10CX085YF672I6G - Cyclone 10 GX 85K LE FPGA, 672-FBGA | Intel
부품 번호: 10CX085YF672I6G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $382.5 | $3,825.00 |
| 100 | $340 | $34,000.00 |
| 500 | $297.5 | $148,750.00 |
| 1,000 | $255 | $255,000.00 |
10CX085YF672I6G 개요
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks. FPGAs sit at the top of the digital semiconductor hierarchy (programmable logic -> configurable logic device -> digital IC) and are typically deployed where ASIC NRE costs are unjustified, time-to-market is critical, or hardware must be reconfigured post-deployment.
Key features of the 10CX085YF672I6G include the Cyclone 10 GX architecture built on a 20 nm process, support for DDR3/DDR4/LPDDR3 external memory interfaces with hard PHY, up to 12.5 Gbps multi-protocol transceivers (PCIe Gen2, 10GbE, CPRI, JESD204B/C), and 156 18x19 multipliers for DSP workloads. The device operates from a 0.9V core supply with separate transceiver and auxiliary rails, and supports industrial temperature grades.
The Cyclone 10 GX architecture uses Adaptive Logic Modules (ALMs), a fine-grained fabric that improves logic utilization versus older ALM generations. Hardened PCIe Gen2 endpoints, hard memory controllers, and hard transceiver physical coding sublayers reduce soft logic overhead and lower power per operation, enabling higher aggregate bandwidth at lower cost than competing mid-range FPGAs.
Typical applications include industrial machine vision and video bridging, low-cost wireless backhaul radios, broadcast video processing, PCIe-based accelerator cards, and motor control / industrial Ethernet endpoints. The 12.5 Gbps transceivers make the part especially suitable for protocol bridging (e.g., 10GbE to PCIe, CPRI to Ethernet) where the 85K LE budget is sufficient.
When designing with this device, ensure the PCB can accommodate the 672-ball FBGA land pattern with proper via-in-pad or dog-bone fanout, and validate transceiver channel placement against your board stack-up. Pin-compatible migration to 10CL (Cyclone 10 LP) FPGAs in the same package is not supported because the transceivers and fabric differ.
드롭인 대체품: 10CX085YF672I6G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10CX085YF672I6G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Adaptive Logic Modules (ALM), Speed Grade, Logic Elements (LE).
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10CX085YF672I5G
✅ 드롭인✓ 재고 있음
$95.6 / 개
데이터시트 보기 →10CX085YF672E6G
✅ 드롭인✓ 재고 있음
$280.5 / 개
데이터시트 보기 →10CX085YF672E5G
✅ 드롭인✓ 재고 있음
$289 / 개
데이터시트 보기 →10CX085YF672A7G
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10CX085YF672I6G 최대 정격 & 전기적 특성
| Series | Cyclone 10 GX |
| Logic Elements (LE) | 85,000 |
| Embedded Memory Bits | 5,959,680 |
| Maximum User I/O | 216 |
| 패키지 | 672-FBGA (F672) |
| Process Node | 20 nm |
| Transceiver Data Rate | Up to 12.5 Gbps |
| Hard Memory Controller | DDR3 / DDR4 / LPDDR3 |
| DSP Blocks (18x19 Multipliers) | 156 |
| Operating Temperature Grade | Industrial |
| Core Voltage | 0.9 V (typical) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Hard PCIe Gen2 Endpoint | Yes |
| Speed Grade | -6 |
10CX085YF672I6G 672-fbga (f672) 핀 구성 가이드
10CX085YF672I6G(672-fbga (f672) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10CX085YF672I6G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10CX085YF672I6G 적합 용도: 6 애플리케이션s: Industrial Machine Vision and Video Bridging, PCIe Gen2 Accelerator Add-In Card, Wireless Backhaul and Small-Cell Baseband, Broadcast Video Processing and Format Conversion, Motor Control and Industrial Ethernet Gateways, Portable Test and Measurement Instrumentation.
