A3P125-2PQG208 - ProASIC3 Flash FPGA 1.5KLE 208-PQFP | Microchip
부품 번호: A3P125-2PQG208 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $27.57 | $27.57 |
| 10 | $26.2 | $262.00 |
| 100 | $24.8 | $2,480.00 |
| 500 | $23.5 | $11,750.00 |
| 1,000 | $22.3 | $22,300.00 |
A3P125-2PQG208 개요
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory cells rather than an external configuration ROM. Within the programmable logic hierarchy, an FPGA sits above CPLDs in gate count and capability, and the ProASIC3 family is positioned for ultra-low-density, single-chip solutions where reprogrammability, instant-on startup, and low total cost of ownership (TOC) matter more than raw fabric size.
Key differentiating features include single-chip operation with no external boot device, live-at-power-up behavior that eliminates configuration time, reprogrammability in-system, and small-footprint package options. The -2 speed grade supports system clock rates up to 310 MHz, adequate for glue logic, bus bridging, control-state machines, and moderate datapath functions.
Architecturally, ProASIC3 is built on a 130 nm flash process with a Sea-of-Tiles fabric of versatile logic elements, each containing a lookup-table-based core with register capability. The flash switching technology is inherently nonvolatile and low-power at standby, and the fabric supports single-ended and differential I/O standards on its 133 available user pins.
Typical applications include industrial control and automation, portable and handheld instrumentation, communications line-card glue logic, and military/aerospace subsystems where instant-on and configuration-store reliability are required. The 1.5V core with 3.3V-tolerant I/O banks fits standard board power trees.
Design consideration: budget the 208-pin PQFP footprint carefully - at 28x28 mm with 0.5 mm pin pitch, thermal relief and fanout escape routing on 4+ layer PCBs should be planned early.
This page synthesizes verified distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3P125-2PQG208 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P125-2PQG208 (동일 폼 팩터 및 풋프린트) — 차이점: System Gates, Package, Configuration Memory, RoHS Status, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P125-2PQG208I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$18.75 / 개
데이터시트 보기 →A3P250-2PQG208
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$23.71 / 개
데이터시트 보기 →A3P250-1PQG208I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$16.19 / 개
데이터시트 보기 →A3P600-1PQG208I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$68 / 개
데이터시트 보기 →A3P600-2PQG208
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$55.87 / 개
데이터시트 보기 →A3P1000-2PQG208
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$65.67 / 개
데이터시트 보기 →A3P125-2PQG208 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| System Gates | 125000 |
| Logic Elements (LEs) | 1500 |
| Embedded Memory | 36864 bits |
| User I/O | 133 |
| Maximum System Frequency | 310 MHz |
| Speed Grade | -2 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm flash |
| Configuration Memory | Nonvolatile on-chip flash (single-chip) |
| 패키지 | 208-pin PQFP (BFQFP), 28x28 mm |
| 실장 유형 | Surface Mount |
| Pin Pitch | 0.5 mm |
| RoHS 상태 | Compliant (per LCSC listing) |
| Reprogrammability | Yes, in-system reprogrammable |
| Power-Up Behavior | Live at power-up (instant-on, no external configuration device) |
A3P125-2PQG208 208-pin pqfp (bfqfp), 28x28 mm 핀 구성 가이드
A3P125-2PQG208(208-pin pqfp (bfqfp), 28x28 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P125-2PQG208.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P125-2PQG208 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Portable and Handheld Instrumentation, Communications Line-Card Glue Logic, Military and Aerospace Subsystems, Test and Measurement Equipment, Secure Embedded Control.
Industrial Control and Automation
The A3P125-2PQG208 suits industrial control because its on-chip flash configuration makes it live at power-up, which is critical for safety interlocks, watchdog logic, and power sequencing on factory floor equipment. With 1,500 logic elements and 133 user I/Os, it absorbs glue logic, legacy bus bridges, motor control state machines, and sensor interface consolidation that would otherwise require several discrete ICs. Placed between a 3.3V backplane and mixed-voltage peripherals, its per-bank I/O configuration handles 3.3V and 2.5V standards directly. The 310 MHz fabric ceiling is far above typical industrial control loop rates, giving generous timing margin, and the 130 nm flash process delivers very low standby power for always-on cabinets. For -40C cold-start installations, specify the industrial-grade A3P125-2PQG208I variant in the same footprint.
추천
Portable and Handheld Instrumentation
In portable instruments, the A3P125-2PQG208's single-chip flash architecture removes the external configuration ROM, saving board area, BOM cost, and battery-draining boot current. The 1.5V core with low standby draw extends battery life in duty-cycled measurement equipment such as handheld meters, dataloggers, and field analyzers. Its 1,500 LEs and 36,864 bits of memory implement display controllers, keypad scanning, ADC/DAC interfacing, and calibration logic, while the 28x28 mm 208-PQFP can be hand-soldered and reworked during prototyping - unlike fine-pitch BGA alternatives. The -2 speed grade at up to 310 MHz comfortably covers instrument timing bases and trigger engines. Designs that later need more logic can migrate to the pin-compatible A3P250-2PQG208 without a PCB respin, protecting the mechanical enclosure investment.
