10AX090S2F45E1SG - Arria 10 GX FPGA 900K LE | Intel
부품 번호: 10AX090S2F45E1SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6250 | $6,250.00 |
| 10 | $5980 | $59,800.00 |
| 100 | $5640 | $564,000.00 |
| 500 | $5210 | $2,605,000.00 |
| 1,000 | $4890 | $4,890,000.00 |
10AX090S2F45E1SG 개요
What is an FPGA? A Field Programmable Gate Array is a reprogrammable semiconductor whose logic fabric, routing, and I/O can be configured by the end user after manufacturing. FPGAs sit between fixed-function ASICs (best unit cost at high volume) and software-programmable DSPs/MCUs (best flexibility, lowest performance). Within Intel's portfolio, the Arria 10 family occupies the mid-range transceiver-rich segment below the high-end Stratix 10 and above the lower-cost Cyclone 10 series - used when 10-12.5 Gbps serial links, moderate DSP, and significant on-chip memory are required in a single device.
Key features include 24 transceivers up to 12.5 Gbps supporting PCIe Gen3, 10GbE, CPRI, and JESD204B, hard IP for floating-point DSP and variable-precision digital signal processing, 1.6 GHz hard-core ARM Cortex-A9 dual-core Embedded Processor Subsystem option on related variants, and a 96-lane PCIe Gen3 hard IP block. The 1932-ball FCBGA package provides a 45x45 mm footprint suitable for high-density system-in-package modules and advanced thermal management.
Typical applications include 100G line-card bridging, wireless baseband processing, military radar signal processing, broadcast video processing, ASIC prototyping, and high-performance computing acceleration. Designers pair this device with DDR4 external memory and high-speed ADCs/DACs to build complete signal-processing platforms.
When designing with this part, plan thermal dissipation early - 900K LE utilization can draw significant dynamic power. Use Intel Quartus Prime for synthesis, place-and-route, and power estimation. Verify transceiver channel loss budgets with the Arria 10 Transceiver User Guide before committing to PCB stack-up.
This page synthesizes selected distributor stock status, same-package alternative part numbers, and application notes into a single decision-ready reference - the synthesis and application guidance here are not duplicated in the Intel datasheet itself.
드롭인 대체품: 10AX090S2F45E1SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX090S2F45E1SG (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, DSP Blocks, Process Technology, Transceivers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX090S1F45E1SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$8200 / 개
데이터시트 보기 →10AX090S2F45I1SG
✅ 드롭인✓ 재고 있음
$3620 / 개
데이터시트 보기 →10AX090N2F45E1SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$10250 / 개
데이터시트 보기 →10AX090N2F45I1SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6450 / 개
데이터시트 보기 →10AX090N3F45I2SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3450 / 개
데이터시트 보기 →10AX090N3F45E2LG
✅ 드롭인✓ 재고 있음
$2285 / 개
데이터시트 보기 →10AX090S2F45E1SG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Device | 10AX090 |
| Logic Elements (LE) | 900,000 |
| Embedded Memory | 59,234,304 bits |
| DSP Blocks | 1,518 (variable-precision, hard floating-point) |
| Transceivers | 24 channels |
| Max Transceiver Data Rate | 12.5 Gbps |
| 패키지 | 1932-ball FCBGA |
| Package Code | F45 |
| Speed Grade | -E1 (fastest) |
| Device Variant | -S2 (lower-power core) |
| Operating Temperature Grade | Extended |
| Process Node | 20 nm TSMC |
| Hard PCIe Gen3 Blocks | Yes, up to 96 lanes |
| Configuration Method | Active serial (AS), Passive serial (PS), JTAG |
| RoHS 상태 | Compliant |
10AX090S2F45E1SG f45 핀 구성 가이드
10AX090S2F45E1SG(f45 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX090S2F45E1SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX090S2F45E1SG 적합 용도: 7 애플리케이션s: 100G Optical Line-Card Bridging, Wireless Baseband Processing, Military Radar Signal Processing, ASIC Prototyping, Broadcast Video Processing, HPC Acceleration Card, Medical Imaging Processor.
100G Optical Line-Card Bridging
The 10AX090S2F45E1SG's 24 transceivers at 12.5 Gbps aggregate 300 Gbps of bidirectional serial bandwidth, sufficient for 100G Ethernet and OTU4 line-card bridging designs. With 900K LEs and 1,518 DSP blocks, the FPGA can implement MAC, PCS, FEC, and packet-processing functions without external coprocessors. The hard PCIe Gen3 IP block enables direct CPU pairing over x8 PCIe Gen3. Estimated typical power consumption at full transceiver utilization is 22-28 W, requiring a controlled-airflow thermal design.
추천
Wireless Baseband Processing
The 10AX090S2F45E1SG targets LTE and 5G NR baseband units where the variable-precision DSP and floating-point hard IP accelerate FFT, channel estimation, and MIMO decoding. The 59 Mbits of embedded memory buffers OFDM symbols efficiently, reducing external DDR4 bandwidth. Twenty-four transceivers support CPRI up to option 7 (9.83 Gbps) for fronthaul, while 12.5 Gbps lanes enable eCPRI and JESD204B to ADCs/DACs. Quartus Prime DSP Builder accelerates floating-point IP generation.
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Military Radar Signal Processing
The 10AX090S2F45E1SG delivers the logic density and DSP throughput required for phased-array radar beamforming and pulse compression. With 1,518 hard floating-point DSP blocks operating at up to 750 MHz, the device can sustain complex FFT chains at multi-Gsample rates. Transceivers support multi-channel JESD204B ADC/DAC interfaces common in modern radar receivers. Extended temperature grade (E1) suits air-cooled military electronics; ruggedized deployments often derate the industrial I1 variant.
