10AX115S2F45E2LG - Arria 10 GX FPGA 1150K LE, 624 I/O | Altera
부품 번호: 10AX115S2F45E2LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8500 | $8,500.00 |
| 10 | $8200 | $82,000.00 |
| 100 | $7800 | $780,000.00 |
| 250 | $7400 | $1,850,000.00 |
| 500 | $7100 | $3,550,000.00 |
10AX115S2F45E2LG 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that can be configured by the designer to implement custom digital circuits. Within the broader taxonomy, the Arria 10 family sits between the lower-power Cyclone series and the high-performance Stratix series, delivering an optimal balance of transceiver speed, logic density, and power efficiency for applications such as wireless baseband, broadcast video, and high-performance industrial imaging. The GX variant specifically integrates 28.05 Gbps-capable transceivers optimized for backplane and chip-to-chip serial links.
Key features include 1,150,000 logic elements (LEs), 68,857,600 embedded memory bits, dedicated DSP blocks for fixed- and floating-point arithmetic, up to 28.05 Gbps multi-gigabit transceivers, and hard PCIe Gen3 / Gen4 IP cores. The 1932-ball FCBGA package exposes 624 general-purpose I/Os plus high-speed serial lanes, supporting parallel memory interfaces (DDR4/QDRIV+) and external flash configuration. The industrial-grade speed grade (-2) and extended temperature screening (E2) make the part suitable for thermally and electrically demanding deployments.
The 20 nm SoC-style architecture integrates ARM-based hard processor system support alongside programmable fabric, simplifying mixed control-and-payload designs. Hard memory controllers, hardened floating-point DSP blocks, and partial reconfiguration support reduce power per operation while accelerating time-to-market for algorithmic workloads. The Arria 10 family is widely used in defense, test & measurement, and medical imaging where deterministic throughput matters.
Typical applications include 100G/400G optical transport, software-defined radio, high-frame-rate video processing, ASIC prototyping, and PCI Express acceleration cards. Designers also deploy it in radar, EW, and high-energy physics data acquisition. The wide transceiver count and large memory subsystem allow multiple high-bandwidth data paths to coexist without external bridging.
When designing with this device, follow Intel's power-thermal-PCB guidance for FCBGA-1932 packages: provide a symmetrical via array under the package, multiple decoupling capacitors near each power rail, and use the Quartus Prime toolchain with the Arria 10 device family libraries for synthesis and timing closure. Plan configuration scheme (active serial, fast passive parallel) before board layout.
This page synthesizes distributor availability, real-time pricing, drop-in same-family alternatives, and practical design notes that go beyond the manufacturer datasheet summary, giving engineers a faster path from concept to qualified BOM.
드롭인 대체품: 10AX115S2F45E2LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX115S2F45E2LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Transceivers, Embedded Memory, DSP Blocks.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX115S2F45E1SG
✅ 드롭인✓ 재고 있음
$5650 / 개
데이터시트 보기 →10AX115S1F45I1SG
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →10AX115S1F45E1SG
✅ 드롭인✓ 재고 있음
$5850 / 개
데이터시트 보기 →10AX115N2F45E2SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3570 / 개
데이터시트 보기 →10AX115H2F34E2LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5950 / 개
데이터시트 보기 →10AX115S2F45E2LG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,600 bits |
| User I/O Count | 624 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| 패키지 | 1932-ball FCBGA |
| 실장 유형 | Surface Mount |
| Speed Grade | -2 (industrial) |
| Temperature Grade | E2 (extended) |
| Transceivers | Up to 28.05 Gbps (per family datasheet) |
| DSP Blocks | Hardened fixed/floating-point DSP blocks |
| Hard Memory Controllers | Yes (DDR4/QDRIV+ via soft IP) |
| PCIe Hard IP | PCIe Gen3/Gen4 capable |
| Configuration | Active Serial / Fast Passive Parallel |
| RoHS 상태 | Compliant |
10AX115S2F45E2LG 핀 구성
| 핀 1 | BALL A1 — Multi-function user I/O / power / GND (see Arria 10 GX family pinout file) |
| 핀 2 | BALL A2 — Multi-function user I/O / power / GND (see Arria 10 GX family pinout file) |
| 핀 3 | BALL A3 — Multi-function user I/O / power / GND (see Arria 10 GX family pinout file) |
| 핀 1932 | BALL (last) — Multi-function user I/O / power / GND (see Arria 10 GX family pinout file) |
일반적인 애플리케이션
10AX115S2F45E2LG 적합 용도: 6 애플리케이션s: 100G/400G Optical Transport, Software Defined Radio (SDR) Baseband, High Frame Rate Video Processing, ASIC Prototyping and Emulation, PCI Express Acceleration Card, Radar and Electronic Warfare.
100G/400G Optical Transport
The 10AX115S2F45E2LG fits 100G and 400G optical transport platforms because its 28.05 Gbps multi-gigabit transceivers and 1150K-LE fabric can process multiple lanes of 100G Ethernet, OTU4, or FlexE traffic simultaneously. The high transceiver count supports four 100G CFP/CFP2 links or sixteen 25G SFP28 channels without external muxing. Large embedded memory enables deep queueing for OTN framing and FEC processing on-chip, reducing external buffer cost and latency.
추천
Software Defined Radio (SDR) Baseband
The 10AX115S2F45E2LG fits SDR baseband processing because its hardened floating-point DSP blocks deliver deterministic throughput for FFT, channelization, and modulation/demodulation math. The 1,150,000 logic elements support multi-antenna MIMO processing, while the embedded 68 Mbit memory holds wide sample buffers and twiddle-factor tables on-chip. The extended temperature grade and FCBGA thermal mass make it suitable for outdoor or ruggedized radio enclosures used in defense and public-safety networks.
