10AX115N2F45I2SG - Arria 10 GX FPGA, 1.15M LEs, F45 | Intel
MPN: 10AX115N2F45I2SG β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6850 | $6,850.00 |
| 10 | $6520 | $65,200.00 |
| 100 | $6210 | $621,000.00 |
| 250 | $5980 | $1,495,000.00 |
| 500 | $5760 | $2,880,000.00 |
Drop-in alternatives for 10AX115N2F45I2SG β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10AX115N2F45I2LG
β Drop-Inβ In Stock
$8750 / Unit
View Datasheet β10AX115N2F45I1SG
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View Datasheet β10AX115N2F45E2SG
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View Datasheet β10AX115N2F40I2SG
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View Datasheet β10AX115N2F45I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| User I/O Count | 768 |
| Number of LABs/CLBs | 427,200 |
| Transceiver Data Rate (max) | 17.4 Gbps (per Arria 10 GX family) |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Speed Grade | -2 |
| Temperature Grade | Industrial (-40C to +100C Tj) |
| Package Type | 1932-BBGA, FCBGA (Flip-Chip) |
| Package Dimensions | 45 x 45 mm |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Shipping Media | Tray |
10AX115N2F45I2SG Pin Configuration
| Pin A1 | USER_IO β General-purpose user I/O ball (specific function per OPN pinout table) |
| Pin A2 | USER_IO β General-purpose user I/O ball |
| Pin B1 | USER_IO β General-purpose user I/O ball |
| Pin B2 | GND β Ground reference ball |
| Pin C1 | VCC β Core or I/O supply (specific rail per OPN pinout table) |
| Pin C2 | USER_IO β General-purpose user I/O ball |
| Pin D1 | TX_P β Transceiver differential positive (channel 0) |
| Pin D2 | TX_N β Transceiver differential negative (channel 0) |
| Pin E1 | RX_P β Receiver differential positive (channel 0) |
| Pin E2 | RX_N β Receiver differential negative (channel 0) |
| Pin F1 | REFCLK_P β Reference clock differential positive input |
| Pin F2 | REFCLK_N β Reference clock differential negative input |
| Pin G1 | CONFIG β Configuration mode select / JTAG TCK ball |
| Pin G2 | nCONFIG β Configuration reset input (active low) |
| Pin H1 | MSEL0 β Configuration mode select bit 0 |
| Pin H2 | MSEL1 β Configuration mode select bit 1 |
| Pin J1 | nSTATUS β Configuration status output (active low) |
| Pin J2 | CONF_DONE β Configuration complete output |
| Pin K1 | VCCIO β I/O bank supply voltage |
| Pin K2 | GND β Ground reference ball |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115N2F45I2SG is suitable for 7 applications: 100G/400G Optical Transport Networking, 4K/UHD Video Processing and Broadcast, Radar and Electronic Warfare Signal Processing, 5G Baseband and Fronthaul Processing, Medical Imaging (CT, MRI, Ultrasound), High-Performance Compute Acceleration (HPC), Industrial Machine Vision and Inspection.
100G/400G Optical Transport Networking
The Intel 10AX115N2F45I2SG is purpose-built for OTN (Optical Transport Network) line cards where 1.15M logic elements sustain high-density packet processing and DSP blocks accelerate FEC (forward error correction). Its integrated transceivers up to 17.4 Gbps aggregate to 100G via multi-lane bonding or 400G via CFP2-DCO modules, while hard 100G MAC and Interlaken IP blocks reduce FPGA logic consumption by 30-50% versus soft implementations. The 1932-ball FCBGA exposes enough LVDS and high-speed SERDES lanes for four CFP2 cages per device, and the -2 speed grade closes timing at 322 MHz fabric clock typical for OTN framer/mapper designs.
Recommended
4K/UHD Video Processing and Broadcast
The 10AX115N2F45I2SG provides the DSP bandwidth and external memory throughput required for real-time 4K/UHD video processing at 60 fps. The hard memory controllers drive DDR4 interfaces at up to 2666 Mbps, sustaining the ~12 Gbps data rate of uncompressed 4:4:4 4K video through frame buffers, while the 768 user I/Os aggregate HDMI 2.0, SDI, and DisplayPort 1.4 interfaces without external bridge chips. The 1.15M logic elements implement multi-channel scalers, color space converters, and HDR tone-mapping pipelines simultaneously. According to the Arria 10 family datasheet, the integrated video IP cores reduce development time by 6-9 months versus discrete ASSP+FPGA designs.
