5M1270ZF324I5N - MAX V 980-Macrocell CPLD, 324-FBGA | Intel
부품 번호: 5M1270ZF324I5N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $21.01 | $21.01 |
| 10 | $19.5 | $195.00 |
| 100 | $17.85 | $1,785.00 |
| 500 | $15.9 | $7,950.00 |
| 1,000 | $13.95 | $13,950.00 |
5M1270ZF324I5N 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits in the hierarchy of digital logic between simple PLDs and FPGAs. It uses a classic AND/OR fabric with macrocells to implement combinatorial and registered logic, glue logic, bus interfaces, and state machines. CPLDs are valued for deterministic timing, single-chip boot, and high-drive I/O - positioning them as the bridge between hard-wired logic (discrete gates, PALs, GALs) and SRAM-based FPGAs in the broader programmable logic taxonomy.
Key features include 980 macrocells distributed across 16 logic array blocks (LABs), 212 MHz maximum internal frequency, 6.2 ns pin-to-pin logic delay, and a low standby current of approximately 40 µA typical at 25 °C. The I/O subsystem provides 5 V-tolerant inputs via clamping diodes and supports 1.2/1.5/1.8/2.5/3.3 V interface standards including LVCMOS, LVTTL, and SSTL on each of the eight I/O banks, enabling mixed-voltage bridging without external level translators.
The MAX V architecture combines a flash-based configuration memory with a fine-grained logic fabric, eliminating the boot PROM and warm-up delay of SRAM FPGAs. On-chip user flash memory (8 Kbits) and a JTAG-driven ISP engine support field updates without removing the part from the board, while the built-in Schmitt-trigger inputs and programmable pull-up resistors reduce external component count.
Typical applications include I/O expansion and bus bridging for industrial controllers, power-meter and SMPS control logic, battery-operated portable devices, cross-matrix switches, and discrete-logic replacement in white goods and consumer electronics. The device is well suited to designers migrating from legacy 3.3 V PLDs who need higher density and additional I/O without migrating to an FPGA.
When designing with the 5M1270ZF324I5N, observe the 1.8 V core supply tolerance (1.71 V to 1.89 V) and add bulk decoupling within 25 mm of each supply pin. Use the Quartus II or Intel Quartus Prime design tool with the MAX V device library; signal-integrity benefits from the device's slow slew-rate and programmable drive strength on each I/O bank.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers select, source, and qualify the 5M1270ZF324I5N with confidence.
드롭인 대체품: 5M1270ZF324I5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5M1270ZF324I5N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Programming Interface, Configuration Memory, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5M1270ZF324C5N
✅ 드롭인✓ 재고 있음
$7.5 / 개
데이터시트 보기 →5M1270ZF324C4N
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →5M1270ZF324A5N
✅ 드롭인✓ 재고 있음
$17.85 / 개
데이터시트 보기 →5M1270ZF256I5N
✅ 드롭인✓ 재고 있음
$7.55 / 개
데이터시트 보기 →5M1270ZF256C5N
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →5M1270ZF324I5N 최대 정격 & 전기적 특성
| Series | MAX V |
| Device Family | 5M1270Z |
| Number of Macrocells | 980 |
| Number of Logic Array Blocks (LABs) | 16 |
| User I/Os | 271 |
| Maximum Internal Frequency | 212 MHz |
| Pin-to-Pin Logic Delay (tPD) | 6.2 ns |
| Number of I/O Banks | 8 |
| Core Voltage (VCCINT) | 1.8 V (1.71 V to 1.89 V) |
| I/O Voltage Standards Supported | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (LVCMOS, LVTTL, SSTL) |
| Programmable Logic Type | In-System Programmable (ISP) flash-based CPLD |
| Configuration Interface | JTAG (IEEE 1149.1) |
| On-Chip User Flash Memory | 8 Kbits |
| 패키지 | 324-pin FBGA (FineLine BGA), 19 mm |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40 °C to +100 °C (TJ) |
| Standby Current (typ, 25 °C) | 40 µA |
| RoHS Compliance | Compliant |
| Lead-Free | Yes |
5M1270ZF324I5N 324-pin fbga (fineline bga), 19 mm 핀 구성 가이드
5M1270ZF324I5N(324-pin fbga (fineline bga), 19 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5M1270ZF324I5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5M1270ZF324I5N 적합 용도: 6 애플리케이션s: Industrial I/O Expansion and Bus Bridging, Power Meter and Smart-Energy Metering, SMPS and Power-Supply Control Logic, Battery-Operated Portable Devices, Cross-Matrix Switch and Signal Routing, Discrete-Logic Replacement and Board Consolidation.
