10M50DCF484C7G - MAX 10 FPGA 50K LE 484-FBGA | Intel
부품 번호: 10M50DCF484C7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $62.8 | $6,280.00 |
| 500 | $55.4 | $27,700.00 |
| 1,000 | $48.9 | $48,900.00 |
10M50DCF484C7G 개요
A MAX 10 FPGA is a non-volatile programmable logic device from Intel (formerly Altera) that combines LUT-based logic, embedded memory blocks, DSP blocks, and user flash memory on a single chip. In the broader taxonomy, MAX 10 sits below Cyclone V as the low-density, low-cost, instant-on tier of Intel FPGAs and is widely used as a glue-logic and I/O-expansion companion to microprocessors. The 10M50 part number decodes as 10 = MAX 10 family, M50 = 50K logic elements; the C7 suffix indicates commercial temperature range (0 C to 85 C) and speed grade 7.
Key features include integrated configuration flash (no external boot PROM required), up to 360 general-purpose I/Os supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards, hardware multipliers (18x18) for DSP, analog-to-digital converter (ADC) blocks, and dual-purpose configuration pins. The F484 package measures 23 x 23 mm with a 1.0 mm ball pitch, making it suitable for cost-sensitive mid-density designs.
Architecturally, MAX 10 uses 4-input adaptive LUTs, 20 Kbit M9K memory blocks, and 144-bit wide DSP blocks. The non-volatile flash enables instant-on operation in under 10 ms, eliminating external boot memory cost and board space. A hard PCIe Gen2 endpoint (x1/x2) is present in the largest MAX 10 variants.
Typical applications include industrial motor control, factory automation I/O expansion, video bridging and display controllers, low-cost PCIe endpoint cards, and portable test equipment. The integrated flash also enables secure boot and field-update use cases.
When designing with this part, verify that Quartus Prime supports the latest tool version for MAX 10, since Intel has announced end-of-life for older Quartus support on selected MAX 10 die. Always check pin assignment compatibility for migrated designs.
This page synthesizes distributor pricing across 14 sources, drop-in MAX 10 same-package alternatives, and PCB-layout design notes not collected in the manufacturer datasheet alone.
드롭인 대체품: 10M50DCF484C7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M50DCF484C7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Memory, Process Technology, Embedded Memory (bits), On-chip ADC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M50DCF484C8G
✅ 드롭인✓ 재고 있음
$106.16 / 개
데이터시트 보기 →10M50DAF484C7G
✅ 드롭인✓ 재고 있음
$65.8 / 개
데이터시트 보기 →10M50DCF484I7G
✅ 드롭인✓ 재고 있음
$99.6 / 개
데이터시트 보기 →10M40DCF484C7G
✅ 드롭인✓ 재고 있음
$124.2 / 개
데이터시트 보기 →10M40DCF484C8G
✅ 드롭인✓ 재고 있음
$53.9 / 개
데이터시트 보기 →10M40DAF484C7G
✅ 드롭인✓ 재고 있음
$92.4 / 개
데이터시트 보기 →10M50DCF484C7G 최대 정격 & 전기적 특성
| Family | MAX 10 |
| Logic Elements (LE) | 50,000 |
| Embedded Memory (bits) | 1,677,312 |
| User I/O Pins | 360 |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Speed Grade | 7 |
| 동작 온도 범위 | 0 C to 85 C (Commercial) |
| 패키지 | 484-ball FBGA (F484) |
| Package Dimensions | 23 x 23 mm |
| Ball Pitch | 1.0 mm |
| Configuration Memory | Internal flash (non-volatile) |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | 3 (168 hours) |
| RoHS 상태 | Compliant |
10M50DCF484C7G 23 x 23 mm 핀 구성 가이드
10M50DCF484C7G(23 x 23 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M50DCF484C7G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M50DCF484C7G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Display Controllers, Low-Cost PCIe Endpoint Cards, Portable Test and Measurement Equipment, IoT Edge Gateways and Sensor Aggregation.
Industrial Motor Control
The 10M50DCF484C7G is well suited for industrial motor control because its 50,000 logic elements and embedded DSP blocks can implement field-oriented control (FOC) algorithms with PWM generation, encoder feedback, and current-sensing loops in a single device. With 360 user I/Os available on the F484 package, designers can connect multiple encoder channels, gate-driver control signals, and serial peripheral interfaces (SPI/I2C/UART) to host MCUs. The integrated configuration flash enables instant-on (<10 ms) operation, critical for safety-critical motor restart sequences. Engineers should note that for deployments outside 0 C to 85 C, the industrial-grade 10M50DCF484I7G should be selected instead.
추천
Factory Automation I/O Expansion
In factory-automation PLCs and distributed I/O modules, the 10M50DCF484C7G serves as a flexible I/O expander and protocol bridge. Its 360 user I/Os can be configured as LVCMOS 3.3V, LVDS, or RS-485 differential pairs to interface sensors, actuators, and industrial Ethernet MACs. The 1,677 Kbit embedded SRAM buffers high-speed EtherCAT, PROFINET, or EtherNet/IP frames without external memory. The MAX 10 instant-on flash configuration ensures deterministic boot for time-critical fieldbus nodes. Designers should verify signal-integrity margins on the 1.0 mm-pitch BGA fanout at 50 MHz+ toggle rates.
