5CGXBC9E6F35C7N - Cyclone V GX FPGA, 301K LE, 35C7 Speed | Intel
부품 번호: 5CGXBC9E6F35C7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $215 | $215.00 |
| 10 | $198.5 | $1,985.00 |
| 100 | $178 | $17,800.00 |
| 250 | $168.4 | $42,100.00 |
| 500 | $159.9 | $79,950.00 |
5CGXBC9E6F35C7N 개요
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device in which the logic fabric, interconnect, and I/O routing are programmed after manufacturing, enabling hardware-level parallelism far beyond microcontrollers. Within the broader taxonomy, the 5CGXBC9E6F35C7N belongs to the Cyclone V family (low-power, mid-density FPGA), which sits within Intel's (formerly Altera's) programmable logic device (PLD) portfolio that includes Stratix (high-end) and MAX series (CPLD). FPGAs function as the silicon platform for digital signal processing, custom I/O bridging, and hardware acceleration in communications, industrial, and vision systems.
Key features include a core voltage of 1.1V, 6 transceiver channels operating up to 3.125 Gbps per the GX family profile, 4 PLL blocks, 9.45 Mbits of total embedded RAM, and PCIe Gen2 hard IP support. The 1152-pin FBGA package supports 364 user I/O pins distributed across 11 banks, while dual-configuration flash interfaces simplify in-system programming. The Cyclone V GX architecture reduces dynamic power by up to 40% relative to the prior Cyclone IV generation while maintaining backwards-compatible IP through the Quartus Prime design toolchain.
The Cyclone V GX family architecture combines an 8-input adaptive logic module (ALM) fabric, dedicated DSP blocks, M20K SRAM, and 3.125 Gbps transceivers to provide balanced logic, memory, and serial I/O bandwidth. The 28nm process node enables higher integration at lower leakage, supporting the GX variant's combination of programmable fabric and hardened serial interfaces without the power penalty of higher-node FPGAs. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and JTAG modes.
Typical applications include industrial machine vision and video bridging, motor control and factory automation, low-cost PCIe endpoint cards, protocol bridging (EtherCAT, PROFINET), and small-cell wireless backhaul. The combination of transceivers and PCIe hard IP makes it well-suited for embedded computing platforms that need custom I/O plus standard high-speed serial.
When designing with this device, ensure the 1.1V core supply decoupling uses low-ESL ceramic capacitors placed adjacent to every VCC pin, and verify the transceiver reference clock jitter meets the 3.125 Gbps link budget. Bank I/O voltages must be configured correctly before LVDS or 1.5V/1.8V/2.5V/3.3V signalling, and unused transceiver channels must be powered down per Quartus recommendations.
This page synthesizes distributor pricing, drop-in Cyclone V GX alternatives, and Quartus Prime design guidance not assembled on a single manufacturer page.
드롭인 대체품: 5CGXBC9E6F35C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CGXBC9E6F35C7N (동일 폼 팩터 및 풋프린트) — 차이점: Core Voltage, Package, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CGXBC9E7F35C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CGXBC9E7F35C8N
✅ 드롭인✓ 재고 있음
$555.1 / 개
데이터시트 보기 →5CGXBC9D7F35C8N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CGXBC9D6F35C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CGXFC9E7F35C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CGXBC9E6F35C7N 최대 정격 & 전기적 특성
| Family | Cyclone V GX |
| Logic Elements | 301,000 |
| Embedded Memory (bits) | 14,251,008 |
| Total RAM (M20K + MLAB) | 9.45 Mbits |
| Embedded 18x18 Multipliers | 560 |
| Process Node | 28 nm |
| Core Voltage | 1.1 V |
| Speed Grade | 7 |
| 패키지 | 1152-ball FBGA |
| User I/O Count | 364 (max for package) |
| Transceiver Channels | 9 (GTX, up to 3.125 Gbps) |
| PLL Count | 4 (fractional) |
| PCIe Hard IP | Gen2 (x1/x2/x4 lanes) |
| Configuration Modes | PS, FPP, JTAG |
| 동작 온도 | 0C to +85C (commercial) |
| RoHS 상태 | Compliant |
5CGXBC9E6F35C7N 1152-ball fbga 핀 구성 가이드
5CGXBC9E6F35C7N(1152-ball fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CGXBC9E6F35C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CGXBC9E6F35C7N 적합 용도: 6 애플리케이션s: Industrial Machine Vision, Motor Control and Servo Drives, Low-Cost PCIe Endpoint Cards, Protocol Bridging and Industrial Networking, Small-Cell Wireless Backhaul, Video Broadcast and Image Processing.