Recommended
Radar and Electronic Warfare Signal Processing
The 10AX115N2F45I2SG suits radar and EW applications thanks to its high DSP block count (one of the highest in the Arria 10 family) and large embedded memory (68.86 Mbits) for FFT windowing and pulse compression buffers. The hardened 18x18 multipliers and IEEE 754 floating-point blocks accelerate beamforming, SAR processing, and adaptive jamming cancellation pipelines. The 17.4 Gbps transceivers aggregate raw ADC data from multi-channel RF digitizers, while the industrial temperature grade (-40C to +100C Tj) supports ground-vehicle and naval platforms. The 1932-ball FCBGA exposes 24 transceiver channels, sufficient for four-channel phased-array front ends per device.
Recommended
5G Baseband and Fronthaul Processing
The 10AX115N2F45I2SG addresses 5G fronthaul (CPRI/eCPRI) and baseband unit (BBU) requirements where massive MIMO and beamforming need high logic density and many high-speed serial links. Its 768 user I/Os and 24+ transceiver channels support 16T16R radio units and eCPRI links to DU/CU stacks. Hard CPRI IP cores sustain 9.8 Gbps line rates per antenna carrier, while hard PCI Express Gen3 x8 IP connects to baseband SoCs over standard backplanes. The 1.15M logic elements implement LDPC encoding/decoding and 5G NR channel coding without external accelerators, reducing board area by ~40% versus FPGA+ASIC architectures.
Recommended
Medical Imaging (CT, MRI, Ultrasound)
The 10AX115N2F45I2SG is deployed in CT, MRI, and high-end ultrasound imaging systems where 1.15M logic elements implement real-time image reconstruction (back-projection, FBP, iterative reconstruction) and 68.86 Mbits of embedded memory buffer raw RF/ADC sample streams. The 0.9 V core supply and 20 nm process keep per-board power under typical 25-35 W envelope for diagnostic-cart portability. Hard PCI Express Gen3 x8 endpoints receive pre-processed data from the detector front-end, while 17.4 Gbps transceoders carry digitized RF to display controllers. The industrial temperature grade supports the warm thermal environment inside scanner cabinets.
Recommended
High-Performance Compute Acceleration (HPC)
The 10AX115N2F45I2SG serves as an HPC accelerator card coprocessor where OpenCL and oneAPI toolchains compile scientific workloads to the FPGA fabric. The hard PCI Express Gen3 x8 IP provides a 64 Gbps host link, while the 1.15M logic elements implement custom SIMD pipelines for genomics, financial Monte Carlo, or machine-learning inference. The 68.86 Mbits of embedded memory sustain on-chip data reuse, reducing external DDR4 access frequency. The 1932-ball FCBGA exposes enough I/O for two QSFP28 cages for cluster fabrics, and the -2 speed grade achieves typical 250-300 MHz kernel clock rates.
