10AX090S2F45I1SG - Arria 10 GX FPGA 900K LE | Intel / Altera
MPN: 10AX090S2F45I1SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4520 | $45,200.00 |
| 100 | $4180 | $418,000.00 |
| 500 | $3870 | $1,935,000.00 |
| 1,000 | $3620 | $3,620,000.00 |
Drop-in alternatives for 10AX090S2F45I1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090S2F45E2SG
✅ Drop-In✓ In Stock
$2050 / Unit
View Datasheet →10AX090S2F45E2LG
✅ Drop-In✓ In Stock
$3750 / Unit
View Datasheet →10AX090S2F45E1SG
✅ Drop-In✓ In Stock
$4890 / Unit
View Datasheet →10AX090S1F45I1SG
✅ Drop-In✓ In Stock
$3890 / Unit
View Datasheet →10AX090S1F45E1SG
✅ Drop-In✓ In Stock
$8200 / Unit
View Datasheet →10AX090N2F45I1SG
✅ Drop-In✓ In Stock
$6450 / Unit
View Datasheet →10AX090S2F45I1SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Adaptive Logic Modules (ALMs) | 339,620 |
| Embedded Memory Bits | 59,234,304 |
| MLAB Memory | 28.05 Mbits |
| DSP Blocks | 1,518 |
| User I/O Count | 624 |
| Transceiver Count | 12.5 Gbps capable (per family) |
| PCIe Hard IP | PCI Express Gen3 x8 |
| Process Technology | TSMC 20 nm |
| Package | 1932-BBGA, FCBGA |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | 2 (mid-speed) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10AX090S2F45I1SG 1932-bbga, fcbga Pin Configuration Guide
Complete pinout information for 10AX090S2F45I1SG (1932-bbga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090S2F45I1SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090S2F45I1SG is suitable for 6 applications: 4K Video Processing and Broadcast Infrastructure, Wireless Baseband and Radio Unit Processing, Radar Signal Processing and Electronic Warfare, Medical Imaging (Ultrasound, CT, MRI Backplanes), High-Speed Test and Measurement Instrumentation, Industrial Machine Vision and High-Performance Computing.
4K Video Processing and Broadcast Infrastructure
The 10AX090S2F45I1SG fits 4K video processing because its 900K LE fabric and 1,518 DSP blocks deliver the parallelism required for multi-stream HEVC/H.264/H.265 decode and encode at 60 frames per second. Integrated 12.5 Gbps transceivers handle SDI (SMPTE 424M), HDMI 2.0, and DisplayPort 1.4 bridging without external PHY devices, simplifying PCB stack-up and BOM. The 1,518 variable-precision DSP blocks accelerate color-space conversion (RGB to YCbCr), scaling, deinterlacing, and overlay compositing in real time at 4K resolution, while the 59 Mbit embedded RAM sustains line and frame buffers at 60 fps. DDR4 controller bandwidth up to 1,600 Mbps comfortably drives external 4K frame-buffer memory. Hard PCIe Gen3 x8 IP enables direct attachment to host CPUs for ingest pipelines in broadcast studio equipment. The 1932-FCBGA F45 footprint with exposed-die lid offers the thermal headroom needed for sustained full-fabric utilization in 1U rack chassis where airflow is constrained, making it a common choice for broadcast routers, IPTV encoders, and video-wall controllers.
Recommended
Wireless Baseband and Radio Unit Processing
The 10AX090S2F45I1SG fits wireless baseband and remote-radio-unit (RRU) processing because the 1,518 DSP blocks execute FFT/iFFT, channel estimation, and modulation/demodulation kernels for LTE and 5G NR sub-6 GHz radios at full rate. Transceivers rated up to 12.5 Gbps natively support CPRI and OBSAI fronthaul links to baseband units, eliminating external PHY chips. The 900K LE fabric holds multiple simultaneous carriers, including massive-MIMO antenna arrays, while the 59 Mbit embedded RAM buffers OFDM symbol data within the FPGA core, minimizing DDR round-trips. PCIe Gen3 x8 hard IP provides a clean interface to SoC baseband processors. Industrial -40C to +100C temperature grading lets the same part survive outdoor RRU enclosures with passive heatsink cooling. Designers frequently pair this device with DDR4 memories and RF front-end ADCs/DACs to build a complete 4T4R or 8T8R radio head in a single FPGA.
