A3P600-FGG256 - 600K Gate ProASIC3 FPGA | Microchip Technology
부품 번호: A3P600-FGG256 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $22.14 | $22.14 |
| 10 | $20.29 | $202.90 |
| 100 | $18.63 | $1,863.00 |
| 500 | $17.28 | $8,640.00 |
| 1,000 | $16.11 | $16,110.00 |
| 3,000 | $15.4 | $46,200.00 |
A3P600-FGG256 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks and programmable interconnects that can be configured after manufacturing to implement arbitrary digital logic. In the programmable logic taxonomy, FPGA sits within the broader family of programmable logic devices; ProASIC3 is Microchip's flash-based FPGA family. Unlike SRAM-based FPGAs, ProASIC3 stores its configuration in nonvolatile flash cells, enabling instant-on operation without external boot memory. This architecture improves system reliability, reduces bill-of-materials count, and provides inherent bitstream security.
Key features of the A3P600-FGG256 include nonvolatile flash configuration with instant-on capability, 600K system gates, 177 user I/Os, 110,592 RAM bits, 231 MHz system performance, and a 1.425V-1.575V supply range. The device is RoHS3 compliant and lead-free, and it is supplied in a 256-FPBGA package with a 17x17 mm body and 1.00 mm ball pitch. The four I/O banks with dedicated VCCIB supplies allow flexible voltage-standard mixing on the same device.
The ProASIC3 family is built on a flash-based CMOS process, combining ASIC-like unit cost with full reprogrammability. The device integrates dedicated clock conditioning PLLs and embedded memory resources. According to Microchip's ProASIC3 migration application note, A3P400, A3P600, and A3P1000 devices share four I/O banks and dedicated bank supplies, which simplifies board design when moving between densities in the same 256-ball package. The flash architecture also provides design security and low dynamic power density.
Typical applications include industrial automation and motor control, communications protocol bridging, medical signal processing, aerospace and defense secure processing, smart energy monitoring, and ASIC replacement. The 177 user I/Os and instant-on behavior make the A3P600-FGG256 suitable for high-reliability systems where external configuration devices are undesirable or where fast startup is critical.
When designing with this FPGA, pay careful attention to 1.5V core supply decoupling and to each I/O bank's VCCIB voltage. Use Microchip's power management guidelines, and verify pin compatibility when migrating between ProASIC3 densities using the same 256-FPBGA footprint. For industrial-temperature environments, select the A3P600-FGG256I variant.
This page synthesizes distributor inventory, estimated pricing, drop-in alternatives from the same ProASIC3 family, and practical design notes not found in the manufacturer datasheet, giving engineers a complete cross-reference resource for the A3P600-FGG256.
드롭인 대체품: A3P600-FGG256 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600-FGG256 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, RoHS Status, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600-FGG256I
✅ 드롭인✓ 재고 있음
$96.23 / 개
데이터시트 보기 →A3P600-2FGG256
✅ 드롭인✓ 재고 있음
$50.51 / 개
데이터시트 보기 →A3P600-2FGG256I
✅ 드롭인✓ 재고 있음
$49.8 / 개
데이터시트 보기 →A3P1000-FGG256M
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$27.85 / 개
데이터시트 보기 →A3P1000-1FGG256
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$48.75 / 개
데이터시트 보기 →A3P1000-2FGG256M
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$25.8 / 개
데이터시트 보기 →A3P600-FGG256 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| Number of System Gates | 600000 |
| Number of Logic Elements/Cells | 7KLEs (Mouser term) |
| Total RAM Bits | 110592 |
| Number of I/O | 177 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Supply Voltage (Nominal) | 1.5V |
| 동작 온도 | 0°C ~ 85°C (TJ) |
| 패키지 / 케이스 | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
| 실장 유형 | Surface Mount |
| Packaging | Tray |
| RoHS 상태 | ROHS3 Compliant |
| Product Status | Active |
| Manufacturer Lead Time | 8 weeks |
| Number of Terminals | 256 |
| Terminal Form | BALL |
| Package Shape | SQUARE |
| Maximum System Frequency | 231 MHz |
A3P600-FGG256 square 핀 구성 가이드
A3P600-FGG256(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P600-FGG256.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P600-FGG256 적합 용도: 6 애플리케이션s: Industrial Automation and Motor Control, Communications and Protocol Bridging, Medical Device Signal Processing, Aerospace and Defense Secure Processing, ASIC Replacement and Glue Logic, Smart Energy and Grid Monitoring.
