5M570ZF256A5N - MAX V CPLD 440 Macrocells 256-FBGA | Intel
부품 번호: 5M570ZF256A5N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.8 | $258.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.75 | $9,875.00 |
| 1,000 | $17.4 | $17,400.00 |
5M570ZF256A5N 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits in the digital logic hierarchy between discrete glue-logic gates and higher-density FPGAs. CPLDs are typically used for system-level functions such as bus bridging, I/O expansion, power-up sequencing, and interface glue logic. The MAX V family positions itself as the lowest-power CPLD in the Altera/Intel portfolio, making it suitable for power-sensitive industrial, automotive, and battery-operated applications.
Key features include 1.8 V core operation with multi-voltage I/O support, an integrated flash configuration memory, 27 µA standby current, JTAG (IEEE 1149.1) and in-system programmability via the Altera/Intel Quartus Prime toolchain, and an AEC-Q100 automotive qualification grade. The device supports hot-socketing and 3.3 V/2.5 V/1.8 V/1.5 V LVCMOS/LVTTL I/O standards.
Architecturally, the 5M570ZF256A5N combines a flash-based non-volatile configuration block with a low-power CMOS logic core, giving it deterministic power-up behavior without an external configuration PROM. The flash memory holds the design image permanently, which is read at every power-on in microseconds, eliminating FPGA-style configuration delays. The device is built around the classic MAX interconnect fabric that ties LABs through a global routing pool.
Typical applications include industrial control boards, automotive body and chassis electronics, white goods and appliance controllers, telecommunications line cards, I/O expansion for microcontrollers and DSPs, and portable or battery-powered instrumentation where the 27 µA standby current is critical. The wide operating temperature range and AEC-Q100 grade make it a strong fit for under-hood and cabin automotive modules.
When designing with the 5M570ZF256A5N, plan for the FBGA-256 ball grid: it requires X-ray or BGA rework for prototyping and a 4-layer (or more) PCB with a continuous ground/thermal plane to keep junction temperature within spec at full toggle rate. Use the Quartus Prime Classic or Standard edition for synthesis; the device is not supported by Quartus Prime Pro.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that complement the official MAX V device handbook and datasheet.
드롭인 대체품: 5M570ZF256A5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5M570ZF256A5N (동일 폼 팩터 및 풋프린트) — 차이점: Configuration Memory, Mounting Type, Operating Temperature, Package, Programming Interface.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5M570ZF256C5N
✅ 드롭인✓ 재고 있음
$13.2 / 개
데이터시트 보기 →5M570ZF256I5
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5M570ZF256A5
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5M1270ZF256A5N
✅ 드롭인✓ 재고 있음
$24.1 / 개
데이터시트 보기 →5M2210ZF256A5N
✅ 드롭인✓ 재고 있음
$20.9 / 개
데이터시트 보기 →5M570ZF256A5N 최대 정격 & 전기적 특성
| Family | MAX V |
| Macrocells | 440 |
| Logic Array Blocks (LABs) | 212 |
| User I/Os | 159 |
| Maximum Internal Frequency | 118.3 MHz |
| Core Voltage | 1.8 V |
| Standby Current | 27 uA |
| Configuration Memory | Non-volatile flash (internal) |
| 패키지 | 256-FBGA (17 x 17 mm) |
| 동작 온도 | -40C to +125C (Automotive AEC-Q100) |
| 실장 유형 | Surface Mount (BGA) |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable |
| I/O Standards Supported | LVCMOS, LVTTL (3.3/2.5/1.8/1.5 V) |
| RoHS 상태 | Compliant |
| AEC-Q100 Grade | Qualified (automotive grade -A) |
| Hot Socketing | Supported |
5M570ZF256A5N 256-fbga (17 x 17 mm) 핀 구성 가이드
5M570ZF256A5N(256-fbga (17 x 17 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5M570ZF256A5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5M570ZF256A5N 적합 용도: 6 애플리케이션s: Automotive Body Electronics Modules, Industrial PLC and Control Boards, Telecom Line Card I/O Expansion, Consumer Appliance and White Goods Controllers, Portable Medical Devices, I/O Expansion and Bus Bridging for Microcontrollers.
