10AX090S2F45I2LG - Arria 10 GX FPGA 900K LE | Intel | 1932-FCBGA
부품 번호: 10AX090S2F45I2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5200 | $5,200.00 |
| 10 | $4900 | $49,000.00 |
| 100 | $4500 | $450,000.00 |
| 500 | $4100 | $2,050,000.00 |
| 1,000 | $3800 | $3,800,000.00 |
10AX090S2F45I2LG 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic functionality is defined after manufacturing by a configuration bitstream loaded into on-chip SRAM. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) and bridge the gap between fixed-function ASICs and software-defined processors. The Arria 10 GX family is positioned for mid-range, transceiver-rich applications requiring high throughput serial I/O and DSP horsepower without the cost of high-end Stratix parts.
Key features of this variant include transceiver support via the GX designation, 624 user I/Os, industrial temperature grade (-40C to +100C operating range per the I2 suffix), 28.05 Gbps capable transceivers depending on speed grade (2 in this part number), and integrated hard IP for PCIe Gen3 and memory controllers. The 20nm process combined with an adaptive logic module (ALM) architecture provides a strong performance-per-watt envelope for compute-intensive designs.
Technical depth: the Arria 10 architecture introduces a heterogeneous SoC-like fabric combining FPGA logic, hard floating-point DSP blocks, and high-speed transceivers. The F45 package code denotes a specific BGA pinout family; the I2 suffix encodes industrial temperature grade with speed grade 2; the LG suffix indicates a lead-free (Pb-free) RoHS-compliant finish. Together these provide a balanced performance, power, and I/O bandwidth solution for wired communications, broadcast video, and high-performance computing.
Typical applications include 100G/400G Ethernet line cards, OTN/WDM optical transport, video broadcasting equipment, radar and DSP front-end processing, and PCIe Gen3 accelerator cards. The combination of high logic density and integrated transceivers removes the need for external SerDes chips.
When designing with this part, pay attention to PCB escape routing density for the 1932-ball BGA, signal-integrity simulation of high-speed serial links, and the power-delivery network: a multi-rail core and transceiver supply scheme must be carefully decoupled.
This page synthesizes distributor pricing, drop-in variants within the Arria 10 GX family, and practical design notes that go beyond the manufacturer datasheet headline specifications.
드롭인 대체품: 10AX090S2F45I2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX090S2F45I2LG (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, DSP Blocks, Package, Process Technology, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX090S2F45I1SG
✅ 드롭인✓ 재고 있음
$3620 / 개
데이터시트 보기 →10AX090S2F45E2LG
✅ 드롭인✓ 재고 있음
$3750 / 개
데이터시트 보기 →10AX090S2F45E2SG
✅ 드롭인✓ 재고 있음
$2050 / 개
데이터시트 보기 →10AX090S2F45E1SG
✅ 드롭인✓ 재고 있음
$4890 / 개
데이터시트 보기 →10AX090S2F45E1LG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AX090S2F45I2LG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Device Model | 10AX090 |
| Logic Elements | 900000 |
| Embedded Memory Bits | 59234304 |
| Number of User I/Os | 624 |
| Package Type | 1932-BBGA, FCBGA |
| Operating Voltage (Core) | 0.9 V |
| Process Technology | 20 nm |
| Operating Temperature Grade | Industrial |
| Temperature Range (I2 suffix) | -40C to +100C |
| Speed Grade | 2 |
| Lead Finish | Lead-free (LG suffix, RoHS compliant) |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount (BGA) |
| Terminal Form | Ball |
| Package Code | BGA, FCBGA |
| Package Shape | Square |
10AX090S2F45I2LG square 핀 구성 가이드
10AX090S2F45I2LG(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX090S2F45I2LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX090S2F45I2LG 적합 용도: 6 애플리케이션s: 100G/400G Ethernet Line Cards, OTN/WDM Optical Transport Platforms, Broadcast Video Processing, Radar and DSP Front-End Processing, PCIe Gen3 Accelerator Cards, Test & Measurement Instrumentation.