추천
Communications Line-Card Glue Logic
Telecom and datacom line cards commonly need a deterministic bridge between processors, PHYs, and backplane connectors, and the A3P125-2PQG208 fills this role with instant-on availability - the fabric is live before the host CPU completes reset, allowing it to perform bus parking, reset distribution, and interrupt management from the first millisecond. The 133 I/Os span multiple banks for 3.3V and 2.5V interfaces to PHY devices, and the 310 MHz speed grade supports clock-domain crossing FIFOs built from the 36,864-bit embedded memory. Because configuration is internal flash, there is no bitstream load delay or external flash failure mode on hot-swappable cards. The 208-PQFP's 0.5 mm pitch escapes cleanly on 4-layer boards typical of line-card designs, keeping layer count and cost down versus BGA-packaged FPGAs.
추천
Military and Aerospace Subsystems
ProASIC3 flash FPGAs are widely deployed in defense electronics because the nonvolatile configuration cannot be intercepted during power-up and the device contains no configuration bitstream in external memory to spoof or read. The A3P125-2PQG208 implements sensor preprocessing,Telemetry formatting, and discrete I/O in avionics and rugged ground systems where instant-on is a system requirement, not a convenience. Its sealed-flow 208-PQFP ceramic-compatible footprint lineage and mature 130 nm flash process support long-lifetime programs, and the extended-temperature A3P125-2PQG208I covers -40C to +100C ambient. With 1,500 LEs and deterministic flash-based routing, timing closure is stable across temperature and radiation-tolerant program flows are documented by Microchip for family derivatives. Verify export control and flow requirements before design freeze.
추천
Test and Measurement Equipment
Bench and automated test equipment benefits from the A3P125-2PQG208's reprogrammability combined with instant-on configuration: firmware can be updated in-system via JTAG with FlashPro, yet the instrument is fully functional the moment power is applied. The 1,500 logic elements implement pattern generators, trigger comparators, counter/timer arrays, and relay-matrix control, while the 36,864-bit memory block captures event traces and waveform segments. With 133 I/Os in per-bank configurable banks, one device interfaces to 3.3V and 2.5V timing buses and front-panel logic simultaneously. The 310 MHz fabric limit supports nanosecond-class timing resolution in the -2 speed grade. Compared with an MCU-only design, the FPGA's parallel I/O handling removes software latency from the measurement path, improving repeatability and channel-to-channel skew.
추천
Secure Embedded Control
Applications such as secure boot managers, license enforcement dongles, and anti-cloning controllers favor flash-based FPGAs because the design lives entirely inside the chip with no external bitstream to copy. The A3P125-2PQG208 implements custom authentication logic, challenge-response engines, and locked state machines whose topology is invisible to probing of board nets. Flash cells retain configuration through power cycles, and Microchip provides design-security features on the ProASIC3 family for flash lock and verification disable. The 1.5V core keeps standby consumption near zero for always-on secure modules, and the 133 I/Os interface to smart-card style contacts, SPI/I2C buses, and tamper-switch inputs. The 208-PQFP's exposed leadframe also simplifies conformal-coating and tamper-evident potting compared with heat-sink-constrained BGA devices.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P125-2PQG208 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P125-2PQG208I | A3P250-2PQG208 | A3P600-2PQG208 | A3P1000-2PQG208 |
|---|---|---|---|---|---|
| Package | 208-PQFP (PQG208), 28x28 mm | 208-PQFP (PQG208) - same | 208-PQFP (PQG208) - same | 208-PQFP (PQG208) - same | 208-PQFP (PQG208) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 1.5K | 1.5K | 3K | 13K | 24K |
| System Gates | 125K | 125K | 250K | 600K | 1M |
| Maximum Frequency | 310 MHz (-2) | 310 MHz (-2) | 310 MHz (-2) | 310 MHz (-2) | 310 MHz (-2) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Commercial | Industrial (-40C) | Commercial | Commercial | Commercial |
주요 차별점
- Single-chip flash configuration, no external boot ROM (vs SRAM FPGAs such as A3P250-2FGG144-class competitors' SRAM parts)
- Industrial temperature option in identical footprint (vs A3P125-2PQG208I)
- Lowest-cost entry to PQG208 ProASIC3 roadmap (vs A3P600-2PQG208)
설계 노트
The PQG208 package has a 0.5 mm pin pitch on a 28x28 mm body. Plan fanout escape routing on at least 4 signal layers: a 0.5 mm pitch PQFP allows one trace between pins at 4/4 mil geometry, but two-trace escapes require 3/3 mil. Define the footprint per the Microchip PQG208 mechanical drawing, not a generic PQFP-208 library part, and include the pin-1 dot and courtyard. Verify I/O bank assignment in Libero SoC before routing so that 3.3V and 2.5V interfaces land in correctly powered banks.
Supply the 1.5V core from a dedicated regulator; do not derive it from I/O rails with resistor dividers. Decouple each VCC/VSSI pin pair with 0.1 uF ceramic capacitors placed within 2 mm of the pin, plus bulk 10 uF per bank. I/O bank VCCI voltages set the bank's logic standard, so power unused banks only if the design assigns I/O there - check the Libero SmartPower report for actual per-bank current before sizing regulators, since flash ProASIC3 standby current is very low but dynamic current scales with toggling rates.
Do not assume temperature range interchangeability: the standard A3P125-2PQG208 is commercial-grade, and substituting the industrial A3P125-2PQG208I later requires a purchasing change even though the footprint is identical. Also, programming requires a FlashPro unit and Microchip Libero SoC - SRAM FPGA JTAG tools will not program ProASIC3 flash cells. Finally, migrate designs to larger family members (A3P250-2PQG208) via recompile and pin-assignment review, not by assuming automatic pin equivalence.
규정 준수 정보
RoHS compliance per LCSC product listing (C2614910). Obtain REACH, halogen-free, and conflict-minerals declarations directly from Microchip compliance documentation.
