5CSEBA5U19C8SN - Cyclone V SE SoC FPGA, 85K LE, ARM Cortex-A9 | Intel
부품 번호: 5CSEBA5U19C8SN ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $228.5 | $2,285.00 |
| 100 | $205 | $20,500.00 |
| 500 | $182.75 | $91,375.00 |
| 1,000 | $162 | $162,000.00 |
5CSEBA5U19C8SN 개요
What is an SoC FPGA? An SoC FPGA is a hybrid device that combines a traditional FPGA programmable logic fabric with a hard processor system (HPS) - in this case a single-core ARM Cortex-A9 MPCore with NEON media engine and single/double-precision floating-point unit - on a single silicon die. The HPS sits in the device taxonomy: SoC FPGA -> FPGA + ASIC processor -> programmable logic -> semiconductor. By integrating the processor, designers eliminate the need for a companion microcontroller or ASIC, reduce board area, simplify power sequencing, and enable tightly coupled hardware accelerators in the FPGA fabric that share memory with the CPU through a coherent system interconnect.
Key features of the 5CSEBA5U19C8SN include 85K logic elements (LEs), 4,450 Kbits of embedded memory, 87 variable-precision DSP blocks, and a hard memory controller supporting DDR2/DDR3/LPDDR2. The Cyclone V SE family is built on a low-power process and is qualified for industrial temperature ranges, making the part popular in motor control, industrial Ethernet, video surveillance, and machine vision. Compared to standalone FPGAs, the integrated HPS allows Linux and RTOS workloads to share the same silicon as custom logic accelerators.
The architecture uses Intel's coherent interconnect between the HPS and FPGA fabric, allowing low-latency accelerator access to processor memory. The 28 nm low-power process, variable-precision DSP, and integrated PLL/clock network reduce total BOM cost while maintaining mid-range performance. Hardware debug is supported via the ARM CoreSight trace macrocell, JTAG, and SignalTap II embedded logic analyzer inside the FPGA fabric.
Typical applications include industrial motor drives, factory automation controllers, machine vision pipelines, broadcast video processing, and embedded vision systems. Designers also use the 5CSEBA5U19C8SN in medical imaging front-ends, automotive ADAS prototyping, and smart-grid substation equipment where the HPS runs Linux while the FPGA fabric handles deterministic DSP.
When designing with this SoC, plan the HPS-to-FPGA clock and reset handshake carefully, route DDR traces with matched length and proper termination, and ensure the 1.1 V core rail can supply the in-rush current during FPGA configuration. The Quartus Prime toolchain handles pin assignment, timing closure, and HPS firmware bring-up.
This page synthesizes distributor pricing, drop-in alternative Cyclone V SE family MPNs sharing the same U19 footprint, and practical Quartus Prime design notes that are not collected in the manufacturer datasheet alone.
드롭인 대체품: 5CSEBA5U19C8SN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSEBA5U19C8SN (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, HPS Maximum Frequency, Embedded Memory, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSEBA5U19C7SN
✅ 드롭인✓ 재고 있음
$305 / 개
데이터시트 보기 →5CSEBA5U19C8N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →5CSEBA5U19C7N
✅ 드롭인✓ 재고 있음
$99.2 / 개
데이터시트 보기 →5CSEBA5U19I7SN
✅ 드롭인✓ 재고 있음
$118.4 / 개
데이터시트 보기 →5CSEBA5U19C6N
✅ 드롭인✓ 재고 있음
$118.2 / 개
데이터시트 보기 →5CSEBA5U19A7N
✅ 드롭인✓ 재고 있음
$152.4 / 개
데이터시트 보기 →5CSEBA5U19C8SN 최대 정격 & 전기적 특성
| Family | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEBA5 (U19 package) |
| Logic Elements | 85 K |
| Hard Processor System | Single-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 600 MHz |
| Process Technology | TSMC 28 nm low-power |
| Hard Memory Controller | DDR2 / DDR3 / LPDDR2 |
| Core Voltage | 1.1 V |
| 패키지 | 484-pin UFBGA (U19, 19x19 mm) |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | 0C to +85C (commercial) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| Configuration Method | Serial / Parallel flash, JTAG |
5CSEBA5U19C8SN 484-pin ufbga (u19, 19x19 mm) 핀 구성 가이드
5CSEBA5U19C8SN(484-pin ufbga (u19, 19x19 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSEBA5U19C8SN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSEBA5U19C8SN 적합 용도: 7 애플리케이션s: Industrial Motor Drives and Servo Control, Machine Vision and Image Processing, Broadcast Video Processing and Conversion, Automotive ADAS Prototyping and Sensor Fusion, Medical Imaging Front-End and Signal Conditioning, Smart Grid Substation and Energy Management, Embedded Linux Networking Appliances.
Industrial Motor Drives and Servo Control
The 5CSEBA5U19C8SN is widely adopted in industrial motor drive and servo controller designs because the single-core ARM Cortex-A9 HPS at 600 MHz can run Linux or an RTOS to implement high-level motion control loops, while the 85K logic elements of FPGA fabric deliver deterministic, sub-microsecond PWM generation, encoder (QEI) decoding, and field-oriented control (FOC) accelerators. The integrated DDR3 hard memory controller feeds the HPS and FPGA with shared system memory, eliminating external SDRAM bridges. Compared to a discrete MCU plus FPGA, this SoC cuts PCB area by roughly 40 percent and removes chip-to-chip latency, which is critical in multi-axis servo loops where torque loop bandwidths exceed 5 kHz. The Cyclone V SE family is qualified for industrial environments, making it suitable for factory-floor inverters and CNC controllers.
추천
Machine Vision and Image Processing
In machine vision pipelines, the 5CSEBA5U19C8SN's FPGA fabric accelerates image preprocessing - Bayer demosaicing, lens distortion correction, edge detection - at line-rate while the Cortex-A9 HPS runs the OpenCV-based classifier and Ethernet-based result reporting. The 87 variable-precision DSP blocks handle 2D convolution and Sobel kernels at video rates up to 1080p60. With on-chip SDRAM and an integrated processor, the design avoids the FPGA-to-ARM data bottleneck that arises with separate chips over parallel buses. The 484-pin UFBGA package also supports multiple MIPI CSI-2 or LVDS camera interfaces, enabling multi-camera industrial inspection systems with a single SoC.
추천
Broadcast Video Processing and Conversion
Broadcast studios and AV-over-IP products use the 5CSEBA5U19C8SN to perform SDI-to-IP bridging, format conversion (3G-SDI to HDMI), and HDR tone mapping. The FPGA fabric implements SDI phy interfaces, color-space conversion, and audio embedding/extraction, while the ARM Cortex-A9 HPS runs a Linux control stack for SNMP, web UI, and JSON-based orchestration. The device's high-speed transceivers support 3G-SDI rates up to 2.97 Gbps per lane, and the DDR3 controller acts as a frame buffer for cross-rate conversion. Power consumption stays modest thanks to the 28 nm low-power process.
추천
Automotive ADAS Prototyping and Sensor Fusion
Although the 5CSEBA5U19C8SN is commercial grade, it is commonly used by automotive Tier-1 suppliers for ADAS prototyping and pre-production sensor fusion ECUs. The HPS runs AUTOSAR or Linux for object classification and sensor fusion, while the FPGA fabric aggregates raw data from multiple radar, lidar, and camera interfaces with deterministic latency. The 85K logic elements are sufficient for a multi-camera surround-view pre-processor. Production-bound designs migrate to the AEC-Q100 qualified 5CSEBA5U19A7N variant, which is a drop-in replacement in the same U19 package.
추천
Medical Imaging Front-End and Signal Conditioning
In ultrasound and endoscopy systems, the 5CSEBA5U19C8SN serves as the front-end controller and DSP processor. The FPGA fabric implements beamforming and beam steering across 32 to 128 channels with sample rates above 40 MSPS, while the HPS runs the user interface, image compression, and DICOM stack. The integrated architecture avoids high-pin-count parallel buses between an FPGA and a separate ARM SoC, simplifying the medical device's EMC compliance. Designers also leverage the SoC's secure boot and ARM TrustZone for HIPAA-aligned patient data handling.
추천
Smart Grid Substation and Energy Management
Smart-grid substation equipment uses the 5CSEBA5U19C8SN to implement IEC 61850 communication, phasor measurement, and digital fault recording. The FPGA fabric handles high-speed protection logic and analog front-end sampling, while the ARM Cortex-A9 HPS runs the IEC 61850 stack, GOOSE messaging, and SCADA integration over Ethernet. The wide industrial temperature variants (5CSEBA5U19I7SN) ensure reliable operation in unconditioned substation cabinets. Conformal coating and long-term Intel FPGA support make this device attractive for utilities with 20-year deployment horizons.
