5CGXBC9E7F35C8N - Cyclone V GX FPGA, 301K LE, 1152-BGA | Intel
부품 번호: 5CGXBC9E7F35C8N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $640.74 | $640.74 |
| 10 | $615.5 | $6,155.00 |
| 25 | $595.2 | $14,880.00 |
| 50 | $575.8 | $28,790.00 |
| 100 | $555.1 | $55,510.00 |
5CGXBC9E7F35C8N 개요
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that can be reconfigured after manufacturing to implement custom digital circuits. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital integrated circuits -> semiconductors, offering parallel processing and flexible I/O that microcontrollers and ASICs cannot match at low-to-mid volumes.
Key features of the 5CGXBC9E7F35C8N include 9 full-duplex transceivers supporting CPRI, PCIe Gen1, and Gigabit Ethernet protocols, variable-precision DSP blocks for high-performance fixed- and floating-point arithmetic, and hard memory controllers supporting DDR3, DDR2, and LPDDR2 interfaces. The 'C8N' speed grade indicates an 8 ns commercial 0.85V core voltage; the 'N' suffix indicates lead-free / Pb-free termination.
The Cyclone V GX architecture combines an FPGA fabric with hardened PCIe Gen1/Gen2 and transceiver IP, providing lower power and lower BOM cost versus soft-IP implementations. The 1152-BGA package provides ample signal escape for high-pin-count designs while supporting industrial-grade thermal envelopes.
Typical applications include industrial machine vision and video processing, motor control and industrial automation, broadcast video and Pro-AV equipment, wireless backhaul and small-cell baseband, and PCIe Gen2 endpoint cards for industrial computing.
When designing with this FPGA, ensure the Quartus Prime toolchain version matches the silicon revision; pay attention to transceiver reference clock jitter and PCB-controlled-impedance routing for 3.125 Gbps SERDES channels.
This page synthesizes distributor pricing, drop-in alternatives from the Cyclone V family, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: 5CGXBC9E7F35C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CGXBC9E7F35C8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Logic Elements, Core Voltage, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CGXBC9E7F35C7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CGXBC9E7F35C6N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CGXBC9E7F35I8N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CGXBC9E7F35A7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CGXBC9E6F35C8N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CGXBC9E7F35C8N 최대 정격 & 전기적 특성
| Family | Cyclone V GX |
| Logic Elements | 301,000 |
| Embedded Memory | 14,251,008 bits |
| Maximum User I/O | 560 |
| Transceivers | 9 full-duplex channels |
| Transceiver Data Rate | 3.125 Gbps |
| DSP Blocks | Variable-precision, hardware multiplier |
| Process Technology | 28 nm low-power |
| Core Voltage | 0.85 V (C8 speed grade) |
| Speed Grade | 8 (C8N) |
| 패키지 | 1152-ball FBGA (FineLine BGA) |
| Hard Memory Controller | DDR3, DDR2, LPDDR2 |
| Hard PCIe | PCIe Gen1/Gen2 x1/x2/x4 |
| 동작 온도 | 0C to +85C (commercial) |
| Lead-Free / Pb-Free | Yes (N suffix) |
| RoHS 상태 | Compliant |
5CGXBC9E7F35C8N 1152-ball fbga (fineline bga) 핀 구성 가이드
5CGXBC9E7F35C8N(1152-ball fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CGXBC9E7F35C8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CGXBC9E7F35C8N 적합 용도: 6 애플리케이션s: Industrial Machine Vision Systems, Broadcast Video Processing and Pro-AV, Industrial Motor Control and Drives, Wireless Backhaul and Small-Cell Baseband, PCIe Endpoint Add-In Cards, Medical Imaging and Diagnostics.