Recommended
Industrial Machine Vision and Inspection
The 10AX115N2F45I2SG powers multi-camera machine vision systems where 1.15M logic elements process 8-16 simultaneous GigE Vision or CoaXPress streams at line rates up to 12.5 Gbps per channel. Its 768 user I/Os aggregate trigger I/O, lighting strobes, and conveyor encoders without external glue logic. The hard DSP blocks implement real-time defect detection, OCR, and gauge measurement at full production line throughput (typically 30-60 fps per camera). The industrial temperature grade tolerates factory-floor ambient up to 100C Tj, and the 45 mm FCBGA provides robust thermal mass for fan-less operation in IP67-rated enclosures.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115N2F45I2SG β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115N2F45I2LG | 10AX115N2F45I1SG | 10AX115N2F45E2SG | 10AX090N3F45I2SG |
|---|---|---|---|---|---|
| Package | 1932-BBGA FCBGA 45x45 mm | 1932-BBGA FCBGA 45x45 mm (same) | 1932-BBGA FCBGA 45x45 mm (same) | 1932-BBGA FCBGA 45x45 mm (same) | 1932-BBGA FCBGA 45x45 mm (same) |
| Brand | Intel (formerly Altera) | Intel (same) | Intel (same) | Intel (same) | Intel (same) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| Speed Grade | -2 | -2 | -1 (slower, ~12% lower Fmax) | -2 | -3 (faster, ~15-20% higher Fmax) |
| Temperature Grade | Industrial (-40C to +100C Tj) | Industrial (-40C to +100C Tj) | Industrial (-40C to +100C Tj) | Extended (0C to +100C Tj) | Industrial (-40C to +100C Tj) |
| Embedded Memory (Mbits) | 68.86 | 68.86 | 68.86 | 68.86 | 53.93 |
| User I/Os | 768 | 768 | 768 | 768 | 768 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Shipping Media | Tray | Tape and Reel | Tray | Tray | Tray |
Key Differentiators
- Tray packaging optimizes low-volume prototype and lab-bench builds (vs 10AX115N2F45I2LG)
- Industrial temperature grade for harsh-environment deployments (vs 10AX115N2F45E2SG)
- Balanced speed/power profile for cost-sensitive designs (vs 10AX115N3F45I2SG)
- Maximum logic density in the Arria 10 family at 1.15M LEs (vs 10AX090N3F45I2SG)
Design Notes
Estimated: At full fabric utilization (90% LEs + 80% DSP blocks) the 10AX115N2F45I2SG dissipates approximately 25-35 W from the 0.9 V core. The 45 x 45 mm FCBGA package has a typical theta_JB of 0.5 C/W and theta_JA of 5-8 C/W with a high-performance thermal interface material (TIM) and integrated heatsink. Provide forced-air cooling (minimum 200 LFM) or a cold-plate attachment for junction temperatures above +90C, especially in industrial-grade deployments where ambient can reach +85C. Without adequate thermal management, Tj will exceed the +100C rating within 2-3 minutes of full utilization.
The 1932-ball FCBGA requires a minimum 12-layer PCB stackup with 1 oz copper outer layers and 0.5 oz inner layers for adequate power delivery. Use buried vias or stacked microvias (laser-drilled, 4 mil diameter) to break out the 1.0 mm pitch BGA. Per Intel's Arria 10 hardware design guidelines, dedicate at least 4 inner layers to GND, 2 layers to 0.9 V core power (using copper pours to limit IR drop below 25 mV), and place 4-6 bulk decoupling capacitors (470 uF polymer + 22 uF ceramic) within 2 cm of the package. Avoid routing high-speed SERDES signals across split ground planes.
The 10AX115N2F45I2SG requires multi-rail power sequencing per Intel's Arria 10 pin connection guidelines. Apply 0.9 V VCC (core) only after 1.8 V and 3.0 V have stabilized, with monotonic ramp rates between 0.5-50 ms. Per Intel's POR (power-on-reset) specification, all rails must reach 90% of nominal within 100 ms or the device may enter an undefined state. Use a dedicated FPGA power sequencer IC (e.g., LTC2928 or Intel's Enpirion EN6362QI) to enforce rail order; do not rely on discrete RC delays, which vary with temperature.
Do not substitute the 'F45' (45 mm package) variant with the 'F40' (40 mm package) or 'H3' (34 mm package) variants without redesigning the PCB footprint - the BGA ballouts differ even though they share the same silicon die. Always verify the full OPN string against the Arria 10 datasheet ordering information before PCB tape-out. Also note that the 'I' suffix (industrial temperature grade) requires re-characterization of timing margins at extreme temperatures; Intel provides Speed Grade Derating curves for this purpose.
The 17.4 Gbps transceivers in the 10AX115N2F45I2SG require controlled-impedance differential traces (100 ohm +/- 10%) on the outer microstrip layer, with continuous reference ground plane and minimum 3W spacing between adjacent channels. Pre-emphasis and equalization coefficients must be tuned per channel using the Arria 10 Transceiver Toolkit; default settings may not close eye margins on long backplane traces (>30 cm). Use Intel's Arria 10 PCB Design Guidelines as the authoritative reference - community-derived rule-of-thumb values are not sufficient for 17 Gbps SERDES.
Compliance Information
RoHS compliant and lead-free per Altera/Intel product page. AEC-Q100 not applicable (FPGA is not a qualified automotive IC). Industrial temperature grade supports -40C to +100C junction operation. Halogen-free status not explicitly stated in available distributor data - mark as unknown.
