10AS066K3F35E2LG - Arria 10 SX 660K LE SoC FPGA 1152-FBGA | Intel
부품 번호: 10AS066K3F35E2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2710 | $27,100.00 |
| 100 | $2580 | $258,000.00 |
| 500 | $2450 | $1,225,000.00 |
| 1,000 | $2310 | $2,310,000.00 |
10AS066K3F35E2LG 개요
An SoC FPGA is a single-chip integration of a microprocessor subsystem and an FPGA fabric. The Arria 10 SX series is Intel's mid-range SoC FPGA, positioned between the lower-density Cyclone V SoC and the high-performance Stratix 10 SoC in the broader programmable logic device hierarchy. The integrated ARM Cortex-A9 subsystem runs up to 1.5 GHz with CoreSight debug, while the FPGA fabric provides hardware acceleration for DSP, packet processing, and custom interfaces - enabling lower BOM cost, lower power, and tighter deterministic latency than a discrete CPU + FPGA two-chip solution.
Key features include 660K logic elements, 256 KB of embedded memory (per search-engine snippet), hard DDR3/DDR4 memory controllers, transceivers, and 396 user I/Os. The device targets industrial temperature grade and supports configuration via fast passive parallel (FPP) and active serial (AS) schemes. The F35 package designation indicates a 35 mm x 35 mm FCBGA with 1152 balls.
Typical applications include wireless baseband processing, military radar, medical imaging, industrial machine vision, and high-performance test & measurement. The HPS (Hard Processor System) makes it well suited to applications requiring both Linux/real-time OS execution and parallel hardware processing, such as software-defined radio (SDR) and protocol-aware network appliances.
The -E2 speed grade balances timing margin and power; -E1 (fastest) and -E3 (lowest power) variants are also offered in this device family. The 'K3' code denotes logic density 660 and 3 (transceiver/feature) tier within Arria 10 SX.
드롭인 대체품: 10AS066K3F35E2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS066K3F35E2LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Logic Elements, Mounting Type, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS066K3F35E2SG
✅ 드롭인✓ 재고 있음
$2950 / 개
데이터시트 보기 →10AS066K3F35I2LG
✅ 드롭인✓ 재고 있음
$3712.06 / 개
데이터시트 보기 →10AS066K3F35E1HG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AS066K2F35E2LG
✅ 드롭인✓ 재고 있음
$3360 / 개
데이터시트 보기 →10AS066K2F35E2SG
✅ 드롭인✓ 재고 있음
$2890 / 개
데이터시트 보기 →10AS066K2F35I2SG
✅ 드롭인✓ 재고 있음
$5750 / 개
데이터시트 보기 →10AS066K2F35I2LG
✅ 드롭인✓ 재고 있음
$5650.15 / 개
데이터시트 보기 →10AS066K3F35E2LG 최대 정격 & 전기적 특성
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 |
| Process Technology | 20 nm |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Core Voltage | 0.9 V |
| Speed Grade | -E2 |
| 패키지 | 1152-ball FCBGA, 35 mm x 35 mm |
| Package Code | F35 |
| User I/Os | 396 |
| Memory Cells (per snippet) | 660,000 cells (LE equivalent) |
| On-chip Memory | 256 KB (per FindIC snippet) |
| Configuration Scheme | FPP, AS supported |
| Temperature Grade | Industrial |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (per FindIC listing) |
10AS066K3F35E2LG f35 핀 구성 가이드
10AS066K3F35E2LG(f35 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS066K3F35E2LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS066K3F35E2LG 적합 용도: 6 애플리케이션s: Software-Defined Radio (SDR) Baseband, Military Radar Signal Processing, Medical Imaging (Ultrasound / CT Front-End), Industrial Machine Vision, High-Performance Test & Measurement, 5G / Wireless Baseband Processing.
Software-Defined Radio (SDR) Baseband
The 10AS066K3F35E2LG is well-suited to SDR baseband processing because its dual-core ARM Cortex-A9 HPS running up to 1.5 GHz handles protocol stacks, control-plane processing, and Linux/RTOS execution, while the 660K-LE FPGA fabric delivers parallel DSP for FFTs, channelization, and modulation/demodulation at sample rates beyond the reach of general-purpose DSPs. Arria 10 SX transceivers support multi-gigabit links to JESD204B/C data converters and RF front ends, enabling a single-chip implementation of multi-channel SDR platforms. Compared with a discrete CPU + FPGA solution, the SoC integration reduces board area, inter-chip latency, and BOM cost.
추천
Military Radar Signal Processing
In phased-array radar systems, the 10AS066K3F35E2LG's 660K logic elements provide massive parallel compute for pulse compression, MTI filtering, and digital beamforming across hundreds of antenna elements. The hardened ARM Cortex-A9 subsystem executes tracker and control-plane algorithms in real time. Multi-gigabit transceivers stream digitized antenna data to/from ADC/DAC devices, while industrial temperature grade supports ruggedized deployments. Per Arria 10 SX product literature, this density tier balances DSP throughput and power for medium-range surveillance and fire-control radar.
추천
Medical Imaging (Ultrasound / CT Front-End)
The 10AS066K3F35E2LG supports multi-channel beamforming in ultrasound and CT imaging systems. The 660K-LE FPGA fabric processes 64-128 channels of digitized RF in parallel for delay-and-sum beamforming, while the ARM Cortex-A9 HPS handles user interface, image reconstruction, and DICOM networking. On-chip memory and DDR4 controller support high-bandwidth data movement without external memory bottlenecks. The 20 nm process and integrated SoC reduce power and footprint versus older dual-FPGA ultrasound architectures, enabling portable diagnostic cart designs.
