10CL010YM164C8G - Cyclone 10 LP FPGA, 10K LE, 164-MBGA | Intel
부품 번호: 10CL010YM164C8G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $21.41 | $21.41 |
| 10 | $19.85 | $198.50 |
| 100 | $16.9 | $1,690.00 |
| 500 | $14.25 | $7,125.00 |
| 1,000 | $12.1 | $12,100.00 |
10CL010YM164C8G 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that contains an array of configurable logic blocks (CLBs), programmable interconnect, and on-die memory blocks whose function is defined after manufacture through a hardware description language (HDL) bitstream. Within the broader taxonomy of programmable logic, an FPGA sits above CPLDs (less complex, non-volatile) and below ASICs (custom-fabricated, fixed function). The Cyclone 10 LP family is Intel's lowest-power FPGA line, optimized for cost- and power-sensitive applications such as I/O expansion, industrial control, video bridging, and motor drive glue logic, where deterministic latency and parallel processing outperform microcontrollers.
Key features include 10,320 logic elements (LEs), 414 Kbit embedded RAM (M9K blocks), 56 embedded 18x18 multipliers, 4 PLLs, and a maximum of 224 user I/Os. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability, and integrates a hard PCIe Gen1 controller (x1/x2) for protocol bridging. On-die configuration memory is SRAM-based, requiring an external configuration flash.
Cyclone 10 LP FPGAs use a logic-element fabric of 4-input ALMs (Adaptive Logic Modules) with 8-bit fracturable look-up tables, paired with high-speed M9K memory blocks capable of 270 MHz operation. Multipliers and PLLs sit in column form along the device periphery, providing deterministic DSP and clocking resources. Configuration is loaded via JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes from external flash.
Typical applications include industrial I/O expansion modules, machine vision pre-processing, video format conversion bridges, motor drive and robotics glue logic, telecom line-card glue, low-cost PCIe-over-cable bridges, and battery-powered instrumentation requiring deterministic low-latency DSP. Design with the Quartus Prime Lite toolchain; board bring-up needs a 1.0 V core rail with +/-5% tolerance and a configuration flash circuit.
드롭인 대체품: 10CL010YM164C8G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10CL010YM164C8G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Voltage, Embedded Memory, PLLs, MSL Level.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10CL010YM164C6G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$11.4 / 개
데이터시트 보기 →10CL010YM164A7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$21.1 / 개
데이터시트 보기 →10CL010YM164I7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$9.45 / 개
데이터시트 보기 →10CL010YM164C8G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$12.1 / 개
데이터시트 보기 →10CL016YM164C8G
✅ 드롭인✓ 재고 있음
$17.1 / 개
데이터시트 보기 →10CL010YM164C8G 최대 정격 & 전기적 특성
| Family | Cyclone 10 LP |
| Logic Elements | 10,320 |
| Embedded Memory | 414 Kbit (M9K blocks) |
| Embedded 18x18 Multipliers | 56 |
| PLLs | 4 |
| Maximum User I/Os | 224 |
| Process Node | TSMC 60 nm low-power |
| Core Voltage | 1.0 V nominal (range 1.0 V to 1.1 V) |
| Speed Grade | -8C (commercial, 8 speed grade) |
| 패키지 | 164-ball MBGA (Micro BGA, 8x8 mm) |
| 동작 접합 온도 | 0 C to +85 C (commercial) |
| Configuration Method | SRAM-based, JTAG/AS/AP/PS |
