10M16DAU324I7P - MAX 10 FPGA 16K LE 246 I/O | Intel | 324-LFBGA
부품 번호: 10M16DAU324I7P ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.3 | $723.00 |
| 100 | $65.8 | $6,580.00 |
| 500 | $58.4 | $29,200.00 |
| 1,000 | $51.2 | $51,200.00 |
10M16DAU324I7P 개요
An FPGA (Field Programmable Gate Array) is a class of programmable logic device that allows hardware designers to configure digital logic blocks and interconnects after manufacture. Within the broader semiconductor taxonomy, FPGAs sit above ASICs and CPLDs in flexibility but below microcontrollers in ease of programming. The MAX 10 family specifically integrates a hard processor subsystem, dual-configuration flash, and analog blocks onto a single die, targeting cost-sensitive industrial, automotive, and IoT applications.
Key features of the 10M16DAU324I7P include 16,000 logic elements organized into Adaptive Logic Modules (ALMs), 549 kbit of embedded SRAM, 2.5 Mb of user flash memory, and 246 GPIO pins supporting LVDS, LVCMOS, SSTL, and other I/O standards. The device operates from a 1.2 V core supply with I/O banks supporting 1.2V to 3.3V, and integrates a hard Nios II processor interface for soft-core SoC designs.
The MAX 10 architecture uses TSMC 55 nm embedded flash process technology, combining LUT-based logic fabric with hard IP blocks including PLLs, ADC, and temperature-sensing diodes. This monolithic integration eliminates external boot memory and reduces BOM cost. The dual-boot flash supports field upgrades with zero downtime through the On-Line Update feature.
Typical applications include industrial motor control, factory automation I/O expansion, video bridging, low-cost ASIC replacement, sensor fusion, and portable instrumentation. The integrated 12-bit ADC simplifies analog front-end designs.
When designing with this part, allocate sufficient PCB area for the 0.8 mm pitch LFBGA-324 footprint and route all power rails with adequate decoupling. The Quartus Prime design tool supports the full MAX 10 family with unified place-and-route.
This page synthesizes distributor pricing, same-family drop-in alternatives from the Site MPN list, and practical board-level design notes not collected in a single place on the Intel datasheet.
드롭인 대체품: 10M16DAU324I7P — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M16DAU324I7P (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Logic Elements (LE), Configuration Memory, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M16DAU324I7G
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10M16DAU324C8G
✅ 드롭인✓ 재고 있음
$35.4 / 개
데이터시트 보기 →10M16DAU324A7G
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10M08DAU324I7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$22.1 / 개
데이터시트 보기 →10M08DAU324C8G
✅ 드롭인✓ 재고 있음
$11.4 / 개
데이터시트 보기 →10M16DAU324I7P 최대 정격 & 전기적 특성
| Family | MAX 10 |
| Logic Elements | 16000 |
| User I/O Count | 246 |
| Embedded Memory | 549 kbit |
| Embedded Multipliers (18x18) | 246 |
| 패키지 | 324-LFBGA (UBGA-324) |
| Operating Supply Voltage (Core) | 1.2 V |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +100 C |
| Speed Grade | 7 |
| Temperature Grade | Industrial (I) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
10M16DAU324I7P 324-lfbga (ubga-324) 핀 구성 가이드
10M16DAU324I7P(324-lfbga (ubga-324) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M16DAU324I7P.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M16DAU324I7P 적합 용도: 6 애플리케이션s: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Display Aggregation, Low-Cost ASIC Replacement, Sensor Fusion and IoT Edge Nodes, Portable Test and Measurement.
Industrial Motor Control
The 10M16DAU324I7P fits industrial motor control because its 16K logic elements comfortably handle field-oriented control (FOC) algorithms, sensorless observers, and multi-axis coordination at 32 kHz PWM update rates. The integrated 12-bit 1 MSPS ADC samples phase currents synchronously to PWM events without an external analog front-end, while 246 I/Os drive high-resolution encoder interfaces, resolver excitation, and gate-driver signals. The on-chip flash and dual-configuration boot allow in-field firmware upgrades between production runs. At 1.2 V core and industrial -40 to +100 C operation, the device tolerates factory-floor thermal stress.
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Factory Automation I/O Expansion
For PLC backplane and distributed I/O blocks, the 10M16DAU324I7P provides 246 user I/Os at 0.8 mm pitch, supporting LVDS, RS-485, 24 V field-bus isolators, and parallel industrial Ethernet interfaces. The 549 kbit embedded memory buffers high-speed packet inspection and timestamp data. Industrial temperature grade (-40 to +100 C) and 1.2 V core simplify MTBF analysis. Designers can map EtherCAT or PROFINET soft IP into the same die, eliminating a companion ASIC. The MAX 10 dual-boot flash supports redundant firmware for zero-downtime field updates.
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Video Bridging and Display Aggregation
The 10M16DAU324I7P can aggregate multiple MIPI CSI-2 or parallel CMOS camera inputs into a single USB3 or Ethernet output in video bridging applications. The 246 18x18 multipliers accelerate JPEG/H.264 encoding, while 549 kbit block RAM holds multiple video line buffers without external SDRAM. The industrial temperature range covers outdoor surveillance and machine-vision enclosures. The 324-LFBGA package delivers the I/O density required for 8-bit parallel camera interfaces and HDMI/DVI output bridges. On-chip flash cuts BOM cost versus SRAM-based FPGAs.