Industrial Machine Vision and Video Bridging
The 10CX085YF672I6G fits machine vision pipelines that ingest multi-megapixel sensor streams over MIPI-CSI-2 or parallel LVDS and bridge to GigE Vision, USB3 Vision, or 10GbE backhaul. Its 12.5 Gbps transceivers sustain uncompressed 4K video at 60 fps (roughly 8 Gbps payload) with margin for protocol overhead, while 156 18x19 DSP multipliers handle Bayer demosaic, lens distortion correction, and temporal noise reduction in-line without off-chip DSP. The 5.96 Mbit embedded memory (M20K blocks) buffers line-scan line buffers and histogram accumulators, reducing the need for external SRAM. Industrial temperature grade and hard PCIe Gen2 endpoint IP further simplify host-attached frame-grabber cards.
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PCIe Gen2 Accelerator Add-In Card
The 10CX085YF672I6G suits low-cost PCIe Gen2 x4 or x8 accelerator cards in edge servers and industrial PCs. The hard PCIe Gen2 endpoint IP block eliminates soft IP overhead, freeing fabric for application accelerators (FFT, encryption, signal processing). 85K logic elements plus 156 DSP blocks handle modest compute workloads, while the 12.5 Gbps transceivers enable optional QSFP+ side-band links at 10GbE or CPRI rates for radio units. The 672-FBGA package provides ample I/O for DDR4-1600 host memory buffers (up to 4 GByte with 16-bit ECC) and high-density GPIO for sensor or backplane interconnect. Compared to a soft-core PCIe design, the hard IP reduces latency by ~10-15%.
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Wireless Backhaul and Small-Cell Baseband
The 10CX085YF672I6G supports wireless backhaul radios and small-cell baseband processing where 12.5 Gbps transceivers cover CPRI line rates up to option 7 (9.830 Gbps), with margin for 10GbE fronthaul switching. The DSP fabric executes FFT/iFFT, channel estimation, and pre-coding for LTE and 5G NR sub-6 small cells at 20 MHz to 100 MHz channel bandwidths. Hard memory controllers feed DDR3/DDR4 buffers for HARQ retransmission and downlink data queues, while the 0.9V core voltage and 20 nm process keep board-level power under 15W typical for thermally constrained outdoor enclosures. Industrial temperature screening supports deployment in outdoor cabinets.
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Broadcast Video Processing and Format Conversion
The 10CX085YF672I6G fits broadcast infrastructure such as video routers, format converters (SDI to SMPTE 2110, HDMI to SDI), and multi-viewer processors. Twelve 12.5 Gbps transceivers deliver uncompressed 12G-SDI (ST 2082) and 10GbE SMPTE 2110 essence streams simultaneously, with the 672-FBGA package offering the high pin count required for multi-channel 3G-SDI LVDS inputs. Embedded M20K memory blocks act as line and frame buffers for scaler and color-space-converter pipelines, while 156 DSP multipliers execute polyphase scaling and chroma resampling at full broadcast frame rates. Industrial temperature grade supports 24/7 rack operation.
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Motor Control and Industrial Ethernet Gateways
The 10CX085YF672I6G integrates industrial Ethernet protocol stacks (EtherCAT, PROFINET IRT, EtherNet/IP) with real-time motor control loops in a single device. The 12.5 Gbps transceivers support multi-port 10GbE uplinks, while the DSP fabric executes field-oriented control (FOC), SVPWM, and encoder-decoder logic at 100 kHz loop rates. Hardened memory controllers attach DDR3 buffers for trajectory tables and process data, and 216 user I/Os accommodate PWM channels, encoder inputs, and digital I/O for complex multi-axis drives. Compared to MCU+DSP discrete solutions, the FPGA reduces interrupt latency to ~50 ns deterministic cycles, improving servo loop bandwidth.