Industrial Machine Vision
The 5CGXBC9E6F35C7N fits industrial machine vision pipelines because its 560 18x18 multipliers and 9.45 Mbits of embedded M20K memory handle Bayer demosaicing, edge detection, and histogram accumulation in real time at 1080p60. The 364 user I/O pins connect parallel image sensors, while 3.125 Gbps GTX channels stream processed frames to a host CPU over PCIe Gen2 or CoaXPress. Compared with a discrete DSP + FPGA design, the integrated PCIe hard IP cuts BOM cost by eliminating an external bridge chip, and Quartus Prime DSP Builder accelerates image-processing IP development.
추천
Motor Control and Servo Drives
The 5CGXBC9E6F35C7N integrates the DSP resources, encoder interfaces, and fieldbus controllers needed for a single-chip industrial servo drive. Its 560 18x18 multipliers run field-oriented control loops well under 1 microsecond, while 364 GPIO handle quadrature encoders, Hall sensors, and PWM outputs. The 9 GTX channels carry EtherCAT or PROFINET over MII/RGMII bridges, and 9.45 Mbits of embedded memory hold sinusoidal and SVM lookup tables. Industrial designers value the 0C to +85C commercial range and pin-compatible extended-temp variants for harsh cabinet environments.
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Low-Cost PCIe Endpoint Cards
The 5CGXBC9E6F35C7N ships with PCIe Gen2 hard IP that supports x1, x2, and x4 lanes, eliminating external bridge chips and reducing board cost for low-cost data acquisition cards, software-defined radio peripherals, and instrumentation. Its 9 GTX channels add USB 3.0, SATA, or multi-gigabit serial links alongside the PCIe connection, and 301K logic elements accommodate custom DMA engines, on-card buffering, and protocol logic. Designers pair it with the Intel Cyclone V PCIe development kit to shorten prototype cycles.
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Protocol Bridging and Industrial Networking
The 5CGXBC9E6F35C7N's combination of 3.125 Gbps transceivers and 364 GPIO makes it a flexible bridge between legacy industrial buses (PROFIBUS, RS-485, parallel TTL) and modern Ethernet protocols. Its 301K logic elements implement EtherCAT, PROFINET IRT, or EtherNet/IP slave stacks with hardware acceleration, while the embedded M20K blocks absorb network buffering. Compared with discrete PHY-plus-MCU solutions, the integrated transceiver approach reduces BOM by 30-40% and simplifies EMC compliance for factory-floor deployments.
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Small-Cell Wireless Backhaul
Small-cell base stations and remote-radio-head designs use the 5CGXBC9E6F35C7N for CPRI or OBSAI fronthaul aggregation over the 9 GTX channels at up to 3.125 Gbps each. The 560 18x18 multipliers implement Crest Factor Reduction and Digital Pre-Distortion algorithms to linearize power amplifiers, while 9.45 Mbits of embedded memory buffers IQ samples between the antenna and baseband. The 28 nm low-power Cyclone V architecture reduces thermal dissipation in outdoor sealed enclosures.