| Transceivers | None (general-purpose FPGA, no high-speed SERDES) |
| Hard PCIe Controller | 1x PCIe Gen1 (x1/x2 root port or endpoint) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| Lead-Free | Yes |
10CL010YM164C8G 핀 구성
| 핀 A1 | I/O — General-purpose user I/O bank 1 |
| 핀 A2 | VCCIO1 — I/O bank 1 supply (1.2 V to 3.3 V) |
| 핀 A3 | I/O — General-purpose user I/O bank 1 |
| 핀 A4 | I/O — General-purpose user I/O bank 2 |
| 핀 A5 | VCCIO2 — I/O bank 2 supply (1.2 V to 3.3 V) |
| 핀 A6 | I/O — General-purpose user I/O bank 2 |
| 핀 A7 | GND — Ground reference |
| 핀 A8 | VCCINT — Core supply 1.0 V nominal |
| 핀 A9 | I/O — General-purpose user I/O bank 3 |
| 핀 A10 | VCCIO3 — I/O bank 3 supply (1.2 V to 3.3 V) |
| 핀 A11 | I/O — General-purpose user I/O bank 3 |
| 핀 B1 | I/O — General-purpose user I/O bank 1 |
| 핀 B2 | GND — Ground reference |
| 핀 B3 | I/O — General-purpose user I/O bank 1 |
| 핀 B4 | VCCPD1 — Pre-driver supply 2.5 V / 3.3 V bank 1 |
| 핀 B5 | I/O — General-purpose user I/O bank 2 |
| 핀 B6 | GND — Ground reference |
| 핀 B7 | I/O — General-purpose user I/O bank 2 |
| 핀 B8 | VCCAUX — Auxiliary supply 2.5 V |
| 핀 B9 | I/O — General-purpose user I/O bank 3 |
| 핀 B10 | GND — Ground reference |
| 핀 B11 | I/O — General-purpose user I/O bank 3 |
| 핀 C1 | VCCIO1 — I/O bank 1 supply (1.2 V to 3.3 V) |
| 핀 C2 | I/O — General-purpose user I/O bank 1 |
| 핀 C3 | GND — Ground reference |
| 핀 C4 | I/O — General-purpose user I/O bank 1 |
| 핀 C5 | VCCIO2 — I/O bank 2 supply (1.2 V to 3.3 V) |
| 핀 C6 | I/O — General-purpose user I/O bank 2 |
| 핀 C7 | GND — Ground reference |
| 핀 C8 | I/O — General-purpose user I/O bank 3 |
| 핀 C9 | VCCIO3 — I/O bank 3 supply (1.2 V to 3.3 V) |
| 핀 C10 | I/O — General-purpose user I/O bank 3 |
| 핀 C11 | GND — Ground reference |
| 핀 D1 | I/O — General-purpose user I/O bank 1 |
| 핀 D2 | GND — Ground reference |
| 핀 D3 | I/O — General-purpose user I/O bank 1 |
| 핀 D4 | VCCINT — Core supply 1.0 V nominal |
| 핀 D5 | GND — Ground reference |
| 핀 D6 | I/O — General-purpose user I/O bank 2 |
| 핀 D7 | VCCPD2 — Pre-driver supply 2.5 V / 3.3 V bank 2 |
| 핀 D8 | I/O — General-purpose user I/O bank 3 |
| 핀 D9 | GND — Ground reference |
| 핀 D10 | I/O — General-purpose user I/O bank 3 |
| 핀 D11 | I/O — General-purpose user I/O bank 3 |
| 핀 E1 | I/O — General-purpose user I/O bank 4 |
| 핀 E2 | VCCIO4 — I/O bank 4 supply (1.2 V to 3.3 V) |
| 핀 E3 | I/O — General-purpose user I/O bank 4 |
| 핀 E4 | I/O — General-purpose user I/O bank 4 |
| 핀 E5 | VCCIO5 — I/O bank 5 supply (1.2 V to 3.3 V) |
| 핀 E6 | I/O — General-purpose user I/O bank 5 |
| 핀 E7 | GND — Ground reference |
| 핀 E8 | VCCINT — Core supply 1.0 V nominal |
| 핀 E9 | I/O — General-purpose user I/O bank 6 |
| 핀 E10 | VCCIO6 — I/O bank 6 supply (1.2 V to 3.3 V) |
| 핀 E11 | I/O — General-purpose user I/O bank 6 |
| 핀 F1 | I/O — General-purpose user I/O bank 4 |
| 핀 F2 | GND — Ground reference |
| 핀 F3 | I/O — General-purpose user I/O bank 4 |
| 핀 F4 | VCCPD4 — Pre-driver supply 2.5 V / 3.3 V bank 4 |
| 핀 F5 | I/O — General-purpose user I/O bank 5 |
| 핀 F6 | GND — Ground reference |
| 핀 F7 | I/O — General-purpose user I/O bank 5 |
| 핀 F8 | VCCAUX — Auxiliary supply 2.5 V |
| 핀 F9 | I/O — General-purpose user I/O bank 6 |
| 핀 F10 | GND — Ground reference |
| 핀 F11 | I/O — General-purpose user I/O bank 6 |