추천
Industrial Machine Vision
For high-speed industrial inspection lines, the 10AS066K3F35E2LG ingests multi-gigabit pixel streams from Camera Link, CoaXPress, or GigE Vision cameras through its transceivers, performs real-time image processing (filtering, segmentation, defect detection) in the FPGA fabric, and uses the ARM Cortex-A9 subsystem for line-control communication, HMI, and rejection decisions. The 396 user I/Os allow direct connection to encoders, lighting controllers, and PLCs without bridge logic. Industrial temperature grade and long-term Intel product support suit 24/7 factory-floor operation.
추천
High-Performance Test & Measurement
The 10AS066K3F35E2LG powers next-generation oscilloscopes, protocol analyzers, and BERT platforms where the FPGA fabric handles real-time waveform processing, eye-diagram rendering, and trigger logic at multi-GS/s rates. The integrated ARM HPS runs the instrument's GUI, measurement firmware, and remote-control interfaces (LXI, USBTMC). Tight FPGA-to-HPS coupling minimizes data-movement latency for segmented capture and deep-memory triggers. The 20 nm Arria 10 process gives deterministic timing margin required for measurement-grade instruments.
추천
5G / Wireless Baseband Processing
In small-cell and macro baseband units, the 10AS066K3F35E2LG implements PHY-layer functions (channel coding, MIMO detection, FFT/iFFT) in the FPGA fabric while the dual ARM Cortex-A9 cores run MAC scheduling and OAM stacks under Linux. Multiple CPRI or eCPRI fronthaul links are supported via the integrated transceivers, and the DDR4 controller handles high-bandwidth data movement between PHY buffers and upper layers. SoC integration reduces the bill of materials and power versus discrete ASSP + FPGA designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS066K3F35E2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS066K3F35E2SG | 10AS066K3F35I2LG | 10AS066K3F35E1HG | 10AS066K2F35E2LG | 10AS066K2F35E2SG |
|---|---|---|---|---|---|---|
| Package | 1152-FBGA F35 (35x35 mm) | 1152-FBGA F35 (35x35 mm) - same | 1152-FBGA F35 (35x35 mm) - same | 1152-FBGA F35 (35x35 mm) - same | 1152-FBGA F35 (35x35 mm) - same | 1152-FBGA F35 (35x35 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Speed Grade | -E2 | -E2 | -I2 (industrial) | -E1 (faster) | -E2 | -E2 |
| Feature Tier | K3 (max transceiver / hardened IP) | K3 | K3 | K3 | K2 (reduced) | K2 (reduced) |
| Ball Finish | Pb-free (G suffix) | SnPb (S suffix) | Pb-free (G suffix) | Pb-free (G suffix) | Pb-free (G suffix) | SnPb (S suffix) |
| Temperature Grade | Industrial (E suffix) | Industrial | Industrial | Extended industrial | Industrial | Industrial |
| Approx Unit Price (qty 1, USD) | 2850.00 | Similar (legacy SnPb) | Similar | Higher (~10-15% premium for -E1) | Lower (~10-20% K2 discount) | Lower (~10-20% K2 discount) |
주요 차별점
- Maximum K3-tier hardened IP and transceiver count in the 660K-LE density (vs 10AS066K2F35E2LG)
- Mid-tier -E2 speed grade balances timing margin and cost (vs 10AS066K3F35E1HG)
- Pb-free (RoHS-compliant) ball finish for new designs (vs 10AS066K3F35E2SG)
설계 노트
The 10AS066K3F35E2LG requires multiple supply rails (core 0.9 V, HPS core, HPS I/O, FPGA I/O banks, transceiver, and auxiliary) with strict power-up and power-down sequencing. Per Altera's Arria 10 pin connection guidelines, use an Intel-recommended power management IC such as the Enpirion EM11Z or equivalent multi-rail controller with PG signals tied back to CONF_DONE. Sequencing violations can cause inrush currents above the FPGA's tolerance and risk long-term reliability degradation.
Estimated: At full fabric utilization (~80%) and ~250K logic elements toggling at 250 MHz, the FPGA core can dissipate 8-12 W; the HPS at 1.5 GHz adds another 3-5 W; transceivers at full lane utilization add 1-2 W. The 1152-FBGA F35 package has a typical theta_JA around 8-10 C/W with proper 12-layer PCB and thermal vias under the heat slug. A heatsink with 1-2 C/W thermal resistance and 200 LFM airflow is recommended for industrial-grade deployment; use Arria 10 thermal models in Quartus PowerPlay for accurate per-design estimation.
The 1152-FBGA F35 footprint (35 mm x 35 mm, 1.0 mm ball pitch) requires an HDI PCB stack-up with laser-drilled microvias and at least 8 layers for signal integrity. Match length on DDR4 channels per the Arria 10 EMIF specification. Provide a full ground plane under the BGA with stitched ground vias on the thermal ball array for thermal dissipation. Reference the Arria 10 SoC Development Kit PCB layout files as a starting point.
Do not omit the configuration flash memory or attempt to use a different MSL level than the package specifies - BGA packages are moisture sensitive and require controlled storage and reflow profiles per IPC/JEDEC J-STD-020. Per Intel documentation, leaving MSEL pins in the wrong state during power-up will prevent configuration. Always validate the HPS boot ROM source (SD/eMMC/QSPI) using the Intel SoC EDS bootloader configuration tool before silicon bring-up.
규정 준수 정보
RoHS and lead-free confirmed by 'G' suffix per Altera/Intel package naming convention. AEC-Q100 not applicable - this is an industrial-grade FPGA, not an automotive-qualified part. For automotive designs consider Cyclone V or Arria 10 Auto variants instead.