Industrial Automation and Motor Control
In industrial automation, the A3P600-FGG256 implements high-speed I/O logic, encoder interfaces, and safety interlocks alongside host MCUs. Its 177 user I/Os support parallel interfaces to position encoders and fieldbus controllers, while the 231 MHz capability handles real-time combinatorial functions. The flash-based instant-on architecture eliminates external configuration memory in remote or vibration-prone environments, improving mean time between failures. Placed between a 1.5V core rail and field-side transceivers, the FPGA can also pre-filter signals before DSP/MCU processing. Designers should decouple each I/O bank separately and verify VCCIB voltage compatibility. The 256-FPBGA footprint allows a two-layer board with careful via placement.
추천
Communications and Protocol Bridging
The A3P600-FGG256 suits protocol bridging because it can simultaneously buffer data in 110,592 RAM bits and steer multiple serial/parallel interfaces. Its 177 user I/Os provide enough connectivity for UART, SPI, and local parallel buses; with a 1.5V core and 231 MHz system performance, bridge latency remains low. In a typical design, the FPGA sits between a host processor and communication PHYs, translating packet formats and performing clock-domain crossing. Since ProASIC3 is flash-based, an accidental power loss does not cause reconfiguration delay, preserving link availability. Use the four I/O banks to assign different VCCIB levels for 1.8V, 2.5V, and 3.3V transceivers. The single-chip solution reduces board area versus an external configuration device.
추천
Medical Device Signal Processing
Medical monitoring and diagnostic instruments require high reliability and deterministic start-up. The A3P600-FGG256 provides flash-based instant-on, so it is ready within milliseconds of power application—important for defibrillators, infusion pumps, and patient monitors. Its 110,592 RAM bits buffer transducer data before an external DSP or MCU processes it; 177 I/Os connect precision ADCs, DACs, and displays. The 0°C to 85°C commercial temperature range covers most laboratory and clinical environments, and the 256-FPBGA package supports compact PCB designs. Because ProASIC3 does not need an external configuration PROM, the system has fewer components to verify under medical safety standards. For isolated patient circuits, maintain adequate PCB creepage and route the core voltage cleanly.
추천
Aerospace and Defense Secure Processing
Aerospace and defense systems value flash FPGAs for their nonvolatile configuration and resistance to bitstream sniffing compared with SRAM FPGAs. The A3P600-FGG256 lets designers implement secure boot logic, bus cryptography glue, and telemetry formatting in a 17x17 mm BGA. Its 600K gates and 177 I/Os are enough for moderate security kernels and protocol controllers; the -2 speed-grade variant supports higher clock rates for DSP preprocessing. The commercial temperature version is suitable for controlled avionics bays, while the I suffix extends to -40°C for unpressurized zones. The 1.5V core can be filtered from a 3.3V bus with a low-noise regulator. For radiation-sensitive orbits, evaluate the device tolerance per mission requirements and consult Microchip radiation reports.
추천
ASIC Replacement and Glue Logic
The A3P600-FGG256 is often chosen as a low total-cost-of-ownership replacement for ASICs or multiple discrete logic chips. Because it is flash-based and reprogrammable, it eliminates NRE and mask changes while preserving board area. The 600K gate count comfortably absorbs 74-series glue logic, bus arbiters, FIFO controllers, and memory-mapped peripheral registers. Its 177 I/Os interface directly with microprocessors, SRAM, and flash memories. The 1.425V-1.575V core and 231 MHz capability allow it to keep pace with legacy bus speeds. Designers should port legacy timing requirements into timing constraints and verify pin assignments with the Microchip Libero tool. The 256-FPBGA package can be routed on modest layer counts with careful escape routing.