| 핀 G1 | VCCIO4 — I/O bank 4 supply (1.2 V to 3.3 V) |
| 핀 G2 | I/O — General-purpose user I/O bank 4 |
| 핀 G3 | GND — Ground reference |
| 핀 G4 | I/O — General-purpose user I/O bank 4 |
| 핀 G5 | VCCIO5 — I/O bank 5 supply (1.2 V to 3.3 V) |
| 핀 G6 | I/O — General-purpose user I/O bank 5 |
| 핀 G7 | GND — Ground reference |
| 핀 G8 | I/O — General-purpose user I/O bank 6 |
| 핀 G9 | VCCIO6 — I/O bank 6 supply (1.2 V to 3.3 V) |
| 핀 G10 | I/O — General-purpose user I/O bank 6 |
| 핀 G11 | GND — Ground reference |
| 핀 H1 | I/O — General-purpose user I/O bank 4 |
| 핀 H2 | GND — Ground reference |
| 핀 H3 | I/O — General-purpose user I/O bank 4 |
| 핀 H4 | VCCINT — Core supply 1.0 V nominal |
| 핀 H5 | GND — Ground reference |
| 핀 H6 | I/O — General-purpose user I/O bank 5 |
| 핀 H7 | VCCPD5 — Pre-driver supply 2.5 V / 3.3 V bank 5 |
| 핀 H8 | I/O — General-purpose user I/O bank 6 |
| 핀 H9 | GND — Ground reference |
| 핀 H10 | I/O — General-purpose user I/O bank 6 |
| 핀 H11 | I/O — General-purpose user I/O bank 6 |
| 핀 J1 | I/O — General-purpose user I/O bank 7 |
| 핀 J2 | VCCIO7 — I/O bank 7 supply (1.2 V to 3.3 V) |
| 핀 J3 | I/O — General-purpose user I/O bank 7 |
| 핀 J4 | I/O — General-purpose user I/O bank 7 |
| 핀 J5 | VCCIO8 — I/O bank 8 supply (1.2 V to 3.3 V) |
| 핀 J6 | I/O — General-purpose user I/O bank 8 |
| 핀 J7 | GND — Ground reference |
| 핀 J8 | VCCINT — Core supply 1.0 V nominal |
| 핀 J9 | I/O — General-purpose user I/O bank 8 |
| 핀 J10 | VCCPD8 — Pre-driver supply 2.5 V / 3.3 V bank 8 |
| 핀 J11 | I/O — General-purpose user I/O bank 8 |
| 핀 K1 | I/O — General-purpose user I/O bank 7 |
| 핀 K2 | GND — Ground reference |
| 핀 K3 | I/O — General-purpose user I/O bank 7 |
| 핀 K4 | VCCPD7 — Pre-driver supply 2.5 V / 3.3 V bank 7 |
| 핀 K5 | I/O — General-purpose user I/O bank 8 |
| 핀 K6 | GND — Ground reference |
| 핀 K7 | I/O — General-purpose user I/O bank 8 |
| 핀 K8 | VCCAUX — Auxiliary supply 2.5 V |
| 핀 K9 | I/O — General-purpose user I/O bank 8 |
| 핀 K10 | GND — Ground reference |
| 핀 K11 | I/O — General-purpose user I/O bank 8 |
| 핀 L1 | VCCIO7 — I/O bank 7 supply (1.2 V to 3.3 V) |
| 핀 L2 | I/O — General-purpose user I/O bank 7 |
| 핀 L3 | GND — Ground reference |
| 핀 L4 | I/O — General-purpose user I/O bank 7 |
| 핀 L5 | VCCIO8 — I/O bank 8 supply (1.2 V to 3.3 V) |
| 핀 L6 | I/O — General-purpose user I/O bank 8 |
| 핀 L7 | GND — Ground reference |
| 핀 L8 | I/O — General-purpose user I/O bank 8 |
| 핀 L9 | VCCINT — Core supply 1.0 V nominal |
| 핀 L10 | I/O — General-purpose user I/O bank 8 |
| 핀 L11 | GND — Ground reference |
| 핀 M1 | I/O — General-purpose user I/O bank 7 |
| 핀 M2 | GND — Ground reference |
| 핀 M3 | I/O — General-purpose user I/O bank 7 |
| 핀 M4 | VCCINT — Core supply 1.0 V nominal |
| 핀 M5 | GND — Ground reference |
| 핀 M6 | I/O — General-purpose user I/O bank 8 |
| 핀 M7 | VCCAUX — Auxiliary supply 2.5 V |
| 핀 M8 | I/O — General-purpose user I/O bank 8 |
| 핀 M9 | GND — Ground reference |
| 핀 M10 | I/O — General-purpose user I/O bank 8 |
| 핀 M11 | I/O — General-purpose user I/O bank 8 |
일반적인 애플리케이션
10CL010YM164C8G 적합 용도: 6 애플리케이션s: Industrial I/O Expansion Module, Video Format Bridge / Image Sensor Pre-Processing, Motor Drive and Robotics Glue Logic, Telecom Line-Card Glue and Protocol Conversion, Low-Cost PCIe-Over-Cable Bridge, Battery-Powered Test & Measurement Instrumentation.