Automotive Body Electronics Modules
The 5M570ZF256A5N's AEC-Q100 qualification and -40C to +125C operating range make it well suited to body and chassis ECUs in passenger vehicles. With 440 macrocells and 159 user I/Os, it absorbs multiple low-speed interface glue functions such as LIN/CAN signal conditioning, mirror-fold control logic, and lighting PWM sequencing on a single non-volatile device. The 27 uA standby current is critical for modules parked for weeks - the CPLD draws negligible quiescent current while retaining its flash configuration. Per MAX V family datasheet, the instant-on flash eliminates cold-boot delays seen in SRAM-based FPGAs, which is essential for door-module and seat-controller responsiveness within 100 ms of door-handle activation.
추천
Industrial PLC and Control Boards
In industrial PLC backplanes, the 5M570ZF256A5N serves as deterministic glue logic between microcontrollers, sensors, and power actuators. The 118.3 MHz fMAX provides predictable timing for high-speed encoder decoding and pulse-train generation that microcontrollers handle poorly in software. Its 256-FBGA package integrates onto compact PLC carrier boards alongside isolated DC-DC converters and analog front-ends. The flash-based configuration means the PLC ships pre-programmed from factory and field-updates are performed via JTAG without external PROMs, simplifying inventory and reducing component count. Designers value the 27 uA standby for sleep-mode energy harvesting sensor nodes on Industry 4.0 factory floors.
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Telecom Line Card I/O Expansion
Telecom line cards frequently use CPLDs for bus arbitration, hot-swap control, and front-panel LED driving. The 5M570ZF256A5N's 159 I/Os and hot-socketing support make it ideal for ATCA/AdvancedMC mezzanine cards where line cards are inserted into a live backplane without damaging upstream ASICs. Per MAX V datasheet, all I/Os tri-state during insertion with bus-hold disabled, eliminating back-drive currents. The 1.8 V core reduces card-level power versus 3.3 V legacy CPLDs, and 118.3 MHz fMAX easily meets the 77.76 MHz STS-12 frame timing budget. The non-volatile flash ensures the card comes up correctly even after a cold-swap event in the field.
추천
Consumer Appliance and White Goods Controllers
Washing machines, dishwashers, and induction cooktops need reliable, low-cost logic for HMI matrix scanning, motor-driver timing, and safety interlocks. The 5M570ZF256A5N provides 440 macrocells for rich user-interface decoding plus the AEC-Q100 grade is overkill but accepted by many appliance OEMs for overdesign margin. The 27 uA standby and instant-on flash simplify standby-power regulatory compliance (Energy Star, EU 2021 standby <0.5 W). Designers can re-use the same Quartus project across SKUs by swapping the user EEPROM via JTAG, dramatically shortening appliance platform-development cycles. The FBGA-256 fits comfortably on a 100 x 80 mm appliance main board.
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Portable Medical Devices
Portable patient monitors and handheld diagnostic devices benefit from the 5M570ZF256A5N's 27 uA standby current and instant-on behavior. The device handles low-speed sensor multiplexing, button-debounce, and LCD segment driving without consuming the battery budget that an FPGA would. Per the MAX V datasheet, the 1.8 V core and multi-voltage I/O reduce overall board power, extending battery runtime by 10-15 percent over 3.3 V legacy CPLDs. AEC-Q100 over-temp margin gives medical OEMs confidence for IEC 60601-1 thermal and lifetime requirements. Hot-socketing supports docking-station insertion during patient transfer without resetting the monitor.
