temperature, Process Node.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS057K2F35E2LG
✅ 드롭인✓ 재고 있음
$3450 / 개
데이터시트 보기 →10AS057K3F35E2SG
✅ 드롭인✓ 재고 있음
$3740 / 개
데이터시트 보기 →10AS057K3F35E2SG
✅ 드롭인✓ 재고 있음
$3740 / 개
데이터시트 보기 →10AS066K3F35E2LG
✅ 드롭인✓ 재고 있음
$2310 / 개
데이터시트 보기 →10AS048K3F35E2LG
✅ 드롭인✓ 재고 있음
$3495 / 개
데이터시트 보기 →10AS057K4F35E2LG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AS057K3F35E2LG 최대 정격 & 전기적 특성
| Device Family | Arria 10 SX |
| Product Type | System-on-Chip (SoC) FPGA |
| Logic Elements | 570,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Processor Clock | 1.5 GHz |
| Process Node | 20 nm |
| Core Voltage | 0.9 V |
| User I/O Count | 396 |
| 패키지 | 1152-pin FCBGA, F35 (35x35 mm) |
| Speed Grade | K3 |
| Device Designation | E2 |
| 실장 유형 | Surface Mount (BGA) |
| Terminal Pitch | 1.0 mm |
| RoHS 상태 | Compliant |
| Hard Processor System | Yes - ARM Cortex-A9 MPCore |
10AS057K3F35E2LG 1152-pin fcbga, f35 (35x35 mm) 핀 구성 가이드
10AS057K3F35E2LG(1152-pin fcbga, f35 (35x35 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS057K3F35E2LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS057K3F35E2LG 적합 용도: 6 애플리케이션s: Wireless Base-Station Digital Front-End, Medical Imaging Accelerator, Broadcast Video Processing, Industrial Motor Control, Test & Measurement Instrumentation, Aerospace Avionics & UAV Payloads.
Wireless Base-Station Digital Front-End
The 10AS057K3F35E2LG's 570K logic elements and integrated multi-gigabit transceivers deliver the DSP throughput required for CPRI/OBSAI fronthaul and baseband processing. Its dual ARM Cortex-A9 cores handle Layer-2/3 protocol stacks and timing-critical Ethernet bridging while the FPGA fabric implements crest-factor reduction, digital pre-distortion, and FFT/iFFT pipelines. The 396 user I/Os provide ample connectivity for radio cards, antenna interfaces, and backhaul links, while the 20 nm process keeps power dissipation manageable in thermally constrained radio units. A single SoC replaces an external processor + FPGA + glue logic, reducing BOM cost and PCB area. Reference designs in the Altera/Intel Baseband Function Library accelerate development.
추천
Medical Imaging Accelerator
The 10AS057K3F35E2LG is well suited to medical imaging accelerators (ultrasound beamforming, CT reconstruction, MRI gradient control) because the FPGA fabric delivers the parallel arithmetic needed for FFT, FIR filtering, and back-projection while the HPS runs the patient UI, network stack, and DICOM transfer. The integrated ARM Cortex-A9 MPCore with NEON accelerates image preprocessing and JPEG2000 compression at line rate. The 1.5 GHz HPS clock supports responsive multi-tasking under a Linux medical stack. The F35 1152-ball FCBGA gives enough I/O for high-channel-count ultrasound probes and high-resolution video outputs, while the 20 nm node keeps power within thermal envelopes for cart-mounted systems.
추천
Broadcast Video Processing
The 10AS057K3F35E2LG's 570K logic elements and high-speed transceivers make it a strong fit for broadcast video routers, multiviewers, and SDI-to-IP gateways. The FPGA fabric handles uncompressed 12G-SDI cross-points, HDR/WCG conversion, and audio embedding at multi-channel scale, while the HPS runs control software and Ember+ / NMOS IS-04/05 networking. The 396 user I/Os accommodate many SDI ports, reference timing inputs, and 10/25 GbE SFP cages, reducing the need for external crosspoint chips. SmartVID power management keeps a 4U router frame within thermal limits. The 20 nm process provides timing closure headroom for 12G-SDI at the K3 speed grade.
추천
Industrial Motor Control
For multi-axis servo drives and industrial robots, the 10AS057K3F35E2LG pairs the dual ARM Cortex-A9 cores for EtherCAT / PROFINET master stacks with FPGA logic implementing field-oriented control, SVPWM, and current-loop computation at microsecond rates. Its 396 user I/Os accept multiple encoder inputs (EnDat, BiSS, SSI), Hall sensors, and PWM outputs, reducing the need for external decoder ASICs. The 1.5 GHz HPS supports real-time Linux with PREEMPT_RT for deterministic control loops. The F35 FCBGA's high I/O count and high-speed transceivers enable daisy-chained multi-axis communication and integrated functional safety logic per IEC 61508 SIL-2/3 paths.