Recommended
Radar Signal Processing and Electronic Warfare
The 10AX090S2F45I1SG fits radar signal processing because 1,518 DSP blocks and 900K LEs handle pulse compression, moving-target-indication (MTI) filtering, and FFT-based Doppler processing across hundreds of channels simultaneously. The industrial -40C to +100C temperature range supports airborne, naval, and vehicle-mounted radar enclosures. Transceivers operating up to 12.5 Gbps provide direct IF or RF sampling links to high-speed ADCs and DACs used in phased-array front-ends, supporting AESA radar beamforming. The 59 Mbit embedded RAM acts as a fast scratchpad for range-Doppler maps before transfer to external DDR4 storage, while PCIe Gen3 x8 attaches the FPGA to radar signal processors or graphics cards for track-formation algorithms. The 1932-FCBGA F45 package's exposed-die lid provides the thermal envelope for sustained DSP throughput without throttling in sealed enclosures, making the device common in EW systems, synthetic-aperture radar (SAR) backplanes, and missile-warning receivers.
Recommended
Medical Imaging (Ultrasound, CT, MRI Backplanes)
The 10AX090S2F45I1SG fits medical imaging backplanes because the 1,518 DSP blocks deliver beamforming, harmonic imaging, and speckle-reduction kernels for ultrasound at hundreds of channels per device. High-speed transceivers route raw transducer data at multi-gigabit rates into the FPGA fabric for real-time processing. The 900K LE fabric supports multi-modality CT reconstruction (filtered back-projection or iterative) at clinical frame rates, while DDR4 controllers handle the bulk image-data bandwidth. The 624 user I/O pins interface to ADC arrays and channel-multiplexing ASICs common in 64 to 192 element ultrasound probes. Industrial temperature grading and long-term product longevity programs make this part appropriate for medical OEMs seeking IEC 60601-1 compliance pathways. The exposed-die lid of the F45 package enables compact thermal designs in portable ultrasound carts and cart-mounted patient monitors.
Recommended
High-Speed Test and Measurement Instrumentation
The 10AX090S2F45I1SG fits high-end oscilloscopes, protocol analyzers, and BERT (bit-error-rate tester) platforms because the 12.5 Gbps transceivers interface directly to high-speed probes, ATX backplanes, and DUT serial links. The 900K LE fabric implements complex trigger engines, real-time protocol decoders (PCIe Gen3, USB 3.1, SATA), and on-screen-display rendering pipelines. The 1,518 DSP blocks accelerate FFT-based spectrum views, jitter decomposition, and equalization tap computation in real time at sample rates up to 50 Gsps aggregate. The 624 user I/O pins drive high-density probe connectors and high-bandwidth memory channels for deep acquisition memory, while PCIe Gen3 x8 links the FPGA to host CPUs for control and visualization. Industrial temperature grade supports lab and field-deployment test equipment. The 1932-FCBGA F45 package's exposed-die lid supports the high thermal envelope required for sustained full-fabric utilization in dense multi-channel instruments.