추천
Embedded Linux Networking Appliances
The 5CSEBA5U19C8SN is a popular platform for embedded networking appliances such as industrial routers, protocol gateways, and edge gateways. The Cortex-A9 HPS runs a full Linux distribution (typically Yocto or Buildroot) with networking daemons, VPN, and firewalling, while the FPGA fabric accelerates packet parsing, deep packet inspection, or hardware crypto offload. The integrated DDR3 controller supports up to 4 GB of system memory, enabling in-memory flow tables for SDN applications. The device also supports Precise Time Protocol (PTP) hardware timestamping for synchronized industrial Ethernet.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSEBA5U19C8SN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSEBA5U19C7SN | 5CSEBA5U19C8N | 5CSEBA5U19C7N | 5CSEBA5U19I7SN | 5CSEBA5U19C6N | 5CSEBA5U19A7N |
|---|---|---|---|---|---|---|---|
| Package | 484-pin UFBGA (U19) | 484-pin UFBGA (U19) - same | 484-pin UFBGA (U19) - same | 484-pin UFBGA (U19) - same | 484-pin UFBGA (U19) - same | 484-pin UFBGA (U19) - same | 484-pin UFBGA (U19) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC |
| Speed Grade | C8 | C7 | C8 | C7 | I7 | C6 | A7 (automotive) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Automotive AEC-Q100 |
| Logic Elements | 85K | 85K | 85K | 85K | 85K | 85K | 85K |
| HPS Configuration | Single-core ARM Cortex-A9 | Single-core ARM Cortex-A9 | Single-core ARM Cortex-A9 | Single-core ARM Cortex-A9 | Single-core ARM Cortex-A9 | Single-core ARM Cortex-A9 | Single-core ARM Cortex-A9 |
| Process Technology | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
주요 차별점
- Single-core ARM Cortex-A9 HPS integration at 600 MHz (vs 5CEBA4F23C8N (Cyclone V E, no HPS))
- Same U19 package enables transparent speed grade and temperature grade migration (vs 5CSEBA5U19I7SN (industrial grade))
- Lower speed grade C7 variant offers cost reduction for power-sensitive designs (vs 5CSEBA5U19C7SN (speed grade 7))
- Automotive AEC-Q100 variant available in same package (vs 5CSEBA5U19A7N (automotive grade))
설계 노트
The 5CSEBA5U19C8SN requires a clean 1.1 V core rail capable of delivering several amps during FPGA configuration and HPS boot. Use a buck regulator with at least 6 A peak headroom (e.g., LTM4628 or TPS54360) and place decoupling capacitors (100 nF + 10 uF bulk per rail) within 5 mm of every power pin. The HPS and FPGA fabric have separate power domains - sequence the HPS core rail before the FPGA fabric if your boot ROM depends on HPS first-stage bootloading. Add a POR (power-on reset) supervisor such as TPS3823 to ensure clean reset behavior across cold-start conditions.
The 484-pin UFBGA package has 0.8 mm ball pitch, which demands 4-layer PCB stack-up with microvia or laser-drilled via-in-pad for reliable BGA breakout. Match DDR3 trace lengths to within 25 mils (0.635 mm) within each byte lane, and keep differential pairs (transceivers, LVDS) length-matched to within 10 mils. Route HPS and FPGA fabric I/O banks to dedicated connector sides to simplify signal-integrity simulation. Maintain a continuous ground plane beneath the BGA - never route signals under the package - to preserve signal integrity for 3G-SDI and high-speed transceiver lanes.
Three common pitfalls when bringing up a Cyclone V SE SoC: (1) Failing to configure the HPS-to-FPGA bridges before HPS boot can hang the system; configure the FPGA first or use the HPS bootloader to load the FPGA image from QSPI. (2) Mixing 1.5 V and 1.8 V I/O standards on shared banks causes contention - verify bank VCCIO voltages match your chosen I/O standard in the Quartus Pin Planner. (3) Industrial temperature variants (I7) require factory-trimmed oscillator compensation for cold-start accuracy; do not substitute commercial crystals without retesting the HPS warm-up cycle.
High-speed transceiver channels (when used) require AC-coupled capacitive coupling on each lane and 100-ohm differential impedance matching. Use HyperLynx or SiSoft SI simulation to verify eye-diagram compliance before layout freeze. For HPS DDR3, enable Quartus's memory controller's read/write leveling and gate training, and follow the Intel pin connection guidelines for VREF and VTT termination to prevent intermittent boot failures at extreme temperatures.
규정 준수 정보
RoHS compliant per Altera/Intel product page. AEC-Q100 qualification not applicable to the commercial C8 part - migrate to the A7N variant for automotive. Halogen-free status not explicitly stated in verified data.