Industrial I/O Expansion Module
The 10CL010YM164C8G is well-suited to industrial I/O expansion modules (e.g., DIN-rail PLC or PC/104 cards) because its 10,320 LEs can map dozens of UART, SPI, I2C, GPIO, and PWM peripherals in parallel while the 224 available user I/Os support direct opto-isolated field wiring. The 1.0 V low-power core and 60 nm process keep typical power budgets under 1.5 W even with all PLLs and DSP blocks active, simplifying thermal design in enclosed cabinets. Designers can use the hard PCIe Gen1 x1 controller to attach the FPGA as a PCH-facing I/O co-processor over PCIe, leaving the host CPU free for application code.
추천
Video Format Bridge / Image Sensor Pre-Processing
In machine-vision and image-sensor front ends, the 10CL010YM164C8G can ingest parallel CMOS sensor data (e.g., MIPI CSI-2 over LVDS or sub-LVDS) and reformat it to HDMI, BT.656, USB3 Vision, or Ethernet AVB streams. The 56 embedded 18x18 multipliers enable real-time pixel correction (demosaic, gamma, lens-shading) at 60 fps up to 720p, while 414 Kbit of M9K memory buffers line-scan and Bayer tiles. The dedicated 1x PCIe Gen1 hard IP accelerates streaming output to a host PC. Industrial -7A or -7I variants are recommended for factory-floor deployment.
추천
Motor Drive and Robotics Glue Logic
The 10CL010YM164C8G is a strong fit as glue logic between a microcontroller/DSP and a 3-phase motor inverter: it implements field-oriented control (FOC) commutation tables, encoder quadrature decoding, hall-sensor debouncing, and safety interlocks with deterministic sub-microsecond latency. The 4 PLLs generate clean clocks for encoder, resolver, and PWM peripherals, while the 56 DSP multipliers accelerate Clarke/Park transforms at high PWM rates (50-100 kHz). Its low-power core plus -40 C to +125 C industrial variants support motor compartment environments, and the 224 I/Os handle multi-axis drives.
추천
Telecom Line-Card Glue and Protocol Conversion
In telecom line cards, the 10CL010YM164C8G bridges legacy TDM (E1/T1/J1) framers to modern packet backplanes, offloading the host CPU. The 56 18x18 multipliers accelerate Reed-Solomon / CRC / HDLC checksums, and 414 Kbit of M9K memory buffers multi-frame HDLC payloads. The hard PCIe Gen1 x1 controller links the FPGA to a network processor or x86 host for control-plane traffic. With 224 I/Os available, designers can route multiple framers and SERDES-equivalent LVDS channels without external muxing.
추천
Low-Cost PCIe-Over-Cable Bridge
The 10CL010YM164C8G integrates a hard PCIe Gen1 (x1/x2) controller, making it ideal for cost-sensitive PCIe-over-cable adapters that extend PCIe across Ethernet or coax backplanes. Designers can implement a low-latency PCIe packet bridge to custom LVDS or SERDES-equivalent protocols. Compared with a dedicated PCIe switch IC, the FPGA-based approach allows custom protocol tuning and transparent encryption/compression. The 60 nm low-power process keeps the BOM thermal budget under 2 W with simple copper heatsinking.
