5CSEBA5U19I7N - Cyclone V SE SoC FPGA 85K LE Dual ARM Cortex-A9 | Intel
부품 번호: 5CSEBA5U19I7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $179.04 | $179.04 |
| 10 | $165.2 | $1,652.00 |
| 100 | $148.5 | $14,850.00 |
| 500 | $132.1 | $66,050.00 |
| 1,000 | $119.85 | $119,850.00 |
5CSEBA5U19I7N 개요
An SoC FPGA is a class of heterogeneous computing device that tightly couples a general-purpose processor subsystem (in this case dual ARM Cortex-A9 with CoreSight debug) to a programmable logic fabric on a single die. In the broader taxonomy it sits between pure microcontrollers (software-only) and pure FPGAs (hardware-only), enabling hardware acceleration in the fabric while running Linux, RTOS, or bare-metal code on the ARM cores. The Cyclone V SE family targets cost-sensitive, low-power embedded applications.
Key features of the 5CSEBA5U19I7N include 85,000 programmable logic elements, approximately 4,450 Kbits of embedded memory, 87 variable-precision DSP blocks (18x18 multipliers), and integrated transceivers at up to 5 Gbps. The HPS exposes 66 user I/O from the FPGA side plus ARM-standard peripherals (USB 2.0 OTG, EMAC, CAN, SPI, I2C, UART, SD/MMC, NAND flash controller). The 28 nm TSMC low-power process reduces both static and dynamic power versus previous-generation Cyclone IV devices.
Architecturally, the device uses an AXI/ACP coherent bridge to allow the Cortex-A9 cores and FPGA fabric to share memory coherently. This enables FPGA accelerators to operate on the same data buffers the CPU is reading and writing, eliminating software-controlled data copies and dramatically reducing latency for DSP, packet processing, and machine-learning inference tasks.
Typical applications include industrial motor control with hardware-accelerated field-oriented control loops, low-power video surveillance edge analytics, factory automation programmable logic controllers (PLCs) with HMI capability, automotive ADAS sensor pre-processing, and PCIe-based embedded computing boards. The HPS integrates the Ethernet, USB, and storage controllers, freeing FPGA fabric for differentiated IP.
When designing with the 5CSEBA5U19I7N, allocate at least 6 PCB layers for the 484-pin UBG package, route all power rails (VCC, VCCPD, VCC_HPS, VCCA_PLL) with decoupling within 100 mil of every pin, and use the Quartus Prime SoC Edition toolchain for combined FPGA and HPS firmware development. Plan boot source (SD/eMMC/QSPI) in the HPS pin mux early in schematic capture.
This page synthesizes distributor pricing, drop-in package-compatible alternatives within the Cyclone V SE family, and practical design notes not consolidated in the manufacturer datasheet. All data is current as of 2026-09-06.
드롭인 대체품: 5CSEBA5U19I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSEBA5U19I7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, DSP Blocks, Embedded Memory, Logic Elements, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSEBA5U19C7N
✅ 드롭인✓ 재고 있음
$99.2 / 개
데이터시트 보기 →5CSEBA5U19I7LN
✅ 드롭인✓ 재고 있음
$142.8 / 개
데이터시트 보기 →5CSEBA5U19C6N
✅ 드롭인✓ 재고 있음
$118.2 / 개
데이터시트 보기 →5CSEBA5U19C8N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →5CSEBA5U19A7N
✅ 드롭인✓ 재고 있음
$152.4 / 개
데이터시트 보기 →5CSEBA5U19I7N 최대 정격 & 전기적 특성
| Product Type | SoC FPGA (System-on-Chip FPGA) |
| Series | Cyclone V SE |
| Logic Elements | 85,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Frequency | 800 MHz (typical), up to 925 MHz |
| Process Technology | 28 nm TSMC low-power |
| 패키지 | 484-pin UBG (UFBGA) 19x19 mm |
| 공급 전압 | 1.1 V core |
| FPGA User I/O | 66 (per datasheet front-page snippet) |
| Embedded Memory | Approximately 4,450 Kbits |
| DSP Blocks | 87 variable-precision (18x18 multipliers) |
| Transceivers | Up to 5 Gbps (Cyclone V SE feature) |
| HPS Peripherals | USB 2.0 OTG, EMAC, CAN, SPI, I2C, UART, SD/MMC, NAND |
| 동작 온도 | -40C to +100C (Industrial grade, suffix I) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (per Heisener listing and product family) |
5CSEBA5U19I7N 484-pin ubg (ufbga) 19x19 mm 핀 구성 가이드
5CSEBA5U19I7N(484-pin ubg (ufbga) 19x19 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSEBA5U19I7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSEBA5U19I7N 적합 용도: 7 애플리케이션s: Industrial Motor Control, Smart Surveillance and Edge Video Analytics, Automotive ADAS Sensor Pre-Processing, Industrial IoT Gateway with Protocol Conversion, Test and Measurement Instrumentation, Medical Patient Monitoring Devices, Aerospace Flight Control and Avionics.
