5CSEBA2U23C6N - Cyclone V SE SoC FPGA, 25K LE, Dual ARM Cortex-A9 | Intel
부품 번호: 5CSEBA2U23C6N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $115.41 | $115.41 |
| 10 | $108.5 | $1,085.00 |
| 100 | $99.2 | $9,920.00 |
| 250 | $92.85 | $23,212.50 |
| 500 | $88.4 | $44,200.00 |
5CSEBA2U23C6N 개요
An SoC FPGA is an integrated device that combines a programmable logic fabric with one or more hard processor cores on a single die, sitting in the system hierarchy between a discrete microcontroller-plus-FPGA pair and a fully fixed ASIC. SoC FPGAs belong to the broader class of programmable logic devices (CPLDs and FPGAs) and are widely used as embedded processors when designers need both deterministic hardware acceleration from the FPGA fabric and software programmability from the ARM cores on one chip. Intel's Cyclone V family is positioned for low-power, cost-sensitive industrial and embedded applications.
Key features include the dual 32-bit ARM Cortex-A9 MPCore subsystem with CoreSight debug, an FPGA fabric with up to 25K logic elements, embedded memory, variable-precision DSP blocks, and a rich set of hardened peripherals such as Ethernet MAC, USB, CAN, SPI, I2C, and DDR controllers. The 672-pin UBGА package provides ample user I/O while supporting high-speed interfaces. The -6 industrial speed grade balances timing margin against operating frequency.
Architecture-wise, the device integrates the HPS (Hard Processor System) and the FPGA fabric through a high-bandwidth interconnect using ARM CoreLink coherent fabric bridges. This allows low-latency FPGA-to-processor data movement without external bus arbitration, critical for industrial vision pipelines and motor control. Hardened peripherals reduce soft-IP footprint and free fabric logic for custom accelerators.
Typical applications include industrial motor control, programmable logic controllers (PLCs), machine vision pre-processing, factory automation HMI gateways, and ruggedized embedded computing. The wide operating-temperature range and robust ARM ecosystem make it suitable for industrial environments requiring deterministic Linux or RTOS operation alongside custom FPGA logic.
When designing, ensure the HPS boot source (SD/eMMC/NAND/QSPI) is correctly configured through boot pins, and apply Intel's recommended power-sequencing for HPS and FPGA rails. Quartus Prime software is required for synthesis, place-and-route, and HPS configuration tool flow.
This page synthesizes distributor pricing, drop-in Cyclone V SoC alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: 5CSEBA2U23C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSEBA2U23C6N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Logic Elements, Speed Grade, HPS Maximum Frequency.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSEBA2U23C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$76.9 / 개
데이터시트 보기 →5CSEBA2U23C8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$55.5 / 개
데이터시트 보기 →5CSEBA4U23C6N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$86.2 / 개
데이터시트 보기 →5CSXFC5C6F27C7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CGXFC5C6F27C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$118 / 개
데이터시트 보기 →5CEFA5F23C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$108.75 / 개
데이터시트 보기 →5CSEBA2U23C6N 최대 정격 & 전기적 특성
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 25,000 |
| Process Technology | 28 nm |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 925 MHz |
| Core Voltage | 1.1 V |
| 패키지 | 672-pin UBGА (UBGA) 23 × 23 mm |
| User I/O | 188 |
| Speed Grade | -6 (industrial) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40°C to +100°C (industrial) |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
5CSEBA2U23C6N 672-pin ubgА (ubga) 23 × 23 mm 핀 구성 가이드
5CSEBA2U23C6N(672-pin ubgА (ubga) 23 × 23 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSEBA2U23C6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSEBA2U23C6N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Machine Vision Pre-Processing, Programmable Logic Controller (PLC), Factory Automation HMI Gateway, Ruggedized Embedded Computing, Industrial IoT Edge Gateway.
Industrial Motor Control
The 5CSEBA2U23C6N fits industrial motor control because its dual 925 MHz ARM Cortex-A9 cores execute deterministic torque and velocity control loops while the FPGA fabric implements high-speed PWM generation and quadrature encoder interfaces. Hardened CAN and SPI peripherals simplify integration with industrial fieldbus networks. The 672-pin UBGА package provides 188 user I/O for multi-axis servo control, while the -6 industrial speed grade and wide operating-temperature range ensure reliability on factory floors.
추천
Machine Vision Pre-Processing
The 5CSEBA2U23C6N fits machine vision pre-processing because the FPGA fabric delivers parallel pixel processing for image filtering, thresholding, and feature extraction at line rates above 100 MHz, while the dual Cortex-A9 cores run Linux for higher-level object detection. The HPS-FPGA coherent interconnect removes DMA bottlenecks for sensor-to-processor streaming. The 672-pin package exposes enough LVDS pairs to receive multi-megapixel camera data directly into the FPGA fabric.
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Programmable Logic Controller (PLC)
The 5CSEBA2U23C6N fits PLC designs because the dual ARM Cortex-A9 cores run deterministic IEC 61131-3 logic and Ethernet/IP or PROFINET stacks while the FPGA fabric handles high-speed digital I/O scanning, pulse-train output, and encoder feedback. Hardened USB, Ethernet MAC, and CAN interfaces reduce BOM cost versus discrete implementations. The industrial temperature grade and 28 nm low-power process support fanless DIN-rail mounting in control cabinets.
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Factory Automation HMI Gateway
The 5CSEBA2U23C6N fits factory automation HMI gateways because the dual 925 MHz Cortex-A9 cores run Qt/Linux UI stacks at 60 fps while the FPGA fabric accelerates protocol conversion between Modbus TCP, EtherCAT, and PROFINET fieldbus standards. Hardened DDR controller and display interfaces simplify HMI panel integration. The wide operating-temperature range and conformal-coating-friendly UBGА package suit industrial enclosure environments with vibration and humidity exposure.
