10M16DCU324I7G - MAX 10 FPGA, 16K LE, 246 I/O, 324-UBGA | Intel
料号： 10M16DCU324I7G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $56.73 | $56.73 |
| 10 | $54.2 | $542.00 |
| 100 | $48.95 | $4,895.00 |
| 500 | $44.3 | $22,150.00 |
| 1,000 | $40.1 | $40,100.00 |
10M16DCU324I7G 概述
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic functions. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-driven microcontrollers, offering parallel processing, deterministic timing, and high I/O flexibility. The MAX 10 series extends this category by embedding non-volatile configuration memory directly on-chip, eliminating the need for an external boot PROM.
Key features include 16,000 logic elements, 45 adaptive logic modules (ALMs) per LAB, 246 maximum user I/Os, 12.5 Kbits of distributed RAM, 558 Kbits of block RAM (M9K), 45 embedded 18x18 multipliers, 4 PLLs, and 2.5 Gbps LVDS support. The industrial temperature grade (-40C to +100C) and integrated ADC make this variant well suited to motor control and industrial sensor interfaces.
Architecturally, the MAX 10 family is built on TSMC 55 nm NOR-flash-based process technology, combining look-up-table logic fabric with on-die flash configuration storage. Dual-configuration flash supports remote in-field updates, while integrated analog blocks (12-bit ADC, temperature sensor) reduce bill-of-material cost. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability, simplifying in-system programming.
Typical applications include industrial motor control, factory automation, video bridging, portable medical devices, and low-cost display controllers. The 10M16DCU324I7G is commonly paired with TI power management and Micron DDR3 memory to form a complete system on a board. When designing, validate pinout against the Quartus Prime device pinout file (DPF) for your specific IO bank assignment, and budget for JTAG programming header access even on production boards.
直接替换替代料： 10M16DCU324I7G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10M16DCU324I7G （相同外形与封装尺寸） ——差异在于 Package, User Flash Memory, Process Technology, Operating Temperature, Speed Grade.
快速对比工具——选择替代料号进行并排对比：
10M16DCU324C8G
✅ 直接替换✓ 有现货
$38.4 / 个
查看数据手册 →10M16DCU324A7G
✅ 直接替换✓ 有现货
$34.95 / 个
查看数据手册 →10M16DAU324I7G
✅ 直接替换📋 参考替代料（不在目录中）
10M16DAU324I7P
✅ 直接替换✓ 有现货
$51.2 / 个
查看数据手册 →10M08DCU324I7G
✅ 直接替换✓ 有现货
$8.5 / 个
查看数据手册 →10M16DCU324I7G 最大额定值与电气特性
| Family | MAX 10 |
| Logic Elements | 16,000 |
| Adaptive Logic Modules (ALMs) | 9,920 |
| User I/O Count (Maximum) | 246 |
| Embedded Memory (M9K Blocks) | 558 Kbits |
| Distributed Logic RAM | 12.5 Kbits |
| Embedded User Flash | 562,176 bits (70 KB) |
| Embedded 18x18 Multipliers | 45 |
| PLLs | 4 |
| Maximum LVDS Channels | 125 |
| 封装 | 324-UBGA (U324), 15 x 15 mm, 0.8 mm pitch |
| 工作温度 | -40C to +100C (Industrial) |
| Process Technology | 55 nm NOR-flash-based CMOS |
| Configuration Memory | On-die dual-configuration flash |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant |
10M16DCU324I7G 324-ubga (u324), 15 x 15 mm, 0.8 mm pitch 引脚配置指南
10M16DCU324I7G（324-ubga (u324), 15 x 15 mm, 0.8 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10M16DCU324I7G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10M16DCU324I7G 适用于 6 应用s: Industrial Motor Control, Video Bridging and Display Controllers, Factory Automation I/O Expansion, Portable Medical Devices, Low-Cost IoT Gateways, Test and Measurement Instrumentation.
Industrial Motor Control
The 10M16DCU324I7G's integrated 12-bit ADC, PWM-capable PLLs, and 246 user I/Os make it well suited for industrial motor control drives. Its on-die dual-configuration flash supports in-field firmware updates without production-line rework, and the industrial -40C to +100C temperature rating covers factory-floor conditions. Combined with 45 embedded 18x18 multipliers, the FPGA can implement Field-Oriented Control (FOC) loops in hardware, achieving sub-microsecond current-loop latency. Pair with TI C2000 gate drivers or Infineon EiceDRIVER for the power stage.
推荐
Video Bridging and Display Controllers
With 246 user I/Os and 125 LVDS channels at up to 2.5 Gbps, the 10M16DCU324I7G is widely used in video bridging applications such as MIPI-to-LVDS, HDMI-to-MIPI, and DisplayPort-to-LVDS conversion. The 558 Kbits of block RAM provides sufficient line buffers for multi-megapixel display streams, while the dual-configuration flash supports A/B image failover for safety-critical displays. Quartus Prime IP cores accelerate development of CSI-2, DSI, and OpenLDI interfaces.
推荐
Factory Automation I/O Expansion
The 246 GPIO count on the 10M16DCU324I7G enables a single FPGA to consolidate multiple industrial protocols such as EtherCAT, PROFINET, Modbus TCP, and RS-485 into one programmable device. Its non-volatile instant-on behavior eliminates boot-time delays required by microcontrollers+external flash combinations. The 4 PLLs allow independent clocking of isolated communication islands, and the on-die temperature sensor enables predictive maintenance telemetry.