추천
Test & Measurement Instrumentation
The 10AS057K3F35E2LG integrates an FPGA fabric and ARM Cortex-A9 cores in a single package, ideal for mixed-signal instruments and protocol analyzers. The FPGA implements real-time DSP for ADC/DAC data paths, FFT-based spectrum analysis, and protocol-aware triggering, while the HPS handles UI rendering, USB/LAN connectivity, and SCPI command parsing at multi-MHz rates. Its multi-gigabit transceivers support 10 GbE streaming capture for protocol analyzers, and the 396 user I/Os accommodate many LVDS or LVCMOS channels. The 20 nm process helps meet aggressive channel-count targets without exceeding rack-unit thermal budgets, while the F35 package footprint is shared across the Arria 10 family.
추천
Aerospace Avionics & UAV Payloads
The 10AS057K3F35E2LG's ARM Cortex-A9 cores plus FPGA fabric enable compact avionics subsystems for UAVs and flight-control computers, where weight, power, and footprint are critical. The HPS runs inertial navigation, mission management, and C2 link encryption while the FPGA implements sensor-fusion DSP, MIL-STD-1553 / ARINC 429 interfaces, and discrete I/O expansion. The 396 user I/Os allow direct connection to multiple IMUs, GPS receivers, and payload sensors without external bus expanders. The 20 nm process provides high reliability under vibration, and the industrial temperature grade supports avionics bay environments. The F35 FCBGA package simplifies mechanical integration into sealed enclosures.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS057K3F35E2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS057K2F35E2LG | 10AS057K3F35E2SG | 10AS066K3F35E2LG | 10AS048K3F35E2LG | 10AS057K4F35E2LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-pin FCBGA, F35 (35x35 mm) | 1152-pin FCBGA, F35 (35x35 mm) - same | 1152-pin FCBGA, F35 (35x35 mm) - same | 1152-pin FCBGA, F35 (35x35 mm) - same | 1152-pin FCBGA, F35 (35x35 mm) - same | 1152-pin FCBGA, F35 (35x35 mm) - same |
| Device Family | Arria 10 SX | Arria 10 SX - same | Arria 10 SX - same | Arria 10 SX - same | Arria 10 SX - same | Arria 10 SX - same |
| Logic Elements | 570,000 | 570,000 | 570,000 | 660,000 | 480,000 | 570,000 |
| Speed Grade | K3 | K2 (slower) | K3 - same | K3 - same | K3 - same | K4 (faster) |
| Processor Cores | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Maximum Processor Clock | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| User I/O Count | 396 | 396 | 396 | 396 | 396 | 396 |
주요 차별점
- K3 speed grade within the same die/package, no PCB rework required (vs 10AS057K2F35E2LG)
- Higher 570K LE density within the F35 footprint (vs 10AS048K3F35E2LG)
- Cost-down vs 660K LE while preserving all peripheral mix (vs 10AS066K3F35E2LG)
- Integrated dual ARM Cortex-A9 HPS eliminates external processor (vs Discrete FPGA + external ARM SoC)
설계 노트
The Arria 10 SX requires multiple independent voltage rails: a 0.9 V core supply (SmartVID), 1.1 V/1.2 V for transceivers, 1.8 V/2.5 V/3.3 V for I/O banks, and a dedicated HPS rail. Use a PMBus-controlled PMIC such as the Intel Enpirion EM11/EM12 family to meet SmartVID sequencing requirements. Place decoupling capacitors as close as possible to each rail pin per the pin connection guidelines, and ensure the SmartVID interface is properly tied to the PMIC for adaptive voltage scaling.
The 1152-ball F35 FCBGA dissipates significant power under full fabric + HPS load, so a multi-layer PCB with a continuous ground plane and thermal vias under the BGA is mandatory. Estimate: a fully utilized 570K-LE design at high toggle rate typically consumes 15-20 W from the FPGA core plus 2-5 W from the HPS; without a heatsink or top-side cooling, junction temperature can exceed 100 C in still air. Use the Intel PowerPlay Early Power Estimator (EPE) and Thermal Calculator for your specific utilization before finalizing thermal design.
The 35x35 mm F35 package has 1.0 mm ball pitch; per the verified web data, all 1152 balls are populated. Use microvia stack-ups (any-layer HDI recommended) with via-in-pad for signal escape, controlled-impedance routing for transceiver lanes (100 ohm differential), and matched-length tuning on HPS memory interface traces to DDR3/DDR4. Reference the Arria 10 SX device handbook pin connection guidelines for per-bank supply, reference voltage, and decoupling requirements; never leave unused transceiver channels floating - tie to GND through 6.8 kohm pull-downs.
Common Arria 10 SX design mistakes: (1) forgetting to power the HPS independently from the FPGA fabric - both rails must ramp in the correct sequence per SmartVID; (2) using the wrong JTAG chain configuration when the HPS debug port is included - include both FPGA and HPS in the scan chain; (3) under-estimating configuration memory capacity for bitstream compression - enable Arria 10 bitstream compression to fit large designs in cheaper EPCQ devices; (4) neglecting the MSL-3 moisture sensitivity for F35 FCBGA - bake before reflow if the sealed bag is opened beyond the floor-life tracker.
규정 준수 정보
RoHS and lead-free compliance per the verified DigiKey product listing. Not AEC-Q100 qualified - this part targets industrial, medical, broadcast, and avionics applications where AEC-Q100 is not required. Halogen-free status was not present in the verified data and is recorded as unknown.
