10AX090S2F45E2SG - Arria 10 GX FPGA 900K LE | Intel FPGA
부품 번호: 10AX090S2F45E2SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2750 | $27,500.00 |
| 100 | $2520 | $252,000.00 |
| 500 | $2280 | $1,140,000.00 |
| 1,000 | $2050 | $2,050,000.00 |
10AX090S2F45E2SG 개요
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnects, and dedicated hard IP blocks such as transceivers, DSP slices, and memory controllers. FPGAs belong to the broader programmable logic device family, sitting alongside CPLDs in the hierarchy of configurable semiconductor devices used for digital logic implementation, hardware acceleration, and rapid prototyping without the cost of an ASIC.
Key features of the 10AX090S2F45E2SG include integrated transceivers capable of multi-gigabit serial connectivity, variable-precision DSP blocks, and hard memory controllers supporting DDR4 and DDR3 external memory interfaces. The -2 speed grade is the mid-power/temperature option (commercial/extended industrial), positioned between the faster -3 and slower -1 grades. The 1932-ball FCBGA package exposes high-bandwidth I/O while managing thermal dissipation through a large exposed-die substrate.
The Arria 10 architecture integrates a hardened ARM-based processor system option in the SoC variants, but the AX (non-SoC) variant here is a pure FPGA fabric device. It uses a 20nm process node, delivering a strong performance-per-watt ratio compared with prior 28nm Arria V / Stratix V families. High-speed serial transceivers and PCI Express Gen3 hard IP make the part well-suited for mid-range wireline and wireless infrastructure.
Typical applications include wireless baseband processing, radar signal processing, test and measurement equipment, broadcast video infrastructure, and PCI Express Gen3 endpoint cards. The wide transceiver bandwidth also supports 10G/40G Ethernet, OTN, and CPRI fronthaul links in telecom systems.
When designing with this device, ensure the PCB has a sufficient copper pour and via array under the FCBGA to manage the multi-watt thermal envelope. Designers should also verify Quartus Prime software support for the specific -2 speed grade and pin-out before tape-out. The high ball count requires multi-layer PCB stack-up and high-density interconnect (HDI) fabrication.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Engineers evaluating Arria 10 GX migration paths will find the comparison table and cross-references especially valuable for supply-chain risk mitigation.
드롭인 대체품: 10AX090S2F45E2SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX090S2F45E2SG (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, DSP Blocks, Process Node, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX090S2F45E2LG
✅ 드롭인✓ 재고 있음
$3750 / 개
데이터시트 보기 →10AX090S2F45E1SG
✅ 드롭인✓ 재고 있음
$4890 / 개
데이터시트 보기 →10AX090S1F45E1SG
✅ 드롭인✓ 재고 있음
$8200 / 개
데이터시트 보기 →10AX090S1F45I1SG
✅ 드롭인✓ 재고 있음
$3890 / 개
데이터시트 보기 →10AX090S2F45E2SG 최대 정격 & 전기적 특성
| Series | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| User I/O Count | 624 |
| Speed Grade | -2 (mid) |
| Package Type | 1932-BBGA, FCBGA |
| 동작 온도 | -40C to +100C (E2 = extended) |
| Process Node | 20nm TSMC |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| Family | Arria 10 |
| Device Variant | GX (transceiver-equipped) |
| Ball Count | 1932 |
10AX090S2F45E2SG 1932-bbga, fcbga 핀 구성 가이드
10AX090S2F45E2SG(1932-bbga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX090S2F45E2SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX090S2F45E2SG 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Radar Signal Processing, Test and Measurement Equipment, Broadcast Video Infrastructure, PCI Express Gen3 Endpoint Card, OTN/CPRI Fronthaul Telecom.
Wireless Baseband Processing
The 10AX090S2F45E2SG is well suited for wireless baseband processing in 4G LTE and 5G NR small-cell base stations. With 900,000 logic elements and 7.2 Mbytes of embedded M20K memory, the device can hold working channel-state information matrices and FFT/IFFT scratch buffers for multi-antenna (MIMO) processing. The integrated multi-gigabit transceivers deliver CPRI fronthaul and JESD204B antenna interfaces at line rates up to 12.5 Gbps per channel, eliminating external SERDES ICs. Compared with a CPU/DSP solution, the FPGA delivers deterministic latency under 1 microsecond for HARQ and beamforming loops, critical for closed-loop wireless control. Pair this FPGA with an Intel Stratix 10 companion for centralized baseband if higher density is needed.
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Radar Signal Processing
The 10AX090S2F45E2SG is a strong fit for phased-array radar signal processing in defense and weather-radar systems. Its variable-precision DSP blocks implement pulse-Doppler FFTs, MTI filters, and CFAR detectors directly in fabric, sustaining multi-gigasample throughput per second. The 20nm process and 1932-FCBGA package provide the thermal headroom for sustained DSP loads typical of radar processing. The high I/O count (624) supports multi-channel ADC interfaces via JESD204B/C sub-class-1 links at 12.5 Gbps, reducing board complexity. Compared with discrete DSP clusters, the FPGA delivers deterministic latency with deterministic sample alignment, essential for synthetic-aperture radar and SAR imaging. Use the part's on-die M20K blocks as FFT window-storage and overlap-save buffers.
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Test and Measurement Equipment
The 10AX090S2F45E2SG supports high-end oscilloscope, logic-analyzer, and protocol-analyzer front-end processing. Its 900K logic elements can implement multi-channel protocol decoders (PCIe Gen3, USB 3.1, SATA III, 100GbE) with on-die statistics aggregation. The hard PCI Express Gen3 IP block enables direct host-attached form factors, while the multi-gigabit transceivers interface with high-speed ADCs and DACs commonly used in automated test equipment (ATE). The -2 speed grade delivers the Fmax margin needed for 400 MHz state machines with timing closure across industrial temperature ranges. Compared with ASIC ATE controllers, the FPGA offers reconfigurability for new protocols without respin.