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Ruggedized Embedded Computing
The 5CSEBA2U23C6N fits ruggedized embedded computing because the industrial temperature grade and -6 speed grade provide tolerance to thermal and voltage stress in defense and transportation deployments. The ARM Cortex-A9 cores run secure Linux or RTOS with TrustZone, while the FPGA fabric implements custom crypto and signal-processing accelerators. The 672-pin UBGА package is shock-resistant and supports conformal coating for harsh-environment assemblies.
추천
Industrial IoT Edge Gateway
The 5CSEBA2U23C6N fits industrial IoT edge gateways because the dual ARM cores run containerized analytics and MQTT brokers while the FPGA fabric performs hardware-accelerated sensor data pre-processing and anomaly detection at sub-millisecond latency. Hardened Ethernet and USB peripherals enable multi-protocol connectivity. The low-power 28 nm process supports fanless edge deployments with passive cooling, and the UBGА-672 package balances I/O count against board area.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSEBA2U23C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSEBA2U23C7N | 5CSEBA2U23C8N | 5CSEBA4U23C6N | 5CSXFC5C6F27C7N | 5CGXFC5C6F27C7N |
|---|---|---|---|---|---|---|
| Package | 672-pin UBGА (23×23 mm) | 672-pin UBGА (23×23 mm) - same | 672-pin UBGА (23×23 mm) - same | 672-pin UBGА (23×23 mm) - same | 672-pin FBGA - same footprint | 672-pin FBGA - same footprint |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -6 (industrial) | -7 | -8 | -6 - same | -7 | -7 |
| HPS | Dual Cortex-A9 925 MHz | Dual Cortex-A9 925 MHz - same | Dual Cortex-A9 925 MHz - same | Dual Cortex-A9 925 MHz - same | Dual Cortex-A9 925 MHz - same | Dual Cortex-A9 925 MHz - same |
| Transceivers | None (SE) | None - same | None - same | None - same | 3.125 Gbps (SX) | 3.125 Gbps (GT) |
| Core Voltage | 1.1 V | 1.1 V - same | 1.1 V - same | 1.1 V - same | 1.1 V - same | 1.1 V - same |
| Operating Temperature | -40°C to +100°C (industrial) | -40°C to +100°C - same | -40°C to +100°C - same | -40°C to +100°C - same | -40°C to +100°C - same | -40°C to +100°C - same |
| Process Node | 28 nm | 28 nm - same | 28 nm - same | 28 nm - same | 28 nm - same | 28 nm - same |
주요 차별점
- Only Cyclone V SE variant in 672-pin UBGА with -6 industrial speed grade (vs 5CSEBA2U23C7N)
- Lower logic element count than the 4-density variant at same package (vs 5CSEBA4U23C6N)
- No transceivers - lower cost vs SX/GT variants at same footprint (vs 5CSXFC5C6F27C7N)
설계 노트
Cyclone V SE SoC FPGAs require multiple power rails: VCC (1.1 V core), VCCPLL (PLL analog), VCCPGM (configuration), VCCPD (I/O pre-driver), VCCIO (I/O banks), and HPS-specific VCC_HPS rails. Per Intel's Cyclone V power guidelines, sequence the FPGA core rail before HPS rails during power-up to prevent latch-up; the recommended sequencer uses a power management IC such as the LTC3612 or Intel's Enpirion family. Decouple each rail with 0.1 µF X7R plus 10 µF bulk capacitors within 5 mm of the package pins.
At typical SoC workloads with HPS active and 50% FPGA utilization, the 5CSEBA2U23C6N dissipates approximately 2-4 W. The 672-pin UBGА package requires a 6×6 via array thermal pad beneath the package connected to internal ground planes for heat spreading. For enclosed industrial enclosures above 70°C ambient, attach a low-profile heat spreader to the package top, or specify the -8 speed grade to reduce switching losses at the cost of timing margin.
The 672-pin UBGА 0.8 mm pitch requires HDI PCB technology with laser-drilled micro-vias. Use 4-layer minimum stack-up with continuous ground planes under the BGA for return-path integrity. Match length within 150 mils for DDR3 SDRAM byte lanes; DDR3 trace impedance should be 50 Ω single-ended and 100 Ω differential. Isolate HPS JTAG traces with ground guards to prevent crosstalk from FPGA fabric switching noise into debug signals.
Do not connect the HPS boot pins (BSEL, CSEL) to floating signals - configure them to the correct boot source (SD/eMMC/NAND/QSPI) before power-up. The HPS reset pin must be released after the HPS PLL is stable, or the Cortex-A9 cores will fail to boot. Ensure the FPGA configuration bitstream is loaded BEFORE HPS reset release if the design uses FPGA-to-HPS bridges, otherwise the HPS will hang waiting for fabric readiness.
Place DDR3 SDRAM within 50 mm of the HPS DDR pins and route using fly-by topology with VTT termination at the end of each address/command fly-by branch. Clock traces should be length-matched to within 25 mils across all DDR byte lanes. Keep high-speed LVDS pairs (for FPGA fabric) at least 3× the dielectric height away from HPS peripheral signals (CAN, USB, I2C) to prevent coupling; both should reference a solid ground plane to avoid split-plane crossing.
규정 준수 정보
RoHS compliant per Altera/Intel product page. Industrial temperature grade -6. Not AEC-Q100 qualified (automotive not supported). Halogen-free status not explicitly stated in verified data.