추천
Video Broadcast and Image Processing
Broadcast routers, video walls, and image-processing appliances use the 5CGXBC9E6F35C7N for multi-format video scaling, color-space conversion, and chroma keying. The 9 GTX channels carry 3G-SDI or DisplayPort streams at up to 3.125 Gbps per link, while 560 multipliers perform real-time 4:4:4 to 4:2:2 conversion. 9.45 Mbits of embedded memory holds multiple line buffers and lookup tables for LUT-based color grading, and the F35 364-pin GPIO count interfaces HDMI, DVI, and parallel RGB panels.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CGXBC9E6F35C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CGXBC9E7F35C7N | 5CGXBC9E7F35C8N | 5CGXBC9D7F35C8N | 5CGXBC9D6F35C7N | 5CGXFC9E7F35C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FBGA (F35) | 1152-ball FBGA (F35) - same | 1152-ball FBGA (F35) - same | 1152-ball FBGA (F35) - same | 1152-ball FBGA (F35) - same | 1152-ball FBGA (F35) - same |
| Logic Elements | 301,000 | 301,000 | 301,000 | 301,000 | 301,000 | 301,000 |
| Embedded Memory (bits) | 14,251,008 | 14,251,008 | 14,251,008 | 14,251,008 | 14,251,008 | 14,251,008 |
| Embedded 18x18 Multipliers | 560 | 560 | 560 | 560 | 560 | 560 |
| Transceiver Channels / Max Rate | 9 GTX @ 3.125 Gbps | 9 GTX @ 3.125 Gbps | 9 GTX @ 3.125 Gbps | 9 GTX @ 3.125 Gbps | 9 GTX @ 3.125 Gbps | 9 GT @ 5 Gbps |
| PCIe Hard IP | Gen2 (x1/x2/x4) | Gen2 (x1/x2/x4) | Gen2 (x1/x2/x4) | Gen2 (x1/x2/x4) | Gen2 (x1/x2/x4) | Gen2 (x1/x2/x4) |
| Speed Grade | 7 (commercial) | 7 (industrial) | 8 (commercial) | 8 (industrial) | 7 (industrial) | 7 (industrial) |
| User I/O (Package Max) | 364 | 364 | 364 | 364 | 364 | 364 |
주요 차별점
- Speed-grade 7 commercial timing closure for cost-sensitive designs (vs 5CGXBC9E7F35C8N)
- Lower-cost E-grade transceivers vs higher-end GT family (vs 5CGXFC9E7F35C7N)
- Largest F35 FBGA for maximum I/O in same family (vs 5CGXBC9E6F31C7N)
설계 노트
The 5CGXBC9E6F35C7N requires four separate supply rails - 1.1V core (VCC), 2.5V analog PLL (VCCA_PLL), 1.5V/1.8V/2.5V/3.3V bank I/O (VCCIO), and a 1.5V/1.8V transceiver supply (VCCH_GXB). Each rail should have a 100 uF bulk capacitor plus 0.1 uF and 0.01 uF ceramic bypass capacitors placed within 100 mil of every pin; Intel's Cyclone V hardware reference manual recommends a star-ground layout with the regulator sense line returning to the FPGA ground pin directly.
Estimated at full transceiver utilization with 3.125 Gbps PRBS-31 traffic on all 9 GTX channels, the F35 1152-ball FBGA junction-to-ambient thermal resistance (theta_JA) of approximately 12 C/W on a 4-layer JEDEC board yields 4.8 C rise per watt. For applications dissipating above 4W, a heatsink or forced-air cooling is recommended. The Cyclone V device handbook (CV-5V2) provides per-package theta_JB and theta_JC values for board-level thermal modeling.
The 1152-ball F35 FBGA uses a 1.0 mm ball pitch requiring microvia or staggered-via PCB fabrication with at least 6 routing layers for full breakout. Intel's Cyclone V pin connection guidelines specify matched-length trace routing for the GTX channels within 150 mil of each other plus 100-ohm differential impedance; reference clock lines must be length-matched to the clock input within 50 mil to preserve jitter budget at 3.125 Gbps.
Do not leave unused GTX transceiver channels floating - they must be powered down through the Quartus Prime device programming file (XCVR_TX_DISABLED / XCVR_RX_DISABLED). Unused M20K memory blocks can be left unconfigured but should be enabled in the fitter to minimize power. Always include external JTAG pull-ups (10 kohm to VCCIO of bank 3) and a 4.7 kohm pull-down on nCONFIG if using passive serial configuration.
규정 준수 정보
RoHS and lead-free per Intel product family datasheet; AEC-Q100 is not applicable for FPGAs (use AEC-Q100-qualified companion parts for automotive-grade designs).