Industrial Motor Control
The 5CSEBA5U19I7N fits industrial motor control because its 85K logic elements host hardware-accelerated field-oriented control (FOC) loops with 87 variable-precision DSP blocks running Clarke, Park, and inverse Park transforms at sub-microsecond latency, while the dual ARM Cortex-A9 cores execute the supervisory speed/torque control loop, the CANopen or EtherCAT communications stack, and any HMI rendering. Placed on a 6-layer PCB with proper thermal management for the 28 nm SoC, the 484-pin UBG package delivers industrial-temperature operation (-40C to +100C). Unlike a discrete DSP plus MCU architecture, this single-chip SoC eliminates inter-chip latency and reduces BOM cost by approximately 30%.
추천
Smart Surveillance and Edge Video Analytics
The 5CSEBA5U19I7N is well suited for IP camera and edge video analytics because its dual ARM Cortex-A9 cores run the Linux camera stack and ONVIF networking, while the FPGA fabric implements hardware-accelerated H.264/H.265 motion detection, face detection CNN inference, and pre-processing pipelines. The 87 DSP blocks handle Sobel and Laplacian filters in real time at 1080p60, offloading the CPU. With USB 2.0 and EMAC already integrated in the HPS, designers avoid external PHY bridges. The -40C to +100C industrial temperature range supports outdoor PoE-powered camera housings where ambient temperatures swing widely.
추천
Automotive ADAS Sensor Pre-Processing
For automotive ADAS pre-processing, the 5CSEBA5U19I7N provides automotive-grade temperature support via its 'I7' industrial grade designation and the 85K LE fabric handles raw radar or lidar point-cloud aggregation, object tracking, and sensor fusion at rates the Cortex-A9 cores alone cannot sustain. The HPS CAN interface aggregates vehicle bus data while the FPGA fabric maintains deterministic timing on time-sensitive sensor pipelines. Compared to a pure software implementation, the FPGA pre-processing reduces sensor-to-decision latency by approximately 5x, a critical margin for collision-avoidance features. The 484-pin UBG package suits under-hood or behind-grille mounting with conformal coating.
추천
Industrial IoT Gateway with Protocol Conversion
The 5CSEBA5U19I7N excels in industrial IoT gateways that must convert between Modbus RTU, Modbus TCP, EtherCAT, PROFINET, and OPC-UA protocols. The dual Cortex-A9 cores run the protocol translation stack and TLS-secured MQTT publishing, while the FPGA fabric implements hardware-accelerated serial protocol decoding (UART, SPI) for legacy sensor aggregation. The 66 FPGA user I/O allow direct connection to multiple RS-485/RS-232 transceivers without external bus switches. With the EMAC and USB already in the HPS, the design needs only one Ethernet PHY for uplink connectivity, simplifying the BOM and reducing gateway cost versus separate MCU plus FPGA architectures.
추천
Test and Measurement Instrumentation
In test and measurement equipment such as protocol analyzers, oscilloscopes, and bit-error-rate testers, the 5CSEBA5U19I7N provides the deterministic hardware response time of an FPGA plus the Linux-friendly Cortex-A9 subsystem for display rendering, USB-TMC, and LAN-based SCPI control. The 87 DSP blocks implement FIR filtering and FFT pre-processing on captured waveforms, while the FPGA fabric drives the ADC/DAC interfaces at line rate. The 800 MHz ARM cores handle the touch-screen UI without missing display updates during acquisition. Designers benefit from the Quartus Prime SoC Edition flow that compiles both fabric and HPS firmware in one project.
추천
Medical Patient Monitoring Devices
Medical patient monitoring devices benefit from the 5CSEBA5U19I7N's combination of deterministic real-time response (FPGA fabric) and high-level operating system capability (Linux on Cortex-A9) for touchscreen UIs and HL7/EHR connectivity. The FPGA implements hardware-accelerated ECG signal conditioning, QRS detection, and arrhythmia classification at sub-millisecond latency, freeing the CPU for trend analysis and alarm management. The HPS USB and Ethernet interfaces connect directly to hospital networks for HL7 messaging. Industrial temperature operation supports equipment-room environments, and the long-lifecycle Intel Altera Cyclone V family ensures multi-year product availability for medical certification cycles.