Recommended
Industrial Machine Vision and High-Performance Computing
The 10AX090S2F45I1SG fits industrial machine vision and edge-computing applications because 1,518 DSP blocks and 900K LEs deliver multi-stream image preprocessing, deep-learning inference acceleration, and frame-by-frame decision logic in factory-automation lines. High-speed transceivers connect to GigE Vision, CoaXPress 2.0, and Camera Link HS camera links without external PHYs, simplifying cable-management in high-channel-count inspection systems. The 624 user I/O pins drive encoder inputs, lighting strobe triggers, and rejection actuators in real time. DDR4 controllers sustain high-bandwidth image buffers at multi-megapixel resolutions, while PCIe Gen3 x8 interfaces to industrial PCs and GPU coprocessors for downstream analytics. Industrial temperature grading and RoHS compliance simplify certification for factory-floor deployment under harsh ambient conditions. The exposed-die lid of the F45 package supports dense multi-camera systems in space-constrained machine-vision enclosures.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090S2F45I1SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090S2F45E2SG | 10AX090S2F45E2LG | 10AX090S2F45E1SG | 10AX090S1F45I1SG | 10AX090S1F45E1SG | 10AX090N2F45I1SG |
|---|---|---|---|---|---|---|---|
| Package | 1932-FCBGA (F45) | 1932-FCBGA (F45) | 1932-FCBGA (F45) | 1932-FCBGA (F45) | 1932-FCBGA (F45) | 1932-FCBGA (F45) | 1932-FCBGA (F45) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | 2 | 2 | 2 | 1 | 1 | 1 | 2 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Family Variant | GX (12.5 Gbps transceivers) | GX | GX | GX | GX | GX | GT (enhanced transceivers) |
| DSP Blocks | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 |
| User I/O | 624 | 624 | 624 | 624 | 624 | 624 | 624 |
Key Differentiators
- Highest-density drop-in option with the same 1932-FCBGA F45 footprint as every same-family variant (vs 10AX090S2F45E2SG)
- Industrial temperature at speed grade 2 balances timing margin and operating envelope (vs 10AX090S1F45I1SG)
- GX variant with 12.5 Gbps transceivers covers mainstream protocol bandwidth (vs 10AX090N2F45I1SG)
Design Notes
The 1932-FCBGA F45 package dissipates up to approximately 45W at full Arria 10 GX fabric utilization. Attach a high-performance thermal interface material (TIM, e.g., 3 W/m-K rated indium or graphite) between the exposed-die lid and a heatsink with at least 0.5 m/s airflow. Without adequate cooling, the FPGA will throttle after extended DSP-heavy workloads, reducing effective throughput and risking long-term reliability. Use the Intel PowerPlay Early Power Estimator before PCB layout to size the heatsink correctly.
Design an 8-layer or 10-layer PCB stack-up with controlled impedance (100 ohm differential) for 12.5 Gbps transceiver channels and 50 ohm single-ended for general-purpose I/O. Reference-plane stitching vias must be placed every lambda/10 along high-speed serial routes to suppress parallel-plate resonances. Use microvia-in-pad technology for the BGA breakout to maintain signal integrity at 12.5 Gbps and below; ensure the PCB vendor supports via-in-pad with copper-filled, plated-over, and planarized structures.
The 10AX090S2F45I1SG requires multiple voltage rails: VCC (core ~0.9V), VCCPT (transceiver PLL), VCCAUX (auxiliary), VCCIO (I/O banks, voltage depends on standard), and VCCR/VCTT (transceiver TX/RX). Use a multi-phase buck regulator for VCC with inductor ripple below 5 percent; place decoupling capacitors (a mix of 1 uF, 100 nF, and 10 nF) within 200 mils of every power pin. Power sequencing must follow the Arria 10 datasheet guidelines - typically VCCIO and VCCAUX first, then VCC, then VCCR/VCTT to avoid latch-up or inrush damage.
Transceiver channels rated to 12.5 Gbps require pre-emphasis and equalization on both transmitter and receiver. Use the Arria 10 Transceiver Toolkit in Quartus Prime to characterize each channel's eye diagram with a BERT; target eye height >100 mV and eye width >0.6 UI for reliable 12.5 Gbps operation. For multi-gigabit LVDS pairs (LVDS SERDES in I/O banks), enforce 100 ohm differential impedance and keep skew between the P and N traces below 5 mil across the entire length.
Common pitfalls include (1) omitting JTAG pull-ups, leading to chain connectivity failures, (2) selecting a heatsink that does not make firm contact with the exposed-die lid, resulting in thermal throttling, (3) failing to ground unused transceiver channels per the datasheet, which can cause unwanted emissions and backplane noise, (4) using non-volatile configuration modes without a valid configuration file on flash, locking the FPGA in a reset state. Read the Arria 10 Pin Connection Guidelines and Errata sheets before tape-out to avoid known issues.
Compliance Information
RoHS and lead-free compliance per Intel Altera product page. AEC-Q100 is not applicable - FPGAs in this density are not typically qualified for automotive safety-critical use, although Arria 10 has automotive variants in lower densities.