Industrial Machine Vision Systems
The 5CGXBC9E7F35C8N fits industrial machine vision because its 301K logic elements, 14 Mb embedded memory, and 9 transceivers handle multiple GigE Vision, Camera Link, or CoaXPress camera streams simultaneously. The variable-precision DSP blocks accelerate Bayer demosaicing, color-space conversion, and convolution filters without offloading to external processors. Its hardened PCIe Gen2 endpoint simplifies host-side frame capture over PCIe x4 to a CPU, while the 28 nm low-power process keeps board thermal design within factory-enclosure budgets. Compared to a Cyclone V E device, the GX variant's transceivers reduce external PHY BOM cost and design complexity for multi-camera aggregation setups.
추천
Broadcast Video Processing and Pro-AV
For broadcast video routing, multiviewers, and Pro-AV signal processors, the 5CGXBC9E7F35C8N provides the SERDES bandwidth to ingest 3G-SDI or HDMI-over-SDI streams while performing real-time scaling and color correction in fabric. The 3.125 Gbps transceivers support SMPTE 424M and emerging 6G/12G UHD-SDI standards via external cable equalizers. The 560 user I/O enables direct connection to multiple parallel video buses, HDMI/TMDS interfaces, and LCD panels. With PCIe x4 Gen2, the FPGA can act as a video capture card or live mixer DSP engine in broadcast studio infrastructure.
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Industrial Motor Control and Drives
The 5CGXBC9E7F35C8N is well matched to multi-axis industrial servo drives and variable-frequency drives (VFDs). Its variable-precision DSP blocks implement field-oriented control (FOC), space-vector PWM, and encoder decoding for up to 8 axes from a single device. Hardened PCIe and Ethernet interfaces enable EtherCAT, PROFINET, or EtherNet/IP master/slave communication. The 28 nm process node and 0.85 V core voltage keep power dissipation low even at full logic utilization, which is critical in sealed drive enclosures. The 560 I/O allows direct connection to multi-axis current-sensing ADCs and gate-driver PWM outputs.
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Wireless Backhaul and Small-Cell Baseband
In small-cell base stations and wireless backhaul modems, the 5CGXBC9E7F35C8N handles CPRI and OBSAI fronthaul via its 9 transceivers at 3.125 Gbps, supporting up to 9 antenna-carrier sectors in a single FPGA. The 14 Mb embedded memory buffers baseband samples between PHY and modem DSP, and the variable-precision DSP blocks implement FFT/iFFT, channel estimation, and pre-coding for LTE/5G NR PHY layers. The hardened PCIe Gen2 enables direct host connectivity to a baseband SoC. Compared to ASIC implementations, the Cyclone V GX allows rapid protocol upgrades across LTE, 5G NR, and Wi-Fi 6E in a single platform.
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PCIe Endpoint Add-In Cards
The 5CGXBC9E7F35C8N is ideal for industrial PCIe Gen2 x4 endpoint cards used in test equipment, data acquisition, and protocol analyzer products. Its hard PCIe Gen2 IP block delivers deterministic latency with minimal logic overhead, freeing the FPGA fabric for application-specific DSP, buffering, or protocol-conversion logic. The 560 I/O and 9 transceivers expose multiple high-speed serial interfaces to the host backplane, while the 14 Mb embedded memory supports high-bandwidth streaming DMA. Commercial-temperature pricing is competitive against full custom ASICs at low-volume production runs.
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Medical Imaging and Diagnostics
In medical imaging modalities such as ultrasound, endoscopy, and X-ray detectors, the 5CGXBC9E7F35C8N provides the parallel processing density to manage multi-channel analog front-end digitization and beamforming in real time. Its variable-precision DSP blocks accelerate finite-impulse-response (FIR) filters, image reconstruction, and Doppler processing at ultrasound frame rates. The transceivers aggregate data from probe-head ADCs over LVDS or serial LVDS at low latency, while the hard memory controller drives DDR3 buffers for raw frame storage. Industrial-grade variants (5CGXBC9E7F35I8N) extend operating range to -40C for portable imaging carts.