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Broadcast Video Infrastructure
The 10AX090S2F45E2SG serves in broadcast video routers, contribution encoders, and IP-based playout systems. The FPGA's high transceiver count enables SDI-over-IP (SMPTE 2110) and 12G-SDI multi-stream aggregation at 12 Gbps per channel. The 59 Mbit embedded memory holds reference frames for motion-adaptive deinterlacing and scaling engines used in up/down/cross-converters. The -2 speed grade balances fabric performance against thermal envelopes for 1U rack-mountable chassis. Compared with ASSP video processors, this FPGA allows custom codec and watermarking IP integration. Pair with an Intel Cyclone 10 GX for low-cost edge I/O processing if needed.
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PCI Express Gen3 Endpoint Card
The 10AX090S2F45E2SG accelerates host-attached workloads such as NVMe controller offload, machine-learning inference, and high-frequency trading. Its hard PCI Express Gen3 x8 IP block provides 8 Gbps lane bandwidth with DMA engines, while the remaining FPGA fabric implements custom acceleration pipelines. The 7.2 Mbyte M20K memory on-chip eliminates off-chip DRAM round-trips for small ML models or trade-book state machines. The 1932-FCBGA package provides the signal-integrity margin required for PCIe Gen3 signaling compliance. Compared with general-purpose GPUs, this FPGA delivers deterministic microsecond-level latency for HFT workloads. Pair with DDR4 ECC memory on the same board for high-throughput data ingest.
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OTN/CPRI Fronthaul Telecom
The 10AX090S2F45E2SG is well matched to OTN (Optical Transport Network) cross-connects and CPRI fronthaul aggregation in telecom central-office equipment. The FPGA's transceivers support OTU2/OTU4 line rates up to 11.18 Gbps and 9.8 Gbps CPRI with multi-channel aggregation. The high logic density implements forward-error-correction (FEC) codecs such as Reed-Solomon and LDPC at line rate. The 624 user I/Os expose multiple QSFP28/SFP28 cage interfaces for 25G/10G line cards. The -2 speed grade sustains FEC processing at OTU4 line rates without dropping cells. Compared with merchant OTN ASSPs, the FPGA allows custom mapping and OAM (Operations, Administration, Maintenance) extensions.
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추천 제품 요약
엔지니어링 참조 데이터: 10AX090S2F45E2SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX090S2F45E2LG | 10AX090S2F45E1SG | 10AX090S1F45E1SG | 10AX090S1F45I1SG | 10AS066K3F35I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-FCBGA (F45) | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1152-FCBGA (F35) - different |
| Speed Grade | -2 (mid) | -2 | -1 | -1 | -1 | -3 (Arria 10 SoC) |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 660,000 |
| Embedded Memory (Mbits) | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 44.0 Mbit |
| Operating Temperature | Extended (E2) | Extended (E2) | Extended (E2) | Extended (E2) | Industrial (I1) | Industrial (I2) |
| Solder Ball Finish | Gold (G) | Matte tin (L) | Gold (G) | Gold (G) | Gold (G) | Gold (G) |
주요 차별점
- Lead-free solder ball finish alternative available with identical silicon (vs 10AX090S2F45E2LG)
- Lower-power -1 speed grade available for thermal-constrained designs (vs 10AX090S2F45E1SG)
- 900K LE density within Arria 10 GX positions this part for mid-range infrastructure (vs 10AX090N3F40E2LG)
설계 노트
Estimated: A 900K-LE Arria 10 GX in -2 speed grade can dissipate 8-15 W at full utilization depending on toggle rate. With the 1932-FCBGA package (theta-JA approximately 4-6 C/W in still air), the junction temperature may rise 60-90 C above ambient. Design a 4-layer PCB with a copper pour area of at least 8 square inches under the package and use thermal vias (0.3 mm pitch, filled) to dissipate heat to inner layers. Without adequate cooling, sustained utilization above 70% risks thermal shutdown in sealed enclosures.
The 1932-ball FCBGA requires high-density interconnect (HDI) PCB fabrication with microvia stack-ups. Use 1.0 mm or 0.8 mm pitch BGA escape routing with sequential lamination. Match trace impedance to 50 ohms single-ended / 90 ohms differential for high-speed transceiver channels. Reference the Altera AN 528 (PCB layout guidelines for Arria 10) for via and stack-up recommendations; failure to follow these can degrade signal-integrity at multi-gigabit rates.
Decoupling the Arria 10 GX requires a hierarchical capacitor network: bulk 22 uF polymer capacitors near the power pins, 4.7 uF ceramic at the IC edge, 0.1 uF X7R close to each power pin, and 0.01 uF/0.001 uF high-frequency bypass on the package underside. Estimated: at least 60-80 capacitors are required for full FPGA supply stability. Group PLL power pins with star-routing back to a low-noise LDO; the transceiver PLLs are particularly sensitive to supply noise above 1 MHz.
Do not mix -1, -2, and -3 speed grades on the same I/O bank if your design uses source-synchronous interfaces - timing skew differs between grades. Also ensure the configuration scheme (AS x4, JTAG, or passive parallel) is selected before PCB layout, as MODE pins are shared with user I/O. Estimated: Approximately 5% of Arria 10 designs have configuration-pin conflicts that require re-spinning the PCB.
규정 준수 정보
RoHS compliance confirmed via Altera/Intel product page. Lead-free solder ball finish variants available (LG suffix). Not AEC-Q100 qualified - FPGAs of this class typically used in industrial/telecom not automotive under-hood applications.