Industrial I/O Expansion and Bus Bridging
The 5M1270ZF324I5N's 271 user I/Os across 8 voltage-configurable banks make it an ideal glue-logic companion to microcontrollers and microprocessors that lack sufficient native GPIO or require mixed-voltage interfacing. The device can bridge between a 3.3 V ARM Cortex-M host and 1.8 V DDR memory, or fan out 24-bit parallel LCD bus signals while adding address-latch and timing-control functions. Its 6.2 ns pin-to-pin delay supports industrial fieldbus latencies, and the 324-FBGA footprint absorbs dense routing on 4-layer FR-4 PCBs typical in PLC backplanes and motor-control inverters.
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Power Meter and Smart-Energy Metering
Smart electricity meters require reliable glue logic for metrology IC interfacing, anti-tamper switch monitoring, RTC supervision, and display multiplexing, all on a low standby current budget. The 5M1270ZF324I5N's typical 40 µA standby at 25 °C preserves battery life during power outages, while 980 macrocells comfortably fit the calibration state machine, LCD segment drivers, and M-Bus / DLMS / COSEM communication state machines. Its industrial -40 °C to +100 °C temperature grade meets outdoor meter enclosure requirements, and the flash-based non-volatile configuration eliminates the external boot EEPROM used in legacy designs.
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SMPS and Power-Supply Control Logic
Switch-mode power supplies require deterministic, low-latency digital control loops for PFC, synchronous rectification, and fault shutdown sequencing. The 5M1270ZF324I5N's 6.2 ns tPD and 212 MHz fMAX allow high-resolution digital PWM generation, while the 271 I/Os handle multi-phase current-sense inputs, gate-driver outputs, and PMBus/I2C housekeeping. The flash-based CPLD configuration avoids the inrush current spikes typical of SRAM FPGA boot sequences, simplifying EMI compliance and inrush-current design. Industrial temperature grade supports telecom rectifiers and industrial DIN-rail supplies.
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Battery-Operated Portable Devices
Portable medical, industrial handhelds, and e-reader products benefit from the 5M1270ZF324I5N's instant-on flash-based configuration and 40 µA typical standby, which collectively extend battery life compared with SRAM FPGA solutions that require boot PROMs and continuous configuration refresh. The 8 on-chip user-flash Kbits allow storage of calibration tables and serial numbers without an external EEPROM. With 271 I/Os the device can drive TFT panels, scan keypads, sequence power rails, and run the display refresh state machine from a single chip.
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Cross-Matrix Switch and Signal Routing
Audio/video routing matrices, telecom cross-connects, and industrial test systems use high-density non-blocking switch fabrics that benefit from CPLD-based control planes. The 5M1270ZF324I5N's 8 I/O banks enable 8 independent voltage domains in a single chip, simplifying PCB routing when interfacing legacy 5 V, 3.3 V, and modern 1.8 V switch ASICs. With 980 macrocells the device can implement full HDCP-style handshake logic, I2C configuration shadowing, and per-port LED drivers. The non-volatile flash configuration ensures immediate fabric bring-up on power-on without CPU intervention.
