5CSEBA2U19C8SN - Cyclone V SE SoC FPGA, 25K LE | Intel
부품 번호: 5CSEBA2U19C8SN ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285.5 | $285.50 |
| 10 | $268.2 | $2,682.00 |
| 100 | $245.75 | $24,575.00 |
| 500 | $222.1 | $111,050.00 |
| 1,000 | $198.4 | $198,400.00 |
5CSEBA2U19C8SN 개요
A SoC FPGA is a class of system-on-chip that fuses a hard ARM Cortex-A9 processor subsystem with an FPGA fabric on the same silicon die, allowing low-latency FPGA-to-processor bridging through high-bandwidth AXI and ACP interfaces. In the broader product taxonomy, a SoC FPGA belongs to the FPGA & CPLD family, which sits under programmable logic devices and, ultimately, the broader semiconductor ecosystem. The Cyclone V SE family specifically targets low-power, cost-sensitive embedded applications where deterministic processing and parallel hardware acceleration must coexist on a single device.
Key features of the 5CSEBA2U19C8SN include the ARM Cortex-A9 MPCore with NEON media engine and single/double-precision FPU, integrated CoreSight debug and trace, on-chip HPS peripherals (EMAC, USB, UART, SPI, I2C, SD/eMMC controllers), variable-precision DSP blocks, and embedded M10K memory blocks. The HPS-to-FPGA bridges (AXI-32/64, ACP) enable low-latency coprocessing patterns. The 484-pin UBGA package supports a high I/O count required for industrial-grade designs.
Architecturally, the device uses a 28 nm low-power process with adaptive logic modules (ALMs) and 8-input fracturable look-up tables (LUTs), giving designers variable-precision DSP and flexible memory mapping. The hard ARM subsystem offloads OS and protocol-stack tasks from the fabric, freeing LUTs and DSP blocks for parallel DSP, video, or signal-processing pipelines.
Typical applications include industrial motor control with deterministic HPS plus FPGA partitioning, machine vision and video processing pipelines using FPGA fabric acceleration, factory automation PLCs with real-time Ethernet stacks running on the HPS, and ruggedized IoT gateways combining Linux on the Cortex-A9 with custom FPGA sensor aggregation.
When designing with this device, plan power sequencing carefully: the HPS and FPGA fabric have separate POR domains and require coordinated ramp. Use Intel's Quartus Prime with the SoC EDS toolkit, and verify pin assignments against the device-specific pin-out file before board fabrication. Memory interface pins require DQ/DQS grouping that the tool will validate, but pre-planning the board layer stack-up avoids costly re-spins.
This page synthesizes distributor pricing, drop-in alternatives within the Cyclone V family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: 5CSEBA2U19C8SN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSEBA2U19C8SN (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Logic Elements, Mounting Type, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSEBA4U19C7SN
✅ 드롭인✓ 재고 있음
$218 / 개
데이터시트 보기 →5CSEBA5U19C7SN
✅ 드롭인✓ 재고 있음
$305 / 개
데이터시트 보기 →5CSEBA6U19I7SN
✅ 드롭인✓ 재고 있음
$305 / 개
데이터시트 보기 →5CSEBA2U19C8SN 최대 정격 & 전기적 특성
| Product Type | System-on-Chip FPGA (SoC FPGA) |
| Series | Cyclone V SE |
| FPGA Logic Elements | 25,000 LE |
| HPS Processor Core | ARM Cortex-A9 MPCore (single/dual-core) |
| HPS Maximum Frequency | 600 MHz |
| Process Technology | 28 nm low-power |
| 패키지 | 484-pin UFBGA / UBGA (19x19 mm) |
| 실장 유형 | Surface Mount |
| 공급 전압 | 1.1 V core |
| HPS Peripherals | EMAC, USB, UART, SPI, I2C, SD/eMMC |
| Debug Support | CoreSight debug and trace |
| DSP Blocks | Variable-precision DSP blocks |
| Embedded Memory | M10K memory blocks |
| RoHS 상태 | Compliant |
| Lead Free | Yes |
5CSEBA2U19C8SN 484-pin ufbga / ubga (19x19 mm) 핀 구성 가이드
5CSEBA2U19C8SN(484-pin ufbga / ubga (19x19 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSEBA2U19C8SN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSEBA2U19C8SN 적합 용도: 6 애플리케이션s: Industrial Motor Control, Machine Vision and Video Processing, Factory Automation PLC, IoT Edge Gateway, Medical Diagnostic Equipment, Automotive Infotainment and ADAS.
Industrial Motor Control
The 5CSEBA2U19C8SN excels in industrial motor control where the ARM Cortex-A9 MPCore HPS runs real-time control loops and communication protocols (EtherCAT, CANopen, PROFINET) while the 25K LE FPGA fabric accelerates encoder feedback processing, PWM generation, and current/voltage sampling. Per the Intel Cyclone V SE datasheet, the HPS-to-FPGA ACP bridge provides deterministic sub-microsecond latency critical for time-critical servo loops. The device's 600 MHz HPS delivers ample headroom for Linux or RTOS stacks handling safety logic, while the fabric offloads parallel math from the CPU. The 484-pin UFBGA package supports the high I/O count required for multi-axis drives, encoder interfaces, and isolation barriers.
추천
Machine Vision and Video Processing
For machine vision pipelines, the 5CSEBA2U19C8SN's variable-precision DSP blocks accelerate image preprocessing (filtering, edge detection, color space conversion) while the HPS runs OpenCV or custom algorithms. The FPGA fabric handles pixel-rate processing at camera sensor speeds (60-120 fps for HD), and the ARM cores coordinate multi-camera systems and network protocols. According to Intel documentation, the M10K memory blocks provide on-chip frame buffer storage eliminating external SDRAM latency. The 25K LE fabric is sufficient for 720p processing; designers targeting 1080p or 4K should consider the 5CSEBA4U19C7SN or 5CSEBA5U19C7SN variants in the same 484-pin UFBGA package.
추천
Factory Automation PLC
The 5CSEBA2U19C8SN is ideal for PLC controllers requiring deterministic I/O scanning and industrial protocol stack handling. The ARM Cortex-A9 MPCore runs the IEC 61131-3 runtime (CODESYS, PLCopen) plus industrial Ethernet (EtherCAT, EtherNet/IP, Modbus TCP), while the FPGA fabric implements high-speed digital I/O, quadrature decoding, and PWM outputs. The HPS-to-FPGA bridges enable sub-100-microsecond scan times required for high-speed automation. The 28 nm low-power process keeps thermal dissipation manageable in sealed control cabinet enclosures, and the 484-pin UFBGA package supports the high I/O count typical of multi-axis PLC designs.
추천
IoT Edge Gateway
The 5CSEBA2U19C8SN enables ruggedized IoT edge gateways combining Linux on the Cortex-A9 with custom FPGA sensor aggregation. The HPS handles TLS encryption, MQTT/CoAP protocol stacks, and cloud connectivity, while the fabric pre-processes sensor data (filtering, feature extraction) before CPU handoff, reducing processor load by 5-10x. The integrated EMAC, USB, and SD/eMMC peripherals simplify connectivity to cellular modems, Wi-Fi modules, and local storage. Per Intel's Cyclone V SE datasheet, the low-power 28 nm process enables fanless operation at 3-5W typical power, suitable for industrial edge deployments.
추천
Medical Diagnostic Equipment
For medical imaging and diagnostic systems, the 5CSEBA2U19C8SN provides the ARM Cortex-A9 HPS for user interface, data logging, and DICOM compliance, while the FPGA fabric processes ultrasound beamforming, ECG signal analysis, or MRI preprocessing. The deterministic HPS-to-FPGA ACP bridge is critical for medical-grade real-time signal processing where latency variance is unacceptable. The 484-pin UFBGA package and 28 nm low-power process meet the reliability and thermal requirements for medical device certification. Designers should verify compliance with IEC 60601-1 and select the 5CSEBA6U19I7SN industrial-grade variant for extended temperature range medical applications.
추천
Automotive Infotainment and ADAS
The 5CSEBA2U19C8SN suits automotive infotainment head units and ADAS sensor fusion where the ARM Cortex-A9 runs the IVI OS (Linux, Android Automotive) while the FPGA fabric handles camera input preprocessing, radar data fusion, and CAN/LIN bus interfacing. The 600 MHz HPS supports multi-display rendering and audio processing, while the fabric accelerates H.264 decode for rear-seat entertainment. For production automotive designs requiring AEC-Q100 qualification, designers should consider the automotive-grade Cyclone V variants or migrate to Intel Cyclone V SoC automotive family in the same 484-pin UFBGA footprint.
추천
엔지니어링 참조 데이터: 5CSEBA2U19C8SN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSEBA4U19C7SN | 5CSEBA5U19C7SN | 5CSEBA6U19I7SN |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 484-pin UFBGA (19x19 mm) | 484-pin UFBGA (19x19 mm) - same | 484-pin UFBGA (19x19 mm) - same | 484-pin UFBGA (19x19 mm) - same |
| Logic Elements | 25K LE | 40K LE | 85K LE | 110K LE |
| HPS Processor | ARM Cortex-A9 MPCore | ARM Cortex-A9 MPCore | ARM Cortex-A9 MPCore | ARM Cortex-A9 MPCore |
| HPS Frequency | 600 MHz | 600 MHz | 600 MHz | 600 MHz |
| Temperature Grade | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Industrial (-40C to 100C) |
| Process Technology | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
| Series | Cyclone V SE | Cyclone V SE | Cyclone V SE | Cyclone V SE |
주요 차별점
- Balanced LE count for mid-range SoC FPGA designs (vs 5CSEBA6U19I7SN)
- Commercial temperature grade for standard applications (vs 5CSEBA6U19I7SN)
- Sufficient logic for 720p video pipeline (vs 5CSEBA4U19C7SN)
설계 노트
The 5CSEBA2U19C8SN has separate power domains for the HPS subsystem and FPGA fabric, requiring coordinated power-on-reset (POR) sequencing. According to the Intel Cyclone V Power Management User Guide, the HPS POR must complete before the fabric enters user mode, or the AXI bridges will not initialize. Use the Intel-recommended power sequencer or a discrete RC delay circuit tied to HPS reset. Typical core supply is 1.1 V; HPS I/O and fabric I/O banks may require 1.8 V, 2.5 V, or 3.3 V depending on I/O standards selected in Quartus Prime.
The 484-pin UFBGA package has 0.8 mm ball pitch requiring 4-layer or 6-layer PCB with microvia technology for fan-out routing. Per the Cyclone V device datasheet pin connection guidelines, unused HPS peripheral pins should be left floating (with internal pull-down enabled in software) to minimize power consumption. DDR3 memory interface pins require matched-length routing within 25 ps skew across DQ/DQS groups - the Quartus Prime pin planner validates this but pre-planning the board layer stack-up avoids costly re-spins. Exposed die pad (if present) must be soldered to the PCB ground plane for thermal dissipation.
A common pitfall when designing with the 5CSEBA2U19C8SN is attempting to use the HPS peripherals without configuring the pin multiplexing in the Quartus Prime HPS component editor first. Per Intel's SoC EDS documentation, GPIO, UART, and SPI peripheral pin assignments are software-configurable but require a regenerated preloader image. Another frequent issue is forgetting to assign the boot mode pins (BSEL/AVL) for QSPI, NAND, SD card, or JTAG boot sources - these are strap pins sampled at HPS reset and cannot be changed in software.
규정 준수 정보
RoHS compliant per distributor listing and Intel product page. Not AEC-Q100 qualified - for automotive applications, consider automotive-grade Cyclone V SoC variants. Operating temperature grade not explicitly stated in provided web data - see [DATA_NEEDED] in specs.
