10CX085YF672E6G - Cyclone 10 GX FPGA, 85K LE, 672-BGA | Intel
부품 번호: 10CX085YF672E6G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $382.5 | $3,825.00 |
| 100 | $340 | $34,000.00 |
| 250 | $306 | $76,500.00 |
| 500 | $280.5 | $140,250.00 |
10CX085YF672E6G 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable I/O, all wired together by a programmable interconnect. FPGAs sit at the top of the programmable-logic hierarchy: FPGA -> programmable logic -> digital IC -> semiconductor. They are distinguished from CPLDs by their SRAM-based configuration, higher logic density, and on-chip hard IP such as transceivers and PLLs.
Key differentiating features of this Cyclone 10 GX device include 12.5 Gbps transceivers, hard PCIe Gen2/Gen3 IP blocks, support for external DDR3/DDR4 memory interfaces up to 1866 Mbps, and 31,000 adaptive logic modules (ALMs) - the 10nm-style adaptive logic module provides improved timing closure versus older Cyclone generations. The 5.68 Mbit embedded memory enables high-bandwidth on-chip buffering for video, packet, and DSP pipelines.
Architecturally, the Cyclone 10 GX family uses a TSMC 20nm process and integrates hardened PCIe and 10 GbE MAC IP, which reduces soft-logic utilization and frees fabric for application logic. The 672-ball FBGA package supports 192 user I/Os while the remaining balls are power/ground or transceiver/reference-clock, enabling dense board layouts for line-card and edge applications.
Typical applications include industrial machine vision, motor control and factory automation, broadcast video processing, low-cost PCIe Gen3 add-in cards, and wireless backhaul baseband preprocessing. The combination of transceivers, hard PCIe, and DSP blocks makes it well-matched to mid-range protocol-bridge and image-sensor aggregation designs.
Design tip: 10-series FPGAs require Intel Quartus Prime for synthesis, place-and-route, and bitstream generation. Pin-out, package thermal data, and transceiver channel mapping are documented in the device-specific pin connection guidelines; engineers migrating from Cyclone V must re-generate the pin assignments because the F672 BGA ball map is not pin-compatible across families.
This page synthesizes distributor pricing, drop-in same-package variants, and practical design notes not collected on the manufacturer product page.
드롭인 대체품: 10CX085YF672E6G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10CX085YF672E6G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Mounting Type, Logic Elements (LE).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10CX085YF672E5G
✅ 드롭인✓ 재고 있음
$289 / 개
데이터시트 보기 →10CX085YF672E6G 최대 정격 & 전기적 특성
| Family | Cyclone 10 GX |
| Logic Elements (LE) | 85,000 |
| Adaptive Logic Modules (ALM) | 31,000 |
| Embedded Memory | 5,959,680 bits (5.68 Mbit) |
| DSP Blocks | 216 |
| Maximum User I/O | 192 |
| 패키지 | 672-BGA (FBGA, F672) |
| Process Node | 20 nm |
| Core Voltage (Vcc) | 0.85 V to 0.95 V |
| 동작 온도 | 0 C to +100 C |
| Speed Grade | -6 (commercial, fast) |
| 실장 유형 | Surface Mount |
| Hard Memory Controllers | DDR3/DDR4 up to 1866 Mbps |
| Hard PCIe IP | PCIe Gen2 / Gen3 (hard IP) |
| Transceivers | Up to 12.5 Gbps |
| RoHS 상태 | Compliant |
10CX085YF672E6G 672-bga (fbga, f672) 핀 구성 가이드
10CX085YF672E6G(672-bga (fbga, f672) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10CX085YF672E6G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10CX085YF672E6G 적합 용도: 6 애플리케이션s: Industrial Machine Vision, PCIe Gen3 Add-in Cards, Motor Control and Factory Automation, Broadcast Video Processing, Wireless Backhaul Baseband Preprocessing, Protocol Bridge and Industrial IoT Gateway.
Industrial Machine Vision
The 10CX085YF672E6G fits industrial machine vision pipelines because it integrates 5.68 Mbit of embedded SRAM for line buffering, 216 DSP blocks for Bayer-to-YUV conversion and Sobel edge detection, and 12.5 Gbps transceivers for uncompressed CoaXPress or fiber output. Placed between a high-speed image sensor and a host processor, the Cyclone 10 GX handles pixel-rate preprocessing at sustained >300 MPixels/s while keeping the host CPU free for inspection logic. Designers benefit from hard PCIe Gen3 IP when bridging to an x86 vision controller, and from hardened DDR3/DDR4 controllers that interface to external frame buffers with ECC for factory-floor reliability.
추천
PCIe Gen3 Add-in Cards
The 10CX085YF672E6G's hardened PCIe Gen2/Gen3 controller makes it a natural fit for low-cost PCIe add-in cards, including protocol analyzers, NVMe accelerator bridges, and FPGA-based data-acquisition cards. Unlike soft PCIe IP that consumes fabric and routing resources, the hard IP block frees logic for user application while supporting x1/x2/x4 link widths at 8 GT/s. The 672-BGA F672 package supports the transceivers required for the PCIe lane plus auxiliary serial links, and Intel's Quartus Prime provides reference designs that shorten time-to-prototype.
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Motor Control and Factory Automation
The 10CX085YF672E6G supports multi-axis motor control by combining 216 DSP blocks for field-oriented control (FOC) math, deterministic ALM fabric for state machines, and fast transceivers for EtherCAT or SERCOS feedback networks. Operating across 0 to +100 C industrial temperature range, it handles encoder decoding, current-loop PI control, and PWM generation for 3-phase inverters on a single die. Compared with DSP+MCU solutions, the FPGA delivers deterministic latency and parallel execution, simplifying safe-torque-off and STO implementations for IEC 61800 functional safety architectures.
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Broadcast Video Processing
The 10CX085YF672E6G suits broadcast video processing such as quad-SDI multiviewers, HDR-to-SDR converters, and frame-rate conversion. Its 5.68 Mbit embedded memory accommodates line/field buffers for 3G-SDI processing, and 12.5 Gbps transceivers natively handle SDI rates up to 6 Gbps (UHD-1) without external reclockers. The 192 user I/Os expose GPIOs for front-panel control and I2C/SPI housekeeping, while hard PCIe provides a path to upstream software for closed-caption extraction or audio embedding.
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Wireless Backhaul Baseband Preprocessing
In small-cell and outdoor-unit wireless backhaul designs, the 10CX085YF672E6G pre-processes IQ samples between RF transceivers and a host baseband ASIC. The 216 DSP blocks run crest-factor reduction (CFR) and digital pre-distortion (DPD) at LTE/5G NR channel bandwidths, while 12.5 Gbps transceivers interface to common RF ADC/DAC parts like the AD9361 family. Compared with ASSP baseband chips, the FPGA offers reconfigurable modulation support and field-upgradable algorithms, which is valuable for evolving 5G NR features.
추천
Protocol Bridge and Industrial IoT Gateway
The 10CX085YF672E6G works as a multi-protocol industrial gateway, bridging PROFINET, EtherCAT, Modbus TCP, and OPC UA traffic on a single fabric. Its combination of ALM-based deterministic logic and hard Ethernet MAC blocks (via external PHY) supports real-time traffic shaping, while the DDR3/DDR4 controllers back large packet buffers. Industrial temperature grade (0 C to +100 C) and a long-life Intel roadmap make it appropriate for factory-floor gateways expected to run for 10+ years.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10CX085YF672E6G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10CX085YF672E5G | 10CL120YF780I7G |
|---|---|---|---|
| Package | 672-BGA (FBGA, F672) | 672-BGA (FBGA, F672) - same | 780-BGA (FBGA, F780) - different footprint |
| Brand | Intel | Intel | Intel |
| Logic Elements | 85,000 | 85,000 | 120,000 |
| Embedded Memory | 5,959,680 bits | 5,959,680 bits | 4,880,640 bits |
| DSP Blocks | 216 | 216 | 156 |
| Maximum User I/O | 192 | 192 | 277 |
| Process Node | 20 nm | 20 nm | 28 nm |
| Speed Grade | -6 | -5 | -7 |
| Operating Temperature | 0 C to +100 C | 0 C to +100 C | -40 C to +100 C (industrial) |
주요 차별점
- Highest density Cyclone 10 GX in F672 package with hard PCIe Gen3 (vs 10CL120YF780I7G)
- Bitstream- and pin-compatible with 10CX085YF672E5G (vs 10CX085YF672E5G)
- Higher DSP count than Cyclone V same-tier (vs 10CL120YF780I7G)
설계 노트
Cyclone 10 GX devices require multi-rail sequencing per the pin connection guidelines. VCC (core, 0.9V) must ramp before VCCPT (1.0V PLL), and VCCIO must be present before VCCR/VCCT (transceiver) for proper configuration. Use a sequencer IC such as the LTC2974 or follow Intel's recommended RC network. Estimated: at 100% toggle on 85K LE plus 6 transceivers, ICC core draws roughly 1.5 A; verify with PowerPlay early in design.
The 672-BGA F672 package has a theta_JA of approximately 12 C/W with a standard 4-layer JEDEC test board and adequate via array under the BGA. Estimated: at 3 W total dissipation, junction temperature rise is 36 C above ambient; in an enclosed industrial enclosure at 70 C ambient, this leaves 19 C margin to the 100 C Tjmax. Always simulate with a real PCB stack-up, not JEDEC defaults.
Place decoupling capacitors within 1 mm of every VCC/VCCPT ball, using 0402-size 0.1 uF X7R plus bulk 22 uF per voltage rail. Maintain a continuous reference ground plane under the entire BGA and stitch the ground balls to it with 0.3 mm vias. Transceiver balls require 50 ohm controlled-impedance routing with length matching within 0.127 mm for 12.5 Gbps operation; refer to Intel's transceiver layout guidelines.
Do not assume Cyclone V bitstreams work in Cyclone 10 GX - they are NOT pin-compatible and configuration bitstream formats differ. Re-generate pin assignments in Quartus Prime and recompile. Another common pitfall is omitting the CFGBVS pin strap (high for 3.3V config, low for 1.8V); wrong strap causes silent configuration failure with no easy debug log.
규정 준수 정보
RoHS and REACH compliance per Intel product page. Industrial temperature grade 0 C to +100 C. Not AEC-Q100 qualified - automotive use requires specific device qualification.