추천
Discrete-Logic Replacement and Board Consolidation
Many designs still ship with dozens of 74-series TTL/CMOS glue packages - address latches, transceivers, muxes, and reset sequencers - consuming board area and BOM cost. The 5M1270ZF324I5N consolidates all of these into a single 19 mm FBGA, freeing PCB real-estate for higher-value analog or RF circuitry. Designers can re-target the same JTAG programming file across product variants by recompiling in Quartus, eliminating multiple SKUs of legacy logic. The MAX V 5M1270Z sub-series is purpose-built for this glue-logic replacement role with its low standby current and instant-on behavior.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5M1270ZF324I5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5M1270ZF324C5N | 5M1270ZF324C4N | 5M1270ZF324A5N | 5M1270ZF256I5N | 5M1270ZF256C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-pin FBGA (19 mm) | 324-pin FBGA - same | 324-pin FBGA - same | 324-pin FBGA - same | 256-pin FBGA - different | 256-pin FBGA - different |
| Macrocells | 980 | 980 | 980 | 980 | 980 | 980 |
| User I/Os | 271 | 271 | 271 | 271 | 212 | 212 |
| Pin-to-Pin Delay (tPD) | 6.2 ns | 6.2 ns | 7.5 ns | 6.2 ns | 6.2 ns | 6.2 ns |
| Max Internal Frequency (fMAX) | 212 MHz | 212 MHz | 152 MHz | 212 MHz | 212 MHz | 212 MHz |
| Operating Temperature | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | -40 °C to +125 °C (Automotive flow) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) |
| Core Voltage (VCCINT) | 1.8 V (1.71 V to 1.89 V) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Configuration Memory | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) |
| Approx. 1-piece Price (USD, as of 2026-09-06) | 21.01 | 18.50 | 17.20 | 23.40 | 19.80 | 17.50 |
주요 차별점
- Highest macrocell density in the MAX V 5M1270Z sub-series with industrial temperature grade (vs 5M1270ZF256I5N)
- Industrial -40 °C to +100 °C operating temperature range (vs 5M1270ZF324C5N)
- Flash-based non-volatile configuration with 8 Kbits user flash (vs SRAM-based small FPGAs (e.g., Cyclone V))
설계 노트
The MAX V 5M1270Z core requires a tightly regulated 1.8 V supply in the range 1.71 V to 1.89 V. Place a 100 µF bulk tantalum or polymer capacitor and a 1 µF X7R ceramic within 25 mm of the VCCINT balls. Estimated: a design using all 980 macrocells at 212 MHz toggling at typical 20% activity draws approximately 35 mA ICCINT plus I/O current; the on-chip voltage regulator tolerates a 3.3 V VCCIO supply but does not generate 1.8 V internally.
The 324-pin FBGA uses a 1.0 mm ball pitch and demands 4-layer PCB with microvia stackups (laser-drilled) for reliable assembly. Fanout should follow Intel's recommended dog-bone or via-in-pad pattern in the MAX V Device Handbook. Ground and VCCINT planes must remain solid under the BGA; split planes force return-current detours that degrade SSO performance. Keep high-speed outputs (DDR-style clocks, fast memory interfaces) on inner layers to reduce EMI.
Do not assume the 5V-tolerant inputs work without the PCI clamping diode enabled in the Quartus pin planner - by default the inputs clamp only at the I/O standard's VCCIO level. The JTAG chain must include 4.7 kΩ pull-ups on TMS, TDI, and TCK as recommended in AN 100. Designers migrating from MAX II to MAX V should review the new 8-bank I/O architecture - bank assignments and VREF pins differ between MAX II and MAX V layouts even in the same package.
규정 준수 정보
RoHS compliant per Intel product page. The standard 5M1270ZF324I5N is industrial temperature grade but NOT AEC-Q100 qualified - choose 5M1270ZF324A5N for automotive stress-tested flow. Halogen-free status not explicitly stated in provided data - marked unknown.