推荐
Portable Medical Devices
Medical designs benefit from the 10M16DCU324I7G's low static power (~25 mW typical), 562 Kbits of user flash for calibration and patient-data logging, and instant-on capability that lets handheld diagnostic equipment boot in under 10 ms. The 12-bit ADC supports direct sensor front-ends for ECG, SpO2, and temperature measurement. The industrial temperature range covers wearable and bedside use cases, while Quartus Prime functional-safety packages ease IEC 62304 documentation.
推荐
Low-Cost IoT Gateways
IoT edge gateways use the 10M16DCU324I7G to bridge sensors over SPI/I2C/UART and to Ethernet or Wi-Fi radios. The 16K logic elements comfortably handle TLS acceleration and on-device sensor fusion, while the dual-configuration flash enables secure OTA updates. The 125 LVDS channels support direct connection to high-resolution camera sensors for vision-based IoT endpoints. Power consumption typically stays under 200 mW, enabling battery-backed operation.
推荐
Test and Measurement Instrumentation
Test equipment designs leverage the 10M16DCU324I7G's 4 PLLs, 45 multipliers, and high I/O count to implement custom waveform generators, logic analyzers, and protocol testers. The on-die ADC combined with 246 user I/Os enables mixed-signal capture at modest sample rates. The 562 Kbits user flash stores calibration tables, eliminating external EEPROMs, and the industrial temperature range supports lab and field-deployed instrumentation alike.
推荐
推荐产品汇总
工程参考数据： 10M16DCU324I7G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10M16DCU324C8G | 10M16DCU324A7G | 10M16DAU324I7G | 10M08DCU324I7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 324-UBGA (U324) | 324-UBGA (U324) - same | 324-UBGA (U324) - same | 324-UBGA (U324) - same | 324-UBGA (U324) - same |
| Logic Elements | 16,000 | 16,000 | 16,000 | 16,000 | 8,000 |
| User I/O Count | 246 | 246 | 246 | 246 | 246 |
| Embedded Multipliers (18x18) | 45 | 45 | 45 | 45 | 24 |
| Block RAM (M9K) | 558 Kbits | 558 Kbits | 558 Kbits | 558 Kbits | 256 Kbits |
| User Flash | 562,176 bits | 562,176 bits | 562,176 bits | 562,176 bits | 290,816 bits |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Automotive (AEC-Q100) | Industrial (-40C to +100C) |
| PLLs | 4 | 4 | 4 | 4 | 2 |
关键差异点
- Mid-density 16K LE with 246 I/O in the MAX 10 family （对比 10M08DCU324I7G)
- Industrial temperature grade at no extra cost （对比 10M16DCU324C8G)
- Instant-on dual-configuration flash with integrated ADC （对比 Cyclone V FPGA family)
设计说明
The 324-UBGA U324 package uses a 0.8 mm ball pitch on a 15 x 15 mm substrate. PCB fabrication must support microvia HDI (High-Density Interconnect) stack-up with at least 4-6-4 layer count. Place at least 4 stitching vias around the BGA perimeter for ground-return inductance control. Reference the Intel MAX 10 device pin connection guidelines for unused-pin tie-off (do not leave UBGA balls floating; tie NC pins to ground per the datasheet). Estimated: microvia cost adds ~15-20% to PCB fabrication but is mandatory for reliable 0.8 mm BGA assembly.
The 10M16DCU324I7G requires three supply rails: VCCINT (core 1.2 V typical, up to ~200 mA), VCCIO (I/O bank voltage, 1.2 V-3.3 V per bank), and VCCA (analog PLL/ADC 2.5 V). All rails must come up within 100 ms of each other per Intel's MAX 10 power management guide. Use a TI TPS54331 or Analog Devices ADM7150 LDO for VCCA to keep ADC noise low; ferrite beads on each VCCIO bank isolate switching noise. Decouple each VCCIO/VCCINT pin pair with 0.1 uF and 10 uF capacitors placed within 100 mils of the ball.
Common pitfalls when designing with the 10M16DCU324I7G: (1) do not exceed 16 LVDS TX channels per bank - the bank VCCIO must be 2.5 V for LVDS operation; (2) the JTAG TCK signal requires a 1-10 kohm pull-down to prevent accidental configuration mode entry; (3) the MSEL[3:0] pins must be tied to VCCIO or GND per the desired configuration mode (AS, PS, JTAG, or fast-on) - floating MSEL causes configuration failure; (4) do not toggle the nCONFIG pin during the configuration window without sequencing per datasheet. Reference Intel AN 736: Using the MAX 10 FPGA Configuration User Guide for the full checklist.
Estimated: at full logic utilization (16K LE, 45 multipliers at 200 MHz, all 246 I/Os switching), the 10M16DCU324I7G consumes approximately 0.7-1.0 W of dynamic power. The 324-UBGA package has a theta-JA of approximately 18 C/W on a 4-layer JEDEC test board, yielding a ~20C junction rise above ambient. For industrial ambient at 85C, junction stays well within the +100C limit. If designing for +100C ambient, add thermal vias under the central BGA balls and consider a 1 oz copper inner-plane stack-up for thermal relief.
合规信息
RoHS and lead-free per manufacturer product page. The I7 industrial-grade variant is not AEC-Q100 qualified; choose 10M16DAU324I7G for automotive qualification.