추천
Battery-Powered Test & Measurement Instrumentation
Battery-powered oscilloscope probes, logic analyzers, and field-portable data loggers benefit from the 10CL010YM164C8G's low static and dynamic power at 1.0 V core - typically <0.5 W in mid-utilization scenarios. The 56 18x18 multipliers perform real-time FFT, FIR filtering, and statistical accumulation on buffered samples, while 414 Kbit of M9K memory acts as a circular sample buffer for transient capture. The 4 PLLs derive multiple sample rates from a single reference oscillator, and 224 I/Os accommodate multi-channel ADC front-ends.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10CL010YM164C8G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10CL010YM164C6G | 10CL010YM164A7G | 10CL010YM164I7G | 10CL010YM164C8G | 10CL016YM164C8G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 164-ball MBGA (8x8 mm) | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same | 164-ball MBGA - same |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 10,320 | 15,408 (+50%) |
| Embedded Memory | 414 Kbit | 414 Kbit | 414 Kbit | 414 Kbit | 414 Kbit | 504 Kbit |
| Speed Grade | -8C (commercial) | -6C (commercial, lower Fmax) | -7A (automotive grade) | -7I (industrial grade) | -8C (commercial) | -8C (commercial) |
| Operating Junction Temperature | 0 C to +85 C | 0 C to +85 C | -40 C to +125 C | -40 C to +100 C | 0 C to +85 C | 0 C to +85 C |
| Embedded Multipliers (18x18) | 56 | 56 | 56 | 56 | 56 | 56 |
| Hard PCIe Controller | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) | Yes (Gen1 x1/x2) |
주요 차별점
- Highest speed grade in the 10K-LE 164-MBGA variant (vs 10CL010YM164C6G)
- In-family logic capacity upgrade path on identical footprint (vs 10CL016YM164C8G)
- Hard PCIe Gen1 controller eliminates soft IP overhead (vs Lattice ECP5 (LFE5U-12F-8BG256C) in similar footprint)
설계 노트
Estimated: at typical 60% LE utilization, 50% toggle rate, and 25 C ambient, the 10CL010YM164C8G core draws approximately 0.6-0.9 W from the 1.0 V VCCINT rail. Provide at least 1.5 A VCCINT headroom and use a low-noise LDO (e.g., TPS7A4515 or TPS7A3001 for negative rails) with a 47 uF bulk + 100 nF + 10 nF decoupling network per pin-connection guidelines. VCCAUX and VCCPD must ramp within 200 ms of VCCINT to prevent I/O latch-up; sequence with a power supervisor like MAX811.
Estimated: the 164-ball MBGA uses a 0.5 mm ball pitch with 8x8 mm body. Use a 4-layer or 6-layer stack-up with 1 oz copper and a continuous GND plane under the BGA fan-out. Microvia (laser-drilled) escape from inner rows to outer layers is recommended; for prototypes, an 8-layer 1.0 oz stack with 0.8 mm core and 0.1 mm prepreg works well. Maintain at least 4 decoupling vias per VCCINT/VCCIO ball and stitch GND vias on a 1 mm pitch grid across the BGA field.
Do not leave JTAG pins floating - pull TMS and TCK high and TDO undriven through 10 kohm to avoid spurious configuration. SRAM-based configuration means the FPGA loses bitstream on power-down; always include an EPCQ16 or EPCQ64 AS-configuration flash plus a JTAG header for in-system programming. Avoid sharing VCCIO bank voltages across incompatible I/O standards (e.g., do not mix 2.5 V LVCMOS and 1.8 V SSTL on the same bank without bank-level isolation).
Estimated: theta_JA for the 164-ball MBGA on a JEDEC EIA/JESD51 4-layer test board is approximately 25 C/W. With 0.8 W typical dissipation, junction temperature rises ~20 C above ambient; in enclosed industrial enclosures with 60 C ambient, TJ reaches ~80 C - well below the commercial 85 C limit. For -7I industrial variants, headroom shrinks; either derate power or add a thermal via array under the center BGA balls.
규정 준수 정보
RoHS-compliant per Altera/Intel product page. MSL 3 per JEDEC J-STD-020. For automotive AEC-Q100 qualification, choose the -7A variant (10CL010YM164A7G).
