5CSEBA5U23I7 - Cyclone V SE SoC FPGA 85K LE Dual A9 | Intel
부품 번호: 5CSEBA5U23I7 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $213.97 | $213.97 |
| 10 | $192.57 | $1,925.70 |
| 100 | $171.17 | $17,117.00 |
| 500 | $156.2 | $78,100.00 |
| 1,000 | $145.5 | $145,500.00 |
5CSEBA5U23I7 개요
A System-on-Chip FPGA is a heterogeneous device that fuses a general-purpose application processor subsystem with programmable logic on a single die. The hard processor subsystem executes OS-level workloads such as Linux, RTOS tasks, or protocol stacks, while the FPGA fabric accelerates custom datapaths, parallel interfaces, and DSP pipelines. This combination bridges the gap between standalone microcontrollers and traditional FPGAs, replacing two-chip ASIC+FPGA designs with one coherent device and reducing board area, BOM cost, and inter-chip latency.
Key features of the 5CSEBA5U23I7 include 85K logic elements (LEs), approximately 4,450 Kbits of embedded memory (M10K + M9K), 87 variable-precision DSP blocks, and a high-speed HPS subsystem that includes dual ARM Cortex-A9 cores with CoreSight debug, NEON media engine, single/double-precision FPU, L1 caches, a 512 KB shared L2 cache, and integrated SDRAM, USB 2.0, Gigabit Ethernet, UART, SPI, I2C, and NAND controllers. The device supports DDR2/DDR3/LPDDR2 SDRAM with hardware ECC on the HPS side.
The architecture pairs an ARM Cortex-A9 hard processor subsystem (HPS) with Cyclone V FPGA fabric through a high-bandwidth, low-latency bridge. The FPGA fabric is organized in logic-array blocks containing adaptive logic modules (ALMs), with dedicated multiplier and accumulator primitives inside each DSP block, enabling efficient fixed- and floating-point signal processing. A multi-gigabit serial interface is not present in the SE family; high-speed serial is provided on Cyclone V GX/SX variants.
Typical applications include industrial motor control and drive, machine vision and factory automation, broadcast and professional audio/video processing, energy and smart-grid embedded systems, medical imaging front-ends, and automotive driver-assistance prototyping. The dual A9 cores run Linux or VxWorks while the FPGA fabric offloads deterministic I/O timing and DSP.
When designing with this device, pay attention to power-rail sequencing: the FPGA core, HPS core, and I/O banks each require separate supplies with defined ramp-order requirements. Use Altera/Intel Quartus Prime with the Cyclone V device support to generate pin assignments, HPS pin muxing, and the preloader/U-boot configuration.
드롭인 대체품: 5CSEBA5U23I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSEBA5U23I7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Embedded Memory, Logic Elements, DSP Blocks.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSEBA4U23I7N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →5CSEBA5U23C8N
✅ 드롭인✓ 재고 있음
$88.75 / 개
데이터시트 보기 →5CSEBA2U23I7N
✅ 드롭인✓ 재고 있음
$124 / 개
데이터시트 보기 →5CSEBA5U19I7N
✅ 드롭인✓ 재고 있음
$119.85 / 개
데이터시트 보기 →5CSEBA5U23I7 최대 정격 & 전기적 특성
| Product Type | SoC FPGA (HPS + FPGA) |
| Family | Cyclone V SE |
| Logic Elements | 85,000 |
| Hard Processor Subsystem | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| DSP Blocks | 87 (variable-precision) |
| Embedded Memory | Approx. 4,450 Kbits (M10K + M9K) |
| User I/O Count | 145 |
| 패키지 | 672-pin UBGA (U23, 23x23 mm) |
| Process Technology | 28 nm low-power |
| Memory Interfaces (HPS) | DDR2 / DDR3 / LPDDR2 with ECC |
| HPS Peripherals | Gigabit Ethernet, USB 2.0, UART, SPI, I2C, NAND |
| 동작 온도 | -40C to +100C (Industrial) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
5CSEBA5U23I7 672-pin ubga (u23, 23x23 mm) 핀 구성 가이드
5CSEBA5U23I7(672-pin ubga (u23, 23x23 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSEBA5U23I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSEBA5U23I7 적합 용도: 6 애플리케이션s: Industrial Motor Control and Drives, Machine Vision and Factory Automation, Broadcast and Professional Audio/Video Processing, Energy and Smart-Grid Embedded Systems, Medical Imaging Front-Ends, Automotive Driver-Assistance Prototyping.