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Low-Cost ASIC Replacement
The 10M16DAU324I7P replaces custom ASICs in volumes below 100K units where NRE charges are uneconomical. With 16K LEs, 246 I/Os, hard ADC, on-chip flash, and 1.2 V operation, the MAX 10 integrates nearly all glue logic of a typical mixed-signal ASIC. Industrial temperature grade supports automotive and industrial markets. The dual-boot flash and JTAG-based programming eliminate the need for an external boot PROM. Designers prototype on the MAX 10 dev kit then move to production boards with the same 324-LFBGA footprint.
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Sensor Fusion and IoT Edge Nodes
Edge-sensor aggregation nodes use the 10M16DAU324I7P to interface multiple SPI, I2C, and UART sensors, then pre-process and compress data before forwarding to a host MCU. The 549 kbit embedded memory holds moving-window statistics and FIR filter taps; the 246 18x18 multipliers accelerate FFT and Kalman filter math. The integrated 12-bit ADC samples analog environmental sensors (temperature, pressure) without an external ADC chip. Industrial temperature range supports outdoor deployment, while the 324-LFBGA package's compact 19 mm x 19 mm footprint suits small-form-factor sensor hubs.
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Portable Test and Measurement
Handheld oscilloscopes, logic analyzers, and protocol testers leverage the 10M16DAU324I7P's high I/O count to capture multiple channels at 200 MHz+ while running on-board DSP for FFT, eye-diagram, and protocol decode. The integrated 12-bit ADC eliminates an external mixed-signal front end for low-bandwidth channels. Industrial -40 to +100 C support covers bench-to-field portable instruments. The on-chip flash simplifies factory calibration storage, and the 549 kbit block RAM buffers deep acquisition captures. USB3, Ethernet, or PCIe soft IP can be implemented in the same die to streamline BOM.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M16DAU324I7P — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M16DAU324I7G | 10M16DAU324C8G | 10M16DAU324A7G | 10M08DAU324I7G | 10M08DAU324C8G |
|---|---|---|---|---|---|---|
| Package | 324-LFBGA (UBGA-324) | 324-LFBGA | 324-LFBGA | 324-LFBGA | 324-LFBGA | 324-LFBGA |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 16000 | 16000 | 16000 | 16000 | 8000 | 8000 |
| User I/Os | 246 | 246 | 246 | 246 | 246 | 246 |
| Embedded Memory | 549 kbit | 549 kbit | 549 kbit | 549 kbit | 378 kbit | 378 kbit |
| Temperature Grade | Industrial -40 to +100 C | Industrial -40 to +100 C | Commercial 0 to +85 C | Automotive -40 to +125 C (AEC-Q100) | Industrial -40 to +100 C | Commercial 0 to +85 C |
| Speed Grade | 7 | 7 | 8 | 7 | 7 | 8 |
| AEC-Q100 Qualified | No | No | No | Yes | No | No |
주요 차별점
- Highest I/O density in MAX 10 10M16 family (vs 10M16DAF484I7P)
- Industrial temperature grade with maximum density (vs 10M16DAU324C8G)
- Lower density drop-in for cost-optimized designs (vs 10M08DAU324I7G)
설계 노트
The 324-LFBGA package uses 0.8 mm ball pitch. Follow Intel AN 532 for land pattern, solder-mask-defined (SMD) vs non-solder-mask-defined (NSMD) pad choice, and reflow profile. SMD pads with a 0.35 mm copper pad diameter and 0.65 mm solder-mask opening are recommended for robust BGA joint formation. Allow at least 6 layers with dedicated ground and 1.2 V power planes beneath the device to provide low-impedance current return paths for the high-speed I/O and ADC.
The 10M16DAU324I7P requires multiple supply rails: 1.2 V core (VCCINT), 1.2 V or 2.5 V PLL analog (VCCA), 2.5 V or 3.3 V configuration (VCCIO7/8 for configuration banks), and per-bank VCCIO for I/O standards. Decouple each rail with 100 nF X7R ceramic capacitors placed within 2 mm of each power pin, plus bulk 10-47 uF tantalum or polymer capacitors on the board. Sequence VCCINT before VCCIO per Intel Power-Up sequencing guidelines to avoid latch-up. The integrated ADC requires a clean 2.5 V analog supply separate from digital 2.5 V.
Estimated: at maximum toggling activity and 246 I/O switching simultaneously, dynamic current can exceed 500 mA on the 1.2 V core. Designers should budget thermal dissipation for the LFBGA package, which has theta-JA around 25 C/W on a standard 4-layer JEDEC test board. Provide thermal vias under the central ball array to the opposite copper plane. JTAG configuration pins (TCK, TMS, TDI, TDO) must not be left floating - add 10 kohm pull-ups to VCCIO7 to keep the device in a known state during power-up.
규정 준수 정보
Industrial-grade MAX 10 FPGA; RoHS and REACH compliant per Intel product declaration. For AEC-Q100 qualified version, choose 10M16DAU324A7G.