추천
I/O Expansion and Bus Bridging for Microcontrollers
Many 32-bit microcontrollers expose a parallel external memory bus that designers can connect to a 5M570ZF256A5N for additional GPIO or bus-protocol conversion. The 159 user I/Os multiplexed through the 256-FBGA allow a single CPLD to replace three or four 74LVC245-style buffers plus address-latch logic. The 118.3 MHz fMAX supports SDRAM-style handshakes up to 80 MHz, sufficient for most MCU expansion scenarios. Flash-based instant-on means the expansion ports come up valid before the MCU firmware initializes, eliminating the bus-contention window that plagues FPGA-based expanders. The JTAG port enables in-system reconfiguration during firmware bring-up.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5M570ZF256A5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5M570ZF256C5N | 5M570ZF256I5 | 5M570ZF256A5 | 5M1270ZF256A5N | 5M2210ZF256A5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-FBGA (17 x 17 mm) | 256-FBGA (17 x 17 mm) - same | 256-FBGA (17 x 17 mm) - same | 256-FBGA (17 x 17 mm) - same | 256-FBGA (17 x 17 mm) - same | 256-FBGA (17 x 17 mm) - same |
| Macrocells | 440 | 440 | 440 | 440 | 1270 (LE-equivalent) | 2210 (LE-equivalent) |
| User I/Os | 159 | 159 | 159 | 159 | 212 | 212 |
| Max Internal Frequency | 118.3 MHz | 118.3 MHz | 118.3 MHz | 118.3 MHz | 304 MHz | 304 MHz |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | -40C to +125C (AEC-Q100) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +125C (AEC-Q100) | -40C to +125C (AEC-Q100) | -40C to +125C (AEC-Q100) |
| Configuration Memory | Internal flash (instant-on) | Internal flash | Internal flash | Internal flash | Internal flash | Internal flash |
주요 차별점
- Automotive AEC-Q100 qualification across full 256-FBGA offering (vs 5M570ZF256C5N)
- 440 macrocells - balanced density for glue-logic without overpaying (vs 5M1270ZF256A5N)
- 27 uA standby - lowest power in its CPLD class (vs 5M2210ZF256A5N)
설계 노트
The 256-FBGA package at 1.0 mm pitch requires a minimum 4-layer PCB with a continuous ground/thermal plane directly under the device. Inner-row balls must be escaped with microvias or via-in-pad technology to break out all 256 signals on standard 4-mil trace/space rules. Plan for X-ray inspection at prototype bring-up - BGA solder-joint shorts and head-in-pillow defects are not visible with optical AOI. Maintain 0.8 mm clearance between the BGA edge and any tall component to allow rework nozzles access during engineering debug.
The 5M570ZF256A5N requires two supplies: VCCINT (1.8 V core) and VCCIO (per-bank, supporting 1.5/1.8/2.5/3.3 V). Decouple each VCCINT ball with a 0.1 uF X7R 0402 ceramic placed within 2 mm of the ball, plus a 10 uF bulk tantalum or ceramic near the package edge. Each VCCIO bank (there are 8 banks on FBGA-256) needs its own 0.1 uF decoupling cap. The 27 uA standby current allows the 1.8 V rail to be sourced from a low-Iq LDO or a coin-cell-backed supercap for battery-backed retention designs.
Do not confuse the 5M570ZF256A5N with the 5M2210ZF256A5N - although they share the FBGA-256 footprint, the 5M570 has 440 macrocells while the 5M2210 has 2210 LE-equivalent density. Migrating a board from 5M2210 to 5M570 actually reduces available logic capacity; verify macrocell usage in Quartus before substitution. Also note that Quartus Prime Pro Edition does not support MAX V - use Quartus Prime Standard Edition (or the legacy Quartus II 13.0sp1) for compilation. JTAG pins (TCK/TMS/TDO/TDI) must be brought out to a 4-pin header or TAG-CONNECT footprint for in-system programming.
Estimated: at 100 percent toggle rate on all 159 I/Os at 3.3 V VCCIO, the FBGA-256 device dissipates approximately 0.5-0.8 W. The thermal resistance theta_JA for the 17 x 17 mm FBGA-256 on a 4-layer JEDEC test board is approximately 25 C/W, yielding a junction-temperature rise of 12-20 C above ambient - well within the 125 C automotive limit. For continuous high-temperature operation near 85 C ambient, designers should still provide a solid ground plane directly under the BGA and avoid routing high-current traces across the device footprint to minimize thermal coupling.
규정 준수 정보
AEC-Q100 automotive grade ('A' suffix) per MAX V family datasheet. RoHS and REACH compliant per distributor parametric listings. Halogen-free status not explicitly listed in provided data.