Industrial Motor Control and Drives
The 5CSEBA5U23I7's dual-core ARM Cortex-A9 HPS running at 800 MHz executes motion-control algorithms and fieldbus communication such as EtherCAT or PROFINET, while the 85K logic elements and 87 variable-precision DSP blocks implement deterministic current loops, PWM generation, and encoder decoding in hardware. Industrial temperature grade (-40C to +100C) allows deployment on factory floors without derating. The HPS-side DDR3 controller with ECC supports high-bandwidth data logging and predictive maintenance analytics. Compared with a discrete MCU+FPGA solution, this single-chip SoC reduces board area and inter-chip latency, critical when closing sub-microsecond control loops on three-phase inverter stages.
추천
Machine Vision and Factory Automation
The 5CSEBA5U23I7 receives image sensor streams through its LVDS-capable GPIO and runs preprocessing such as color conversion, thresholding, and convolution on the FPGA fabric, offloading the dual A9 cores from bit-level work. The 4,450 Kbits of embedded memory buffer line-scan and area-scan frames for inspection of moving parts. A Linux stack on the HPS manages the GigE Vision or USB3 Vision protocol, publishes results over TCP/IP, and renders an HMI on a connected touchscreen. Industrial temperature range ensures reliability in unattended factory cells. The SoC integration reduces the bill of materials compared with separate processor and FPGA boards in vision systems.
추천
Broadcast and Professional Audio/Video Processing
The 85K logic elements and 87 DSP blocks of the 5CSEBA5U23I7 implement real-time video pipelines such as scaling, deinterlacing, and color-space conversion for broadcast routers and pro-AV switchers. The dual ARM Cortex-A9 cores run a Linux-based control plane for IP management (AVB, Dante, NMOS), while the FPGA fabric handles uncompressed SDI over LVDS and HDMI bridge logic. Industrial temperature operation supports OB vans and broadcast equipment racks. DDR3 with ECC on the HPS side buffers compressed streams. Quartus Prime reference designs for SDI and HDMI simplify time-to-market for broadcast OEMs upgrading from legacy FPGAs.
추천
Energy and Smart-Grid Embedded Systems
The 5CSEBA5U23I7 is well suited to smart-grid infrastructure such as substation controllers, power-quality analyzers, and renewable-energy inverters where the dual ARM Cortex-A9 cores run IEC 61850 or DNP3 protocol stacks with security libraries. The FPGA fabric accelerates phasor measurement, harmonic analysis, and anti-aliasing filters for high-voltage sensors. Industrial temperature operation tolerates outdoor enclosures and switchgear cabinets. HPS DDR3 with ECC protects against soft errors in radiation-exposed substations. The integrated design replaces multi-board solutions, reducing points of failure in unattended grid assets.
추천
Medical Imaging Front-Ends
The 5CSEBA5U23I7 supports portable ultrasound, endoscopy, and point-of-care imaging devices by combining the 85K logic elements for beamforming and front-end DSP with the dual Cortex-A9 cores for image reconstruction and DICOM networking. The industrial temperature range suits operating-room carts and ambulances. DDR3 with ECC on the HPS preserves image-data integrity against radiation from imaging sources. Low-power 28nm process reduces thermal load in handheld probes. Linux on the HPS accelerates compliance with FDA pre-market submission requirements through a stable software base.
추천
Automotive Driver-Assistance Prototyping
The 5CSEBA5U23I7 enables prototyping of advanced driver-assistance systems (ADAS) such as surround-view, lane-departure warning, and sensor-fusion ECUs by running AUTOSAR or Linux on the dual A9 cores while the FPGA fabric processes camera and radar data streams. Industrial temperature operation covers cabin installations even though the part is not AEC-Q100 qualified. The 672-pin UBGA package provides enough I/O for multi-camera MIPI-CSI bridging. Designers can use the Cyclone V SoC development kit to validate algorithms before migrating to AEC-Q100-qualified Cyclone V or Arria V SoCs in production.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSEBA5U23I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSEBA4U23I7N | 5CSEBA5U23C8N | 5CSEBA2U23I7N | 5CSEBA5U19I7N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-pin UBGA (U23, 23x23 mm) | 672-pin UBGA (U23, 23x23 mm) - same | 672-pin UBGA (U23, 23x23 mm) - same | 672-pin UBGA (U23, 23x23 mm) - same | 484-pin UBGA (U19, 19x19 mm) - smaller |
| Logic Elements | 85,000 | ~40,000 | 85,000 | ~25,000 | 85,000 |
| HPS Cores | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz |
| DSP Blocks | 87 | ~66 | 87 | ~38 | 87 |
| Embedded Memory | Approx. 4,450 Kbits | ~2,700 Kbits | Approx. 4,450 Kbits | ~1,400 Kbits | Approx. 4,450 Kbits |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| User I/O | 145 | 145 | 145 | 145 | ~75 |
주요 차별점
- Pin-compatible density scaling within the SE family (vs 5CSEBA4U23I7N)
- Industrial temperature grade with same die (vs 5CSEBA5U23C8N)
- Maximum logic density in the 672-pin U23 package (vs 5CSEBA2U23I7N)
설계 노트
The Cyclone V SE SoC requires multiple independent power rails: a 1.1V core supply for the HPS, a 1.1V core supply for the FPGA fabric, separate PLL analog supplies, and various I/O bank voltages (1.2V, 1.5V, 1.8V, 2.5V, 3.3V). Power-on sequencing is mandatory per the Cyclone V handbook: the FPGA fabric core must reach 1.1V before HPS core power is applied. Use a dedicated power manager such as the Intel EN6347 or a discrete MOSFET sequencing circuit. Estimated: sequencing from five rails typically requires 50-100 ms for the FPGA fabric to come up, after which HPS is released and the preloader/U-boot initializes SDRAM. Failure to sequence correctly can latch-up or damage the part.
The 672-pin UBGA at 23x23 mm uses a fine BGA pitch that requires microvia PCB technology (laser-drilled stacked vias) and HDI stack-up. According to Intel Cyclone V hardware design guidelines, every BGA ball should have a via-in-pad or dog-bone escape to inner layers, with the top layer reserved primarily for routing away from the device. Maintain a continuous ground plane directly beneath the BGA and use stitching vias every 2-3 mm around the periphery to suppress EMI. DDR3 trace length matching is critical for the HPS controller - target within 25 mils of the lengths provided in the Cyclone V pin-out file for the byte lanes.
A common pitfall when designing with the 5CSEBA5U23I7 is configuring HPS pin multiplexing in software while leaving the FPGA-fabric pins conflicting in the Pin Planner - Quartus Prime's pin-planner validation step catches this before compile, but skipping it leads to non-functional HPS peripherals on the bench. Another common error is using the wrong Quartus Prime device support file for the specific speed grade; the -I7 speed grade is industrial-temperature and requires the matching 'speed grade' selection during compilation. Estimated: approximately 30% of first-time Cyclone V SoC boards require an additional revision for HPS pin-mux or speed-grade mismatches. Always run 'quartus_pgm --verify' on the final SOF/JIC before declaring bring-up complete.
규정 준수 정보
RoHS compliant per Intel/Altera product page. Industrial temperature grade (-40C to +100C) but not AEC-Q100 qualified - not directly automotive qualified for under-hood use. Cross-brand automotive AEC-Q100 SoC FPGAs (e.g., Xilinx Zynq-7000 automotive variants) are not pin-compatible.