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추천 제품 요약
엔지니어링 참조 데이터: 5CGXBC9E7F35C8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CGXBC9E7F35C7N | 5CGXBC9E7F35C6N | 5CGXBC9E7F35I8N | 5CGXBC9E7F35A7N | 5CGXBC9E6F35C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (F35) | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same | 1152-FBGA (F35) - same |
| Logic Elements | 301,000 | 301,000 | 301,000 | 301,000 | 301,000 | 301,000 |
| Embedded Memory | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits |
| Speed Grade | C8 (8 ns) | C7 (7 ns) - faster | C6 (6 ns) - faster | I8 industrial, 8 ns | A7 automotive, 7 ns | C8, 6G transceiver |
| Transceivers | 9 @ 3.125 Gbps (7G) | 9 @ 3.125 Gbps (7G) | 9 @ 3.125 Gbps (7G) | 9 @ 3.125 Gbps (7G) | 9 @ 3.125 Gbps (7G) | 9 @ 2.5 Gbps (6G) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | -40C to +125C (automotive) | 0C to +85C |
| Hard PCIe Gen2 IP | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) | Yes (x1/x2/x4) |
주요 차별점
- Highest-density Cyclone V GX with 301K LE (vs 5CGXBC9D7F27C8N)
- Hardened PCIe Gen2 IP block included (vs 5CEFA9F27C7N)
- 9 integrated 3.125 Gbps transceivers (vs 5CEFA9F23I7N)
설계 노트
The 5CGXBC9E7F35C8N requires multiple power rails: 0.85 V core (VCC), 1.1 V auxiliary (VCCAUX), 1.5 V/1.8 V/2.5 V/3.0 V I/O banks (VCCIO), and 1.1 V transceiver analog (VCCT_GXB). Use the Intel Cyclone V PowerPlay Early Power Estimator (EPE) spreadsheet before schematic capture to size regulator current capacity. Recommended power sequencing: VCC first, then VCCAUX, then VCCIO, with monotonic ramp-up to prevent latch-up. Decouple each rail with a 100 nF X7R plus 10 uF bulk ceramic near each power pin pair; add 47 uF bulk tantalum at each voltage regulator output.
The 1152-FBGA package requires an 8-layer PCB minimum with stacked micro-via (laser-drilled) or stacked micro-via + buried-via stack-up to escape the 35 mm x 35 mm BGA. Reference the Cyclone V F35 package PCB layout guidelines for via-pad antipad dimensions. Match 100-ohm differential impedance on all 9 GXB transceiver channels and 90-ohm single-ended for LVDS I/O. Maintain at least 4 mm of continuous reference ground plane under the BGA; route high-speed SERDES over solid GND plane, never split planes. Use 0201 or 0402 decoupling on the BGA bottom side for shortest return-current loops.
Estimated: For the 9 full-duplex 3.125 Gbps transceivers, route each TX/RX pair as length-matched differential pairs within 0.13 mm (5 mil) of target length. Place the transceiver reference clock source (LVDS or LVPECL) within 25 mm of the CLK pins, with matched-length traces to within 0.05 mm. Use Intel's Cyclone V transceiver toolkit to simulate channel loss with your chosen PCB stack-up before tape-out; aim for less than 8 dB insertion loss at 1.5 GHz for reliable 3.125 Gbps link-up across all temperature corners.
Do not confuse Cyclone V GX (this part) with Cyclone V E (no transceivers) or Cyclone V GT (6G/10G transceivers) at order entry. Although they share the same F35 package outline for some densities, the ball-out and pin functions differ at many pins. Confirm the F35 ordering code in the Intel ordering information file (OIF) before PCB fabrication. The 'N' suffix denotes lead-free finish; 'N' is mandatory for RoHS compliance. Do not mix JTAG chain ID assignments when using multiple FPGAs in a scan chain - configure MSEL pins for the desired JTAG mode.
규정 준수 정보
RoHS and REACH compliance per Intel product declaration. Lead-free finish confirmed by N suffix in part number. AEC-Q100 qualification requires the A-suffix automotive variant; the 5CGXBC9E7F35C8N is commercial grade. Conflict minerals reporting compliant per Intel policy.