추천
Aerospace Flight Control and Avionics
The 5CSEBA5U19I7N serves aerospace flight control subsystems where deterministic FPGA response handles sensor sampling and actuator command updates, while the dual Cortex-A9 runs guidance and navigation code under a RTOS. The industrial-grade temperature range (-40C to +100C) supports avionics bay environments, and the 484-pin UBG package's high ball density enables compact board layouts in weight-constrained airframes. Designers implement triple-redundant sensor voting in the FPGA fabric with the HPS arbitrating mode logic. The Cyclone V family supports DO-254 design assurance workflows, and Intel provides radiation-tolerant characterization data for defense and aerospace programs.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSEBA5U19I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSEBA5U19C7N | 5CSEBA5U19I7LN | 5CSEBA5U19C6N | 5CSEBA5U19C8N | 5CSEBA5U19A7N |
|---|---|---|---|---|---|---|
| Package | 484-pin UBG (UFBGA) 19x19 mm | 484-pin UBG (UFBGA) 19x19 mm - same | 484-pin UBG (UFBGA) 19x19 mm - same | 484-pin UBG (UFBGA) 19x19 mm - same | 484-pin UBG (UFBGA) 19x19 mm - same | 484-pin UBG (UFBGA) 19x19 mm - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 85,000 | 85,000 | 85,000 | 85,000 | 85,000 | 85,000 |
| DSP Blocks | 87 | 87 | 87 | 87 | 87 | 87 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (AEC-Q100) |
| Speed Grade | I7 (industrial, mid-speed) | C7 (commercial, mid-speed) | L7 (industrial, low-power) | C6 (commercial, slow) | C8 (commercial, fast) | A7 (automotive, mid-speed) |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| FPGA User I/O | 66 | 66 | 66 | 66 | 66 | 66 |
주요 차별점
- Hard ARM Cortex-A9 dual-core HPS on the same die as 85K LE fabric (vs 5CEFA4U19I7 (Cyclone V E without HPS))
- Industrial temperature grade (-40C to +100C) standard (vs 5CSEBA5U19C7N (commercial 0-85C))
- 87 variable-precision DSP blocks support 18x18 multipliers with optional 9x9 packing (vs 5CSEBA4U19I7N (40K LE variant, ~48 DSP blocks))
- 5 Gbps transceivers integrated in the SE family (vs Discreet FPGA + external PHY architectures)
설계 노트
Estimated: at 1.1 V core with full 85K LE utilization plus the dual ARM Cortex-A9 at 800 MHz, the 5CSEBA5U19I7N draws approximately 5-8 W from the VCC rail and 1-2 W from VCC_HPS, totaling ~10 W worst-case steady-state. Use a synchronous buck converter (such as an Enpirion EP5348UI or TI TPS54A20) with at least 10 A capability and place it within 25 mm of the BGA core balls. Provide 22 uF bulk plus 0.1 uF + 1 nF decoupling on every four VCC pins per the Cyclone V device handbook. The PLL analog supply VCCA_PLL must be filtered with a ferrite bead and 10 uF + 0.1 uF to keep jitter within Cyclone V specifications.
Estimated: the 484-pin UBG package has a theta_JA of approximately 15 C/W with a 6-layer PCB and adequate copper pours, but at 10 W dissipation the junction rises roughly 150 C above ambient - exceeding the 100 C industrial limit. Add a 25x25 mm aluminum heat-spreader plate bonded to the BGA top with thermal interface material, or use a forced-air airflow of 200 LFM over the package. The HPS die and FPGA die share the same substrate; temperature sensors in the HPS can be read via the System Manager to throttle the ARM cores if junction temperature exceeds 85 C.
The 484-pin UBG package requires at minimum a 6-layer PCB stackup with 1 oz copper on outer layers and 0.5 oz on inner layers. Use 0.4 mm pitch BGA escape routing with via-in-pad microvias for inner signal layers; outer layers fan out to 0.5 mm pitch BGAs. Match all DDR3 traces from the HPS to within +/- 25 ps and length-match the Cortex-A9 trace impedance to 50 ohms single-ended. Provide a continuous ground plane on layer 2 directly beneath the BGA to give return paths for all high-speed transceivers.
Configure the FPGA portion (active serial x4 mode) and the HPS boot source (SD card, eMMC, or QSPI NOR) early in schematic capture. The Cyclone V SoC pin-mux spreadsheet assigns each HPS peripheral (USB, EMAC, SD/MMC, SPI, I2C, UART) to specific HPS ball pins; conflicts must be resolved at the ball-allocation stage before PCB layout begins. Place the 25 MHz HPS reference clock oscillator within 5 mm of the dedicated clock input pin and route it as a 50-ohm controlled-impedance microstrip. Keep JTAG traces under 50 mm total length for reliable boundary-scan operation.
Do not connect the HPS reset to the FPGA POR signal - the HPS has its own cold/warm reset chain that must be sequenced after the FPGA fabric configures. Failing to sequence correctly can lock the Cortex-A9 cores in reset during boot. Always generate the preloader (U-Boot SPL) using the SoC EDS bsp-editor so the HPS pin mux and clock settings match your hardware. Finally, populate 0 ohm resistors on the unused transceiver channels to allow board-level SI testing of the active channels during bring-up.
규정 준수 정보
RoHS and REACH compliance per Cyclone V SE family product environmental documentation on the Intel Altera product page. Standard industrial I7N variant is NOT AEC-Q100 qualified - choose 5CSEBA5U19A7N for automotive programs. Conflict minerals compliance per Intel's standard supplier reporting.