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ASIC Prototyping
The 10AX090S2F45E1SG is widely used as an ASIC prototyping platform due to its high logic density and large embedded memory. Designers partition ASIC RTL across multiple Arria 10 devices using FPGA-in-the-PCB stacking or pin-multiplexed daughter cards. Quartus Prime supports incremental compilation and Design Partition flow to manage compile time. 1.6 GHz internal clock rates can emulate many ASIC clock domains with limited speed penalty, accelerating pre-tape-out verification.
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Broadcast Video Processing
The 10AX090S2F45E1SG powers 4K/8K broadcast video routers, multi-channel up/down/cross converters, and live production switchers. Twenty-four transceivers handle SDI (SMPTE 2022, SMPTE 2110) and 12G-SDI inputs/outputs, while 900K LEs implement color space conversion, scaling, and frame-rate conversion pipelines. The 7.4 MByte on-chip memory buffers large video frames for low-latency processing. Extended temperature grade (E1) suits broadcast chassis operating at elevated rack temperatures.
추천
HPC Acceleration Card
The 10AX090S2F45E1SG accelerates HPC workloads such as genomics, financial Monte Carlo simulation, and machine learning inference. The PCIe Gen3 x16 hard IP provides 16 GB/s host link bandwidth with sub-microsecond latency. The 900K LEs and 1,518 DSP blocks implement custom dataflow engines optimized for specific algorithms, delivering 2-10x speedups over CPU-only implementations on parallel-friendly kernels. Board thermal designs typically use copper cold plates to remove the 22-28 W envelope.
추천
Medical Imaging Processor
The 10AX090S2F45E1SG enables CT, MRI, and ultrasound systems by processing raw high-speed ADC streams into image frames in real time. Its 12.5 Gbps transceivers interface to multi-channel JESD204B ADCs, while the embedded DSP and floating-point IP implement back-projection and beamforming. 900K LEs allow real-time 3D reconstruction at 30-60 fps for clinical workflows. Medical designs typically use the I1 industrial temperature grade variant and follow IEC 60601-1 isolation practices at the board level.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX090S2F45E1SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX090S1F45E1SG | 10AX090S2F45I1SG | 10AX090N2F45E1SG | 10AX090N3F45I2SG | 10AX090N3F45E2LG |
|---|---|---|---|---|---|---|
| Package | F45 (1932-ball FCBGA) | F45 (1932-ball FCBGA) - same | F45 (1932-ball FCBGA) - same | F45 (1932-ball FCBGA) - same | F45 (1932-ball FCBGA) - same | F45 (1932-ball FCBGA) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Core Power Variant | S2 (lower-power) | S1 (baseline) | S2 (lower-power) | N2 (baseline) | N3 (baseline) | N3 (baseline) |
| Speed Grade | -E1 (fastest) | -E1 | -I1 | -E1 | -I2 | -E2 |
| Temperature Grade | Extended | Extended | Industrial | Extended | Industrial | Extended |
| Transceivers | 24 x 12.5 Gbps | 24 x 12.5 Gbps | 24 x 12.5 Gbps | 24 x 12.5 Gbps | 24 x 12.5 Gbps | 24 x 12.5 Gbps |
| Embedded Memory | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits |
주요 차별점
- Lower-static-power -S2 core variant in identical F45 footprint (vs 10AX090S1F45E1SG)
- 24 hard PCIe Gen3 lanes integrated (vs 10AS066K3F35I2SG)
- Hard floating-point DSP blocks at 1.5 GHz (vs Cyclone 10 GX 10CX220YF780E5G)
설계 노트
Estimated: At typical 900K LE utilization with 12.5 Gbps transceivers active, expect 22-28 W dissipation. Use a copper cold plate or finned heatsink with 1-2 m/s airflow. Apply thermal interface material rated for >3 W/mK conductivity and monitor junction temperature via the on-die temperature diode with the MAX1619 or equivalent external sensor.
Transceiver channel loss budget must remain under 12 dB at 6.25 GHz Nyquist (12.5 Gbps data rate) per the Intel Arria 10 Transceiver User Guide. Use Megtron 6 or similar low-loss PCB material with matched-length differential pairs and AC-coupling capacitors. Verify post-layout simulation against the IBIS-AMI models published in the Quartus Prime installation before tape-out.
The 1932-ball FCBGA requires a 1.0 mm ball pitch and high-density routing of 4-6-6-6 layers minimum. Use microvia-in-pad (VIPPO) stack-up for breakout, and provide continuous ground and power planes below the BGA. Multiple GND balls under the die connect to the internal ground plane via 8-mil stitched vias; do not allow signal traces to interrupt stitching patterns.
Estimated: This device requires at least four power rails (VCC, VCCP, VCCERAM, VCCPT, and transceiver rails). Use a multi-phase PWM controller such as the LTM4677 to achieve sub-1% regulation and minimize switching noise coupling into sensitive transceiver channels. Decoupling must include 100 nF 0201 caps at every VCC ball with a 10 uF bulk per quadrant.
Do not rely solely on software power estimates. Early-board bring-up should measure actual VCC current with a precision shunt monitor. The configuration scheme must match the AS/PS/JTAG selection pins at reset - misconfiguration here is the most common first-time bring-up failure mode. Use Intel's Pin Planner to verify I/O standard assignments before synthesis.
규정 준수 정보
RoHS and lead-free per Intel product page. Halogen-free status not explicitly stated in retrieved data and marked unknown.