추천
Smart Energy and Grid Monitoring
In smart grid monitors and power distribution units, the A3P600-FGG256 performs real-time power-quality analysis, data concentration, and secure communication framing. Its 110,592 RAM bits buffer waveform samples; 177 I/Os connect to current sensor ADCs and PLC transceivers. The 1.5V core keeps dynamic power low in sealed enclosures, while the instant-on flash architecture restores service quickly after line transients. The device can also implement IEC 61850 GOOSE message parsing glue logic before a host MCU handles upper layers. Because grid equipment may be mounted outdoors, choose the -I industrial variant if ambient temperatures exceed 85°C. Use the VCCIB banks to isolate analog sensor I/O from noisy digital communication I/O.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P600-FGG256 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600-FGG256I | A3P600-2FGG256 | A3P1000-FGG256 |
|---|---|---|---|---|
| Package | 256-FPBGA (17x17) | 256-FPBGA (17x17) | 256-FPBGA (17x17) | 256-FPBGA (17x17) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600,000 | 600,000 | 600,000 | 1,000,000 |
| Operating Temperature | 0°C to 85°C | -40°C to 100°C | 0°C to 85°C | 0°C to 85°C |
| Supply Voltage | 1.425V to 1.575V | 1.425V to 1.575V | 1.425V to 1.575V | 1.425V to 1.575V |
주요 차별점
- Same-die industrial temperature variant with identical footprint (vs A3P600-FGG256I)
- Flash-based instant-on and design security (vs SRAM-based Xilinx or Intel Altera FPGAs)
- ProASIC3 migration path to higher density (vs A3P1000-FGG256)
설계 노트
The A3P600-FGG256 core supply is 1.425V to 1.575V with a nominal 1.5V. Place at least 100nF and 1uF low-ESR ceramic capacitors close to each VCC ball and provide a bulk capacitor near the FPGA. The four I/O banks use dedicated VCCIB supplies, so per-bank bypassing is required — estimate total decoupling based on simultaneous switching output current. Because the device is flash-based, there is no external configuration-current surge, but the 1.5V rail should still have a low-impedance plane.
The 256-FPBGA package requires thermal vias under the center of the ball field to conduct heat into the PCB ground plane. Estimated thermal performance depends on board copper area and airflow; Microchip does not list a specific theta-JA in the provided web snapshot. For commercial 0°C to 85°C operation, keep power below the level that raises junction temperature above the absolute maximum, typically 125°C. At higher densities or faster speed grades, recompute power with Libero Power Analyzer.
ProASIC3 FPGAs are flash-based and instant-on, so no external configuration PROM or SPI flash is required. Use Microchip's FlashPro programmer and Libero software to program the device via JTAG. The nonvolatile flash retains the bitstream during power loss, which reduces BOM and boot time. When migrating from SRAM-based FPGAs, remove any configuration device from the schematic and verify the JTAG chain is correctly terminated.
The 256-FPBGA package uses a 17x17 mm body and 1.00 mm ball pitch. Fanout with 0.25mm vias on a 0.8mm staggered pattern is common on 4-layer boards. Keep the 1.5V core plane intact under the FPGA and provide separate reference planes for each VCCIB bank. Follow Microchip's layout app notes for BGA escape routing, and avoid long traces on the JTAG programming pins.
A frequent error is assigning incompatible voltage standards to the same I/O bank. Per Microchip's ProASIC3 migration documentation, only I/Os with compatible voltage standards can be assigned to the same VCCIB bank. Also verify that the selected package variant has enough balls for the required user I/Os; the 177-I/O count is fixed for this package/density combination, so falling short requires a higher-density or larger-package device.
규정 준수 정보
ROHS3 compliant per Microchip USA data; AEC-Q100 not applicable for ProASIC3 FPGA.