추천
Video Bridging and Display Controllers
The 10M50DCF484C7G can aggregate and convert video streams between LVDS, CMOS camera interfaces, and HDMI/DisplayPort bridges in industrial HMIs and kiosks. Its 50K LE capacity implements color-space conversion, frame-rate adaptation, and on-screen display (OSD) blending logic in a single chip. The 360 I/Os provide enough LVDS pairs for parallel camera input up to 1080p60. The non-volatile configuration flash enables instant-on video output without external boot delays. Designers targeting higher bandwidth should consider the 10M50DAF484C7G variant with hard DDR3 for line buffers.
추천
Low-Cost PCIe Endpoint Cards
For low-cost PCIe Gen2 x1 endpoint cards such as data-acquisition modules or industrial interface cards, the 10M50DCF484C7G provides a hard PCIe Gen2 IP block plus 50K LE for application logic. The 1.2 V core and integrated PLLs simplify PCIe clocking and spread-spectrum generation. With 360 user I/Os available, the F484 package supports multiple high-speed serial lanes plus parallel GPIO expansion. Designers should note that PCIe reference-clock input requires a 100 MHz HCSL source and proper AC-coupling capacitors on the TX/RX pairs.
추천
Portable Test and Measurement Equipment
Portable test instruments benefit from the 10M50DCF484C7G's instant-on capability, low power at 1.2 V core, and integration of ADC blocks for direct sensor interfacing. The 50K LE can implement DSP filtering, FFT processing, and display-driving logic in a single chip, reducing BOM cost and board area versus a discrete MCU-plus-FPGA design. The commercial 0 C to 85 C temperature range covers most indoor and outdoor-portable test scenarios. For battery-powered designs, designers should verify quiescent power budget with the Quartus Prime PowerPlay analyzer.
추천
IoT Edge Gateways and Sensor Aggregation
As an IoT edge gateway, the 10M50DCF484C7G aggregates multiple sensor interfaces (SPI, I2C, UART, LVDS) and pre-processes data with custom hardware accelerators running in DSP blocks. The 1,677 Kbit embedded SRAM buffers burst-mode sensor data before forwarding to a host processor over PCIe or Ethernet. The integrated configuration flash supports secure boot with AES-256 bitstream encryption, critical for tamper-resistant IoT deployments. Designers can pair this part with a Wi-Fi or cellular module for wireless IoT endpoints, using MAX 10's flexible GPIO for module control and status signaling.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M50DCF484C7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M50DCF484C8G | 10M50DAF484C7G | 10M50DCF484I7G | 10M40DCF484C7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same |
| Logic Elements | 50,000 LE | 50,000 LE (same) | 50,000 LE (same) | 50,000 LE (same) | 40,000 LE (-20%) |
| Speed Grade | 7 | 8 (faster) | 7 (same) | 7 (same) | 7 (same) |
| Temperature Range | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | -40 C to 100 C (Industrial) | 0 C to 85 C (Commercial) |
| Hard DDR3 Controller | No | No | Yes | No | No |
| Configuration Memory | Internal Flash (non-volatile) | Internal Flash (same) | Internal Flash (same) | Internal Flash (same) | Internal Flash (same) |
주요 차별점
- Non-volatile instant-on configuration (vs 10M50DAF484C7G)
- Commercial temperature for cost-sensitive deployments (vs 10M50DCF484I7G)
- Maximum logic density in MAX 10 F484 commercial grade (vs 10M40DCF484C7G)
설계 노트
The F484 BGA has a 1.0 mm ball pitch on a 23 x 23 mm substrate. Use a 6 or 8-layer PCB stack-up with 50 ohm controlled-impedance traces for high-speed LVDS pairs. Each BGA ball requires a 0.5 mm via-in-pad with filled-and-capped plating to minimize inductance. Route all VCCINT and VCCA power balls through a dedicated inner-layer plane stitched with 0.1 uF and 10 uF decoupling capacitors placed as close to the package as routing permits.
MAX 10 FPGAs require a 1.2 V core rail (VCCINT), a 2.5 V or 3.3 V analog supply (VCCA), and a 1.2 V to 3.3 V I/O supply per bank. Estimated: at typical industrial utilization (60% LE, 50% RAM, 25 C ambient), core current is approximately 0.5 A to 1.0 A. Use a sequencer IC such as the LTC2923 or a discrete MOSFET-based circuit to enforce 2.5 V VCCA before 1.2 V VCCINT to prevent latch-up at power-up.
Do not confuse speed grade 7 (C7G) with industrial temperature (I7G). The 'C' indicates commercial temperature and the '7' is the speed grade; 'I' indicates industrial temperature. MAX 10 bitstreams are NOT pin-compatible across speed grades - always recompile in Quartus Prime with the correct device selected. Also, the D-suffix (DAF) variants include a hard DDR3 controller that requires dedicated bank assignment and pin planning for DDR3 differential clocks.
규정 준수 정보
RoHS compliant per FindIC and Altera product page specifications. Not AEC-Q100 qualified (FPGA, not automotive-grade). For halogen-free status, consult Intel directly - not stated in verified data.