10M16DCU324I7G - MAX 10 FPGA, 16K LE, 246 I/O, 324-UBGA | Intel
부품 번호: 10M16DCU324I7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $56.73 | $56.73 |
| 10 | $54.2 | $542.00 |
| 100 | $48.95 | $4,895.00 |
| 500 | $44.3 | $22,150.00 |
| 1,000 | $40.1 | $40,100.00 |
10M16DCU324I7G 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic functions. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-driven microcontrollers, offering parallel processing, deterministic timing, and high I/O flexibility. The MAX 10 series extends this category by embedding non-volatile configuration memory directly on-chip, eliminating the need for an external boot PROM.
Key features include 16,000 logic elements, 45 adaptive logic modules (ALMs) per LAB, 246 maximum user I/Os, 12.5 Kbits of distributed RAM, 558 Kbits of block RAM (M9K), 45 embedded 18x18 multipliers, 4 PLLs, and 2.5 Gbps LVDS support. The industrial temperature grade (-40C to +100C) and integrated ADC make this variant well suited to motor control and industrial sensor interfaces.
Architecturally, the MAX 10 family is built on TSMC 55 nm NOR-flash-based process technology, combining look-up-table logic fabric with on-die flash configuration storage. Dual-configuration flash supports remote in-field updates, while integrated analog blocks (12-bit ADC, temperature sensor) reduce bill-of-material cost. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability, simplifying in-system programming.
Typical applications include industrial motor control, factory automation, video bridging, portable medical devices, and low-cost display controllers. The 10M16DCU324I7G is commonly paired with TI power management and Micron DDR3 memory to form a complete system on a board. When designing, validate pinout against the Quartus Prime device pinout file (DPF) for your specific IO bank assignment, and budget for JTAG programming header access even on production boards.
드롭인 대체품: 10M16DCU324I7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M16DCU324I7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, User Flash Memory, Process Technology, Operating Temperature, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M16DCU324C8G
✅ 드롭인✓ 재고 있음
$38.4 / 개
데이터시트 보기 →10M16DCU324A7G
✅ 드롭인✓ 재고 있음
$34.95 / 개
데이터시트 보기 →10M16DAU324I7G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M16DAU324I7P
✅ 드롭인✓ 재고 있음
$51.2 / 개
데이터시트 보기 →10M08DCU324I7G
✅ 드롭인✓ 재고 있음
$8.5 / 개
데이터시트 보기 →10M16DCU324I7G 최대 정격 & 전기적 특성
| Family | MAX 10 |
| Logic Elements | 16,000 |
| Adaptive Logic Modules (ALMs) | 9,920 |
| User I/O Count (Maximum) | 246 |
| Embedded Memory (M9K Blocks) | 558 Kbits |
| Distributed Logic RAM | 12.5 Kbits |
| Embedded User Flash | 562,176 bits (70 KB) |
| Embedded 18x18 Multipliers | 45 |
| PLLs | 4 |
| Maximum LVDS Channels | 125 |
| 패키지 | 324-UBGA (U324), 15 x 15 mm, 0.8 mm pitch |
| 동작 온도 | -40C to +100C (Industrial) |
| Process Technology | 55 nm NOR-flash-based CMOS |
| Configuration Memory | On-die dual-configuration flash |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
10M16DCU324I7G 324-ubga (u324), 15 x 15 mm, 0.8 mm pitch 핀 구성 가이드
10M16DCU324I7G(324-ubga (u324), 15 x 15 mm, 0.8 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M16DCU324I7G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M16DCU324I7G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Bridging and Display Controllers, Factory Automation I/O Expansion, Portable Medical Devices, Low-Cost IoT Gateways, Test and Measurement Instrumentation.
Industrial Motor Control
The 10M16DCU324I7G's integrated 12-bit ADC, PWM-capable PLLs, and 246 user I/Os make it well suited for industrial motor control drives. Its on-die dual-configuration flash supports in-field firmware updates without production-line rework, and the industrial -40C to +100C temperature rating covers factory-floor conditions. Combined with 45 embedded 18x18 multipliers, the FPGA can implement Field-Oriented Control (FOC) loops in hardware, achieving sub-microsecond current-loop latency. Pair with TI C2000 gate drivers or Infineon EiceDRIVER for the power stage.
추천
Video Bridging and Display Controllers
With 246 user I/Os and 125 LVDS channels at up to 2.5 Gbps, the 10M16DCU324I7G is widely used in video bridging applications such as MIPI-to-LVDS, HDMI-to-MIPI, and DisplayPort-to-LVDS conversion. The 558 Kbits of block RAM provides sufficient line buffers for multi-megapixel display streams, while the dual-configuration flash supports A/B image failover for safety-critical displays. Quartus Prime IP cores accelerate development of CSI-2, DSI, and OpenLDI interfaces.
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Factory Automation I/O Expansion
The 246 GPIO count on the 10M16DCU324I7G enables a single FPGA to consolidate multiple industrial protocols such as EtherCAT, PROFINET, Modbus TCP, and RS-485 into one programmable device. Its non-volatile instant-on behavior eliminates boot-time delays required by microcontrollers+external flash combinations. The 4 PLLs allow independent clocking of isolated communication islands, and the on-die temperature sensor enables predictive maintenance telemetry.
