A3P125-2PQG208 - ProASIC3 Flash FPGA 1.5KLE 208-PQFP | Microchip
MPN: A3P125-2PQG208 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $27.57 | $27.57 |
| 10 | $26.2 | $262.00 |
| 100 | $24.8 | $2,480.00 |
| 500 | $23.5 | $11,750.00 |
| 1,000 | $22.3 | $22,300.00 |
Drop-in alternatives for A3P125-2PQG208 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P125-2PQG208I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$18.75 / Unit
View Datasheet →A3P250-2PQG208
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$23.71 / Unit
View Datasheet →A3P250-1PQG208I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$16.19 / Unit
View Datasheet →A3P600-1PQG208I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$68 / Unit
View Datasheet →A3P600-2PQG208
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$55.87 / Unit
View Datasheet →A3P1000-2PQG208
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$65.67 / Unit
View Datasheet →A3P125-2PQG208 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| System Gates | 125000 |
| Logic Elements (LEs) | 1500 |
| Embedded Memory | 36864 bits |
| User I/O | 133 |
| Maximum System Frequency | 310 MHz |
| Speed Grade | -2 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm flash |
| Configuration Memory | Nonvolatile on-chip flash (single-chip) |
| Package | 208-pin PQFP (BFQFP), 28x28 mm |
| Mounting Type | Surface Mount |
| Pin Pitch | 0.5 mm |
| RoHS Status | Compliant (per LCSC listing) |
| Reprogrammability | Yes, in-system reprogrammable |
| Power-Up Behavior | Live at power-up (instant-on, no external configuration device) |
A3P125-2PQG208 208-pin pqfp (bfqfp), 28x28 mm Pin Configuration Guide
Complete pinout information for A3P125-2PQG208 (208-pin pqfp (bfqfp), 28x28 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P125-2PQG208.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P125-2PQG208 is suitable for 6 applications: Industrial Control and Automation, Portable and Handheld Instrumentation, Communications Line-Card Glue Logic, Military and Aerospace Subsystems, Test and Measurement Equipment, Secure Embedded Control.
Industrial Control and Automation
The A3P125-2PQG208 suits industrial control because its on-chip flash configuration makes it live at power-up, which is critical for safety interlocks, watchdog logic, and power sequencing on factory floor equipment. With 1,500 logic elements and 133 user I/Os, it absorbs glue logic, legacy bus bridges, motor control state machines, and sensor interface consolidation that would otherwise require several discrete ICs. Placed between a 3.3V backplane and mixed-voltage peripherals, its per-bank I/O configuration handles 3.3V and 2.5V standards directly. The 310 MHz fabric ceiling is far above typical industrial control loop rates, giving generous timing margin, and the 130 nm flash process delivers very low standby power for always-on cabinets. For -40C cold-start installations, specify the industrial-grade A3P125-2PQG208I variant in the same footprint.
Recommended
Portable and Handheld Instrumentation
In portable instruments, the A3P125-2PQG208's single-chip flash architecture removes the external configuration ROM, saving board area, BOM cost, and battery-draining boot current. The 1.5V core with low standby draw extends battery life in duty-cycled measurement equipment such as handheld meters, dataloggers, and field analyzers. Its 1,500 LEs and 36,864 bits of memory implement display controllers, keypad scanning, ADC/DAC interfacing, and calibration logic, while the 28x28 mm 208-PQFP can be hand-soldered and reworked during prototyping - unlike fine-pitch BGA alternatives. The -2 speed grade at up to 310 MHz comfortably covers instrument timing bases and trigger engines. Designs that later need more logic can migrate to the pin-compatible A3P250-2PQG208 without a PCB respin, protecting the mechanