10CX150YF672E6G - Cyclone 10 GX 150K LE FPGA, 672-FCBGA | Intel
부품 번호: 10CX150YF672E6G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $176.35 | $176.35 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152.8 | $15,280.00 |
| 500 | $138.2 | $69,100.00 |
| 1,000 | $124.9 | $124,900.00 |
10CX150YF672E6G 개요
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that combines programmable logic blocks, routing interconnect, and hardened IP blocks such as transceivers, DSP blocks, and memory controllers. FPGAs occupy a unique position in the semiconductor hierarchy: more flexible than an application-specific standard product (ASSP) yet more deterministic and parallel than a microprocessor. The Cyclone 10 GX family specifically sits at the intersection of low static power, integrated 12.5 Gbps transceivers, and hardened PCI Express Gen2 controllers - making it a mainstream workhorse for video, industrial, and wireline bridge designs.
Key features of the 10CX150YF672E6G include up to 12.5 Gbps multi-protocol transceivers, hard PCI Express Gen2 x4 IP blocks, hardened variable-precision DSP blocks supporting 18x18 multipliers and 27-bit pre-adder, and up to 10.9 Mbits of embedded SRAM distributed between M20K block memory and LUTRAM. The device is fabricated on Intel's 20 nm process, balancing leakage versus performance for thermally constrained enclosures. Per-bank programmable I/O banks support LVDS, LVCMOS, and memory interfaces up to DDR3.
Architecturally, the Cyclone 10 GX uses an Adaptive Logic Module (ALM) as its basic building block - each ALM contains an 8-input fracturable look-up table, two dedicated adders, and four registers. Combined with the Core fabric, Memory, and DSP blocks, the 10CX150 delivers approximately 150K logic elements with deterministic routing and timing closure supported by the Quartus Prime design suite.
Typical applications include industrial machine vision over CoaXPress or GigE Vision, broadcast video processing with 12G-SDI and DisplayPort bridging, low-cost 10G Ethernet aggregation switches, motor control and digital drive systems, and PCI Express Gen2 endpoint cards. The transceiver and hard PCIe IP blocks also suit radar/LiDAR front-end preprocessing and software-defined radio baseband.
When designing with this part, pay attention to the FCBGA 672-ball pitch and PCB stack-up. Use Intel's Cyclone 10 GX pin connection guidelines to assign unused I/O, enable internal weak pull-ups where required, and follow the High Speed Board Design Guidelines for the 12.5 Gbps transceiver channels. Plan a complete Quartus Prime-based power tree early - the device uses multiple supply rails (VCC, VCCPT, VCCR_GXB, VCCT_GXB) that must be sequenced.
This page synthesizes distributor pricing, drop-in package alternatives within the Cyclone 10 GX and Cyclone 10 LP families, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: 10CX150YF672E6G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10CX150YF672E6G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Embedded Memory, Logic Elements (LE).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10CX105YF672E6G
✅ 드롭인✓ 재고 있음
$100.547 / 개
데이터시트 보기 →10CX085YF672E6G
✅ 드롭인✓ 재고 있음
$280.5 / 개
데이터시트 보기 →10CX150YF672E5G
✅ 드롭인✓ 재고 있음
$295 / 개
데이터시트 보기 →10CX105YF672I6G
✅ 드롭인✓ 재고 있음
$338 / 개
데이터시트 보기 →10CX085YF672I6G
✅ 드롭인✓ 재고 있음
$255 / 개
데이터시트 보기 →10CX150YF672E6G 최대 정격 & 전기적 특성
| Family | Cyclone 10 GX |
| Logic Elements (LE) | 150,000 |
| Embedded Memory Bits | 10,907,648 (10.9 Mbit) |
| Embedded Multipliers (18x18) | 236 |
| 패키지 | 672-ball FCBGA |
| Speed Grade | -6 (Enhanced) |
| 동작 온도 | Industrial: -40C to +100C |
| Process Node | 20 nm |
| Transceivers | Up to 12.5 Gbps multi-protocol |
| Hard PCIe Gen2 Controller | Yes |
| DSP Block Type | Variable-precision, 27-bit pre-adder |
| 메모리 유형 | M20K block memory + LUTRAM |
| 실장 유형 | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes / Compliant |
| Tray Packaging | Yes (per Arrow listing) |
10CX150YF672E6G 672-ball fcbga 핀 구성 가이드
10CX150YF672E6G(672-ball fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10CX150YF672E6G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10CX150YF672E6G 적합 용도: 7 애플리케이션s: Industrial Machine Vision, Broadcast Video Processing, Low-Cost 10G Ethernet Aggregation, Motor Control and Digital Drive, PCI Express Endpoint Card, Radar and LiDAR Baseband Processing, Software-Defined Radio Baseband.
Industrial Machine Vision
The 10CX150YF672E6G's combination of 150K logic elements, 236 (18x18) multipliers, and up to 12.5 Gbps transceivers makes it ideal for industrial machine vision over CoaXPress, GigE Vision, or Camera Link HS interfaces. The hard PCIe Gen2 controller enables direct connection to a host PC without an external bridge chip. At 672-ball FCBGA the package supports multiple high-speed serial links plus parallel sensor LVDS lanes. Industrial temperature range (-40C to +100C) suits factory-floor enclosures. Compared to a software-driven GPU pipeline, this FPGA delivers deterministic latency and lower BOM cost for multi-camera aggregation.
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Broadcast Video Processing
For broadcast 12G-SDI, DisplayPort 1.2, and HDMI 2.0 bridging, the 10CX150YF672E6G provides enough logic to implement multi-channel video processing pipelines, color-space conversion, and frame-rate conversion in a single device. The variable-precision DSP blocks handle chroma resampling and scaling, while the M20K block memory (10.9 Mbit total) buffers active video frames. Transceivers support 12G-SDI at 11.88 Gbps directly. The industrial temperature grade suits studio and outside-broadcast equipment. Quartus Prime reference designs for video IP cores accelerate development.
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Low-Cost 10G Ethernet Aggregation
The 10CX150YF672E6G's 12.5 Gbps transceivers natively support 10GBASE-R and 1GBASE-R Ethernet without external PHY devices, making it a compact aggregator for industrial switches, network appliances, and 5G fronthaul equipment. The 150K LE budget supports L2/L3 forwarding, MAC learning, and basic traffic shaping. Hard PCIe Gen2 controllers enable line-rate connection to a CPU host. The 672-ball FCBGA package accommodates multiple SFP+ cages on the same PCB. Compared to an ASSP switch, this FPGA offers flexible port-count and protocol customization.
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Motor Control and Digital Drive
The 10CX150YF672E6G handles multi-axis field-oriented control (FOC) and direct torque control (DTC) for industrial servo drives, robotics, and CNC machines. The 236 (18x18) multipliers execute the Park/Clarke transforms and PI loops in hardware at sub-microsecond rates. Industrial temperature rating (-40C to +100C) suits motor enclosures and ambient-rich cabinets. The FPGA's parallel structure outperforms microcontrollers on multi-axis systems. Pairing with external ADCs and power modules creates a complete drive reference design available from Intel FPGA partner ecosystem.
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PCI Express Endpoint Card
With hard PCI Express Gen2 x4 controllers, the 10CX150YF672E6G drops directly into PCIe endpoint cards for data acquisition, software-defined radio, hardware acceleration, and protocol bridging. The Gen2 x4 lanes provide 16 Gbps of host bandwidth, while the 150K logic elements implement application-specific accelerators. The 672-ball FCBGA footprint fits standard PCIe form factors. Industrial temperature grading suits test-and-measurement cards deployed in laboratory and factory environments. Quartus Prime PCIe IP cores are pre-validated for common enumeration scenarios.
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Radar and LiDAR Baseband Processing
The 10CX150YF672E6G's combination of 12.5 Gbps transceivers and 236 (18x18) multipliers is well-suited to automotive and industrial radar preprocessing (FFT, CFAR detection) and LiDAR point-cloud aggregation. JESD204B and CPRI transceiver support interfaces directly to RF ADCs and DACs from major vendors. The industrial temperature grade and 20 nm low-power process suit embedded vehicle and outdoor installations. The 672-ball FCBGA package allows integration of multiple sensor interfaces on a single device. Reference designs from the Cyclone 10 GX partner ecosystem accelerate radar prototyping.
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Software-Defined Radio Baseband
The 10CX150YF672E6G's transceivers support CPRI, JESD204B, and 10G Ethernet to digital RF front-ends, while the 150K logic elements implement channelizers, modulators, and baseband signal processing pipelines. The 10.9 Mbit embedded memory buffers complex I/Q samples between DSP stages. Industrial temperature rating supports outdoor base-station and tactical-radio deployment. Compared to DSP processors, the FPGA's deterministic latency and parallel architecture enable multi-channel operation per watt. Reference designs from Altera/Intel IP partners accelerate waveform bring-up.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10CX150YF672E6G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10CX105YF672E6G | 10CX085YF672E6G | 10CX150YF672E5G | 10CX105YF672I6G | 10CX085YF672I6G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FCBGA | 672-ball FCBGA - same | 672-ball FCBGA - same | 672-ball FCBGA - same | 672-ball FCBGA - same | 672-ball FCBGA - same |
| Logic Elements | 150,000 | 105,000 (-30%) | 85,000 (-43%) | 150,000 (same) | 105,000 (-30%) | 85,000 (-43%) |
| Speed Grade | -6 (Enhanced) | -6 (Enhanced) - same | -6 (Enhanced) - same | -5 (slower) | -I6 (Industrial) | -I6 (Industrial) |
| Transceiver Speed | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps |
| Hard PCIe Gen2 | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Highest density in the 672-ball FCBGA Cyclone 10 GX family (vs 10CX105YF672E6G)
- Enhanced speed grade -6 timing margin vs -I6 industrial (vs 10CX105YF672I6G)
- Hard PCIe Gen2 controllers reduce logic and routing complexity (vs 10CL120YF780I7G (Cyclone 10 LP))
설계 노트
The Cyclone 10 GX family uses multiple power rails: VCC (core), VCCPT (programmable power technology), VCCR_GXB and VCCT_GXB (transceiver receive and transmit), VCCIO (I/O banks), and VCCPD (I/O pre-drivers). Per Intel Cyclone 10 GX device datasheet, all rails must power up monotonically and sequence within the limits defined in the Power Management User Guide. Estimated: at 150K LE utilization with active transceivers at 10 Gbps, core current can exceed 2 A and total board power can reach 8-12 W, requiring a multi-phase buck regulator and at least 4-layer PCB with dedicated power planes.
The 672-ball FCBGA has a fine 1.0 mm ball pitch. PCB layout must follow the Cyclone 10 GX High Speed Board Design Guidelines for BGA escape routing - 0.4-0.5 mm trace width, 0.4-0.5 mm via pad, and microvia-in-pad is strongly recommended. Matched-length routing (within 150 mils) is required for transceiver differential pairs to maintain 12.5 Gbps signal integrity. AC coupling capacitors should be placed near the transmitter balls. Use the Quartus Prime pin planner to verify I/O assignment before layout finalization.
The 672-ball FCBGA exposes a thermal pad to the top of the package. For designs operating above ~6 W total power dissipation, attach a heat spreader with thermal interface material rated for industrial temperature. Estimated: at 8 W dissipation and typical theta_JA around 15 C/W for FCBGA with heat spreader, junction temperature rises 120C above ambient - acceptable in industrial environments but requires derating at high ambient. Use the Cyclone 10 GX PowerPlay Early Power Estimator to size thermal solutions before PCB layout.
Do not leave transceiver reference resistor pins floating - each GXB block requires a 1.5 kohm +/-1% external reference resistor connected to GND. Missing pull-ups on configuration pins (nCONFIG, nSTATUS, CONF_DONE) will prevent the device from entering user mode. Always generate the .sof/.pof using Quartus Prime version 18.1 or later for full Cyclone 10 GX support. Early versions of Quartus do not support the -6 speed grade timing models and will fail timing closure.
규정 준수 정보
RoHS compliance confirmed by distributor listings (DigiKey, Arrow). Industrial temperature rating per -E6G speed grade designation. AEC-Q100 qualification not applicable - this is a non-automotive FPGA; automotive-grade Cyclone 10 GX variants use different ordering codes.