100G/400G Ethernet Line Cards
The 10AX090S2F45I2LG is well matched to 100G and 400G Ethernet line-card designs because its Arria 10 GX architecture integrates transceivers capable of up to 28.05 Gbps per channel (speed grade dependent). With 900K logic elements and 624 user I/Os, designers can implement MAC, PCS, and FEC blocks in fabric alongside the hard SerDes. The 59 Mbit of embedded memory supports packet buffering and statistics counters without external SRAM. Industrial temperature grade (I2) suits telecom central-office environments where ambient air may reach 55-65C inside sealed enclosures.
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OTN/WDM Optical Transport Platforms
For OTN (Optical Transport Network) and WDM platforms, the 10AX090S2F45I2LG delivers the DSP horsepower and SerDes density required for OTU4 framer/mapper functions and DSP-based chromatic-dispersion compensation. The 20nm Arria 10 fabric supports 100G coherent optical DSP blocks while the integrated hard IP for forward error correction (FEC) accelerates soft-decision decoding. With 624 user I/Os, designers can directly interface to CFP/CFP2 ACO modules and backplane connectors. The 1932-ball FCBGA footprint is shared across the F45 family, simplifying board reuse between 10AX090, 10AX066, and 10AX048 SKUs.
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Broadcast Video Processing
The 10AX090S2F45I2LG is widely deployed in broadcast video infrastructure such as 4K/UHD up-converters, multiviewers, and contribution encoders. Its 900K logic elements plus embedded DSP blocks deliver real-time processing of uncompressed 4K streams at 60 fps. The 624 user I/Os accommodate multiple SDI interfaces (SD/HD/3G/12G-SDI) and HDMI/DisplayPort bridging. Industrial temperature grade suits outdoor broadcast antenna farms and mobile production units. Designers benefit from the F45 family pinout compatibility that allows scaling logic density without board re-spin.
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Radar and DSP Front-End Processing
Radar and electronic-warfare front-end processing demands both high DSP throughput and low-latency serial I/O - both of which the 10AX090S2F45I2LG provides via its hardened floating-point DSP blocks and 28 Gbps capable transceivers. Engineers can implement FFT, beamforming, and pulse-Doppler processing entirely in fabric, while the 59 Mbit embedded memory absorbs intermediate samples between FFT stages. The F45 1932-ball FCBGA footprint is compatible with the 10AX115 and 10AX130 SKUs, enabling a single PCB design that scales with mission requirements.
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PCIe Gen3 Accelerator Cards
The 10AX090S2F45I2LG integrates a hard PCIe Gen3 IP core, eliminating soft IP timing closure headaches and freeing logic for the user's acceleration algorithm. Combined with 624 user I/Os and 900K logic elements, designers can implement x8/x16 PCIe interfaces plus the compute engine on a single device. Industrial temperature grade (I2) suits edge-acceleration servers and factory-floor compute nodes. The F45 BGA footprint matches the wider Arria 10 family, allowing the same host board to host larger or smaller FPGAs across product tiers.