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Portable Medical Devices
Medical designs benefit from the 10M16DCU324I7G's low static power (~25 mW typical), 562 Kbits of user flash for calibration and patient-data logging, and instant-on capability that lets handheld diagnostic equipment boot in under 10 ms. The 12-bit ADC supports direct sensor front-ends for ECG, SpO2, and temperature measurement. The industrial temperature range covers wearable and bedside use cases, while Quartus Prime functional-safety packages ease IEC 62304 documentation.
추천
Low-Cost IoT Gateways
IoT edge gateways use the 10M16DCU324I7G to bridge sensors over SPI/I2C/UART and to Ethernet or Wi-Fi radios. The 16K logic elements comfortably handle TLS acceleration and on-device sensor fusion, while the dual-configuration flash enables secure OTA updates. The 125 LVDS channels support direct connection to high-resolution camera sensors for vision-based IoT endpoints. Power consumption typically stays under 200 mW, enabling battery-backed operation.
추천
Test and Measurement Instrumentation
Test equipment designs leverage the 10M16DCU324I7G's 4 PLLs, 45 multipliers, and high I/O count to implement custom waveform generators, logic analyzers, and protocol testers. The on-die ADC combined with 246 user I/Os enables mixed-signal capture at modest sample rates. The 562 Kbits user flash stores calibration tables, eliminating external EEPROMs, and the industrial temperature range supports lab and field-deployed instrumentation alike.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M16DCU324I7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M16DCU324C8G | 10M16DCU324A7G | 10M16DAU324I7G | 10M08DCU324I7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 324-UBGA (U324) | 324-UBGA (U324) - same | 324-UBGA (U324) - same | 324-UBGA (U324) - same | 324-UBGA (U324) - same |
| Logic Elements | 16,000 | 16,000 | 16,000 | 16,000 | 8,000 |
| User I/O Count | 246 | 246 | 246 | 246 | 246 |
| Embedded Multipliers (18x18) | 45 | 45 | 45 | 45 | 24 |
| Block RAM (M9K) | 558 Kbits | 558 Kbits | 558 Kbits | 558 Kbits | 256 Kbits |
| User Flash | 562,176 bits | 562,176 bits | 562,176 bits | 562,176 bits | 290,816 bits |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Automotive (AEC-Q100) | Industrial (-40C to +100C) |
| PLLs | 4 | 4 | 4 | 4 | 2 |
주요 차별점
- Mid-density 16K LE with 246 I/O in the MAX 10 family (vs 10M08DCU324I7G)
- Industrial temperature grade at no extra cost (vs 10M16DCU324C8G)
- Instant-on dual-configuration flash with integrated ADC (vs Cyclone V FPGA family)
설계 노트
The 324-UBGA U324 package uses a 0.8 mm ball pitch on a 15 x 15 mm substrate. PCB fabrication must support microvia HDI (High-Density Interconnect) stack-up with at least 4-6-4 layer count. Place at least 4 stitching vias around the BGA perimeter for ground-return inductance control. Reference the Intel MAX 10 device pin connection guidelines for unused-pin tie-off (do not leave UBGA balls floating; tie NC pins to ground per the datasheet). Estimated: microvia cost adds ~15-20% to PCB fabrication but is mandatory for reliable 0.8 mm BGA assembly.
The 10M16DCU324I7G requires three supply rails: VCCINT (core 1.2 V typical, up to ~200 mA), VCCIO (I/O bank voltage, 1.2 V-3.3 V per bank), and VCCA (analog PLL/ADC 2.5 V). All rails must come up within 100 ms of each other per Intel's MAX 10 power management guide. Use a TI TPS54331 or Analog Devices ADM7150 LDO for VCCA to keep ADC noise low; ferrite beads on each VCCIO bank isolate switching noise. Decouple each VCCIO/VCCINT pin pair with 0.1 uF and 10 uF capacitors placed within 100 mils of the ball.
Common pitfalls when designing with the 10M16DCU324I7G: (1) do not exceed 16 LVDS TX channels per bank - the bank VCCIO must be 2.5 V for LVDS operation; (2) the JTAG TCK signal requires a 1-10 kohm pull-down to prevent accidental configuration mode entry; (3) the MSEL[3:0] pins must be tied to VCCIO or GND per the desired configuration mode (AS, PS, JTAG, or fast-on) - floating MSEL causes configuration failure; (4) do not toggle the nCONFIG pin during the configuration window without sequencing per datasheet. Reference Intel AN 736: Using the MAX 10 FPGA Configuration User Guide for the full checklist.
Estimated: at full logic utilization (16K LE, 45 multipliers at 200 MHz, all 246 I/Os switching), the 10M16DCU324I7G consumes approximately 0.7-1.0 W of dynamic power. The 324-UBGA package has a theta-JA of approximately 18 C/W on a 4-layer JEDEC test board, yielding a ~20C junction rise above ambient. For industrial ambient at 85C, junction stays well within the +100C limit. If designing for +100C ambient, add thermal vias under the central BGA balls and consider a 1 oz copper inner-plane stack-up for thermal relief.
규정 준수 정보
RoHS and lead-free per manufacturer product page. The I7 industrial-grade variant is not AEC-Q100 qualified; choose 10M16DAU324I7G for automotive qualification.