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Portable Test and Measurement Instrumentation
The 10CX085YF672I6G fits mid-range portable oscilloscopes, protocol analyzers, and logic analyzers where its 12.5 Gbps transceivers support 25-50 GHz equivalent sampling front-ends and high-speed serial protocol decoding (PCIe Gen2, USB 3.0 Gen1, SATA, 10GbE). On-chip DSP blocks implement FFT-based spectrum analysis, while the hard memory controllers feed DDR3 acquisition memory up to 4 GByte at sustained rates. The 672-FBGA package keeps board area under 50 x 50 mm critical for handheld instruments, and Quartus Prime Pro design tools provide deterministic timing closure for tight measurement jitter budgets. Industrial temperature grade supports field-deployed test gear.
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추천 제품 요약
엔지니어링 참조 데이터: 10CX085YF672I6G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10CX085YF672I5G | 10CX085YF672E6G | 10CX085YF672E5G | 10CX085YF672A7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (F672) | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same |
| Logic Elements | 85,000 | 85,000 | 85,000 | 85,000 | 85,000 |
| Speed Grade | -6 | -5 | -6 | -5 | -7 |
| Temperature Grade | Industrial | Industrial | Extended | Extended | Automotive / Industrial |
| Embedded Memory Bits | 5,959,680 | 5,959,680 | 5,959,680 | 5,959,680 | 5,959,680 |
| Transceiver Rate | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
| DSP Multipliers (18x19) | 156 | 156 | 156 | 156 | 156 |
주요 차별점
- Higher transceiver data rate than same-density Cyclone V GX parts (vs 5CGXFC5C6F27I7G (Cyclone V GX 85K LE equivalent))
- Hardened DDR4 memory controller not available in Cyclone 10 LP family (vs 10CL080YU484I7G (Cyclone 10 LP 80K LE))
- Hard PCIe Gen2 endpoint IP eliminates soft-core overhead (vs Xilinx Spartan-7 XC7S75 (same density class))
설계 노트
The 672-FBGA package requires either microvia (via-in-pad) PCB technology or a 0.8 mm pitch dog-bone fan-out. Estimated: on a 4-layer stack-up with 1 oz copper, expect 8 signal layers with HDI microvias to fully escape the F672 BGA at 1.0 mm pitch. Maintain a continuous ground plane under the package and stitch vias around the perimeter at 1 mm spacing to control return paths for 12.5 Gbps transceivers. Use length-matched differential pairs for transceiver channels, with intra-pair skew under 1 ps.
Cyclone 10 GX transceivers at 12.5 Gbps can push total device power to 8-15 W depending on utilization. Estimated: at 85% utilization with 8 active transceiver channels, plan for a 4-layer PCB with at least 25 cm^2 of unbroken inner-plane copper under the package and consider a 0.5 mm thick thermal pad or top-side heatsink for fanless operation. Derate junction temperature to 100C max for industrial-grade reliability and 125C only with proper airflow. Refer to the Intel Cyclone 10 GX thermal modeling file for accurate per-design junction-temperature estimation.
Do not assume the Cyclone 10 GX F672 pinout is compatible with Cyclone V GX F672 devices - the bank architecture, transceiver channel mapping, and configuration pin assignments differ. Also note that migrating from speed grade -6 to -5 reduces Fmax by approximately 10-15% on memory interfaces and DSP blocks; always re-run timing analysis. When using hard PCIe Gen2 endpoint IP, ensure the reference-clock input meets the 100 MHz +/-300 ppm tolerance required by the PCIe Base Specification 2.1.
For 12.5 Gbps transceiver channels, use a PCB stack-up with low-loss dielectric (Df under 0.005 at 5 GHz) such as Isola FR408HR or Panasonic MEGTRON 6. Estimated: at 12.5 Gbps on a 6-inch trace, expect 1.2-1.5 dB insertion loss from a typical low-loss stack-up. Implement AC coupling capacitors (typically 100 nF 0402) on every transceiver TX and RX lane, placed close to the FPGA ball. Reference Intel Application Note AN-831 for the canonical transceiver PCB layout guidelines.
규정 준수 정보
RoHS and REACH compliant per Intel product page. Industrial temperature grade -40C to +100C junction. For automotive AEC-Q100 requirements consider the 10CX085YF672A7G variant (verify per Intel PCN).