추천
Test & Measurement Instrumentation
In test and measurement instruments such as protocol analyzers, oscilloscopes, and high-speed digitizers, the 10AX090S2F45I2LG provides the simultaneous combination of high-speed serial I/O (for compliance test patterns), large logic capacity (for real-time protocol decoding), and abundant memory bandwidth. The industrial temperature grade ensures stable operation in lab environments that may not be climate controlled. The 1932-ball FCBGA is shared across the Arria 10 family, enabling OEMs to reuse PCB designs across product lines.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX090S2F45I2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX090S2F45I1SG | 10AX090S2F45E2LG | 10AX090S2F45E2SG | 10AX090S2F45E1SG | 10AX090S2F45E1LG |
|---|---|---|---|---|---|---|
| Package | 1932-BBGA, FCBGA (F45) | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 900000 | 900000 - same | 900000 - same | 900000 - same | 900000 - same | 900000 - same |
| Embedded Memory Bits | 59234304 | 59234304 - same | 59234304 - same | 59234304 - same | 59234304 - same | 59234304 - same |
| User I/Os | 624 | 624 - same | 624 - same | 624 - same | 624 - same | 624 - same |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) - same | Extended (0C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) |
| Speed Grade | 2 | 1 (faster Fmax) | 2 - same | 2 - same | 1 (faster Fmax) | 1 (faster Fmax) |
| Lead Finish | Lead-free (LG, RoHS compliant) | Leaded (SG) | Lead-free (LG, RoHS compliant) - same | Leaded (SG) | Leaded (SG) | Lead-free (LG, RoHS compliant) - same |
주요 차별점
- Industrial temperature grade I2 vs E-temp siblings (vs 10AX090S2F45E2LG)
- Higher Fmax margin than speed-grade-2 alternatives (vs 10AX090S2F45I1SG)
- Drop-in scalable across the 10AX090 F45 family (vs 10AX066N2F40E1SG)
설계 노트
The 1932-ball FCBGA package of the 10AX090S2F45I2LG demands HDI PCB technology (any-layer microvia stackup) to escape signals from the dense inner-row balls. Use Intel's package mechanical drawing to plan escape patterns: typically a 1mm ball pitch allows 4-mil trace and 0.4mm via pad diameters, requiring at least a 1-2-1 or 2-4-2 stackup. Estimate: each escape fan-out uses one signal layer for every two rows of balls, so plan at least 10-12 routing layers plus dedicated power planes.
The Arria 10 GX device requires multiple supply rails: core (VCC, 0.9V typical), VCCPT (0.85V), VCCAUX/VCCAUX_PLL, multiple transceiver rails (VCCR/VCCT/VCCP/VCCPT for the GX channels), and I/O banks at 1.2-3.0V. Decoupling must follow the Intel Quartus PDN tool output: typically 10s of low-ESR MLCCs (0201/0402 100nF-10uF) plus bulk polymer or tantalum capacitors near the package. Estimate: peak core current can exceed 30A during heavy logic utilization, so use a 6+ layer stackup with two dedicated core power planes.
Industrial-grade Arria 10 GX parts in a 1932-ball FCBGA can dissipate 20-40W depending on transceiver and logic utilization. Use the Intel Thermal Modeling tool and follow the device datasheet's theta_JA (junction-to-ambient) figures. Recommended approach: thermal vias in the BGA land pad area, top-side heatsink retention frame for airflow >1 m/s, and monitor the on-die temperature via the internal ALT_VOLTAGE_TEMPERATURE sensor available through the System Console. Estimate: without airflow, junction temperature can rise 30-40C above ambient in dense designs.
The GX transceivers on this device support data rates up to 28.05 Gbps (speed-grade dependent). Use the Arria 10 GX Transceiver User Guide and Intel's PCB design guidelines: target differential impedance of 85-100 ohms for transceiver channels, length matching within 150 mils for any pair, and connector breakouts sized for the selected Phoenix/Tyco backplane footprint. Pre-emphasis and equalization settings should be tuned per-channel using the Transceiver Toolkit in Quartus Prime.
Common pitfalls when designing with the 10AX090S2F45I2LG include: (1) mis-assigning the F45 BGA pinout file to a different package code, (2) using wrong MSL rating for the FCBGA (the part is MSL3 or MSL4 - dry-pack and floor-life controls required), (3) omitting the configuration flash (e.g., EPCQ256) which is mandatory because Arria 10 requires external configuration memory for SRAM-based FPGA bitstream loading, (4) confusing I-temp and E-temp parts during assembly - both share the same ball finish but different operating ranges. Always double-check the ordering suffix against the BOM.
규정 준수 정보
RoHS compliance and lead-free finish confirmed by the LG suffix per the Altera/Intel ordering information. REACH, halogen-free, and conflict-mineral status not stated in the Verified Web Data.