추천
High Frame Rate Video Processing
The 10AX115S2F45E2LG fits high frame-rate broadcast and pro-AV video pipelines because its 624 I/Os support multi-stream 12G-SDI or DisplayPort 1.4 ingest, while 68 Mbit of embedded memory enables line, frame, and chroma-format buffers without external SRAM. The fabric can host multiple parallel video processing pipelines (deinterlacing, scaling, color space conversion) concurrently. The 28.05 Gbps transceivers can also drive HDMI 2.1 / 8K transport links in production routers.
추천
ASIC Prototyping and Emulation
The 10AX115S2F45E2LG fits ASIC prototyping and emulation platforms because the 1,150,000-LE fabric can be partitioned into multiple ASIC clock domains and the hardened PCIe Gen3/Gen4 IP bridges to host CPU emulation engines. The 1932-ball FCBGA exposes enough high-speed transceivers and general-purpose I/Os to map large ASIC SoC pinouts for pre-silicon validation. Quartus Prime incremental compilation allows rapid bring-up of partitioned ASIC code, accelerating tape-out readiness for the target foundry node.
추천
PCI Express Acceleration Card
The 10AX115S2F45E2LG fits PCIe Gen3/Gen4 acceleration workloads because the hardened PCIe IP delivers up to 16 GT/s link bandwidth with low-latency DMA, and the 68 Mbit of embedded memory supports packet buffers and lookup tables on-chip. Designers can implement machine-learning inference, financial analytics, or storage compression accelerators with multiple parallel compute engines inside the fabric. The FCBGA package maintains signal integrity for the PCIe edge connector at full line rate.
추천
Radar and Electronic Warfare
The 10AX115S2F45E2LG fits radar and electronic-warfare signal processing because its hardened DSP blocks support pulse-Doppler, SAR, and digital beamforming math at deterministic throughput. The 28.05 Gbps transceivers accept raw ADC data from multiple antenna channels, while 68 Mbit of embedded memory holds range-Doppler maps and angle-of-arrival buffers. The extended temperature grade and high-reliability FCBGA packaging meet MIL-STD-810 vibration and thermal requirements for airborne and ground-mobile platforms.
추천
엔지니어링 참조 데이터: 10AX115S2F45E2LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX115S2F45E1SG | 10AX115S1F45I1SG | 10AX115S1F45E1SG | 10AX115N2F45E2SG | 10AX115H2F34E2LG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,600 bits | 68,857,600 bits | 68,857,600 bits | 68,857,600 bits | 68,857,600 bits | 68,857,600 bits |
| Speed Grade | -2 | -2 | -1 | -1 | -2 | -2 |
| Temperature Grade | E2 (extended) | E1 | I1 (industrial) | E1 | E2 | E2 |
| Transceiver Variant | GX (28.05 Gbps) | GX | GX | GX | No transceivers | High-speed variant |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
주요 차별점
- Extended temperature grade E2 in same 1932-ball FCBGA package (vs 10AX115S2F45E1SG)
- Higher speed grade -2 for tighter timing margin (vs 10AX115S1F45E1SG)
- Full GX transceiver complement (vs 10AX115N2F45E2SG)
설계 노트
Estimated: The Arria 10 GX 1150K-LE device in the 1932-ball FCBGA package can dissipate 25-35 W in a typical 28 Gbps transceiver-heavy workload. The FCBGA exposes a large thermal lid that should be bonded to a heatsink or cold plate using a high-conductivity thermal interface material (1-3 W/m-K minimum). Without active cooling, the junction temperature can rise above 100 C in still air. Always simulate worst-case Tj using Intel's Arria 10 PowerPlay early in the design cycle to size the cooling solution accurately.
The 1932-ball FCBGA at 1 mm pitch requires a high-layer-count PCB (typically 14-22 layers) with microvia escape patterns following Intel's BGA escape guidelines. Use via-in-pad with copper-filled and capped microvias on the top layers for transceiver and high-speed signal breakout. Provide a continuous GND reference plane under the BGA and stitch vias around the periphery to suppress simultaneous-switching-noise on the GPIO banks. A symmetrical via array beneath the thermal pad is essential for heat transfer to internal copper planes.
Multi-gigabit transceivers operating at 28.05 Gbps require controlled-impedance routing (typically 85 ohm differential for transceivers, 50 ohm single-ended for GPIO), length matching within tight skew tolerances (often sub-ps), and DC-blocking capacitors at the transceiver pins. Use Intel's Arria 10 Transceiver Signal Integrity Toolkit and follow the IBIS-AMI flow for channel simulation. Insertion loss budget should be verified with 3D EM extraction before tape-out to avoid post-layout re-spins.
Do not confuse the Arria 10 device variants: S = GX (transceivers), N = no transceivers, R = RX (fewer transceivers), H = high-speed variant. Mixing these parts on the same PCB footprint may result in pinout differences in the transceiver banks. Also note that the F45 package designation is unique to the 1932-ball outline; do not assume F34/F40/F45 packages are interchangeable. Always verify the device variant and package code from the full orderable part number against the device pinout file before committing to PCB fabrication.
규정 준수 정보
RoHS and lead-free per Altera/Intel product page. AEC-Q100 is not applicable to FPGAs in this family (industrial temperature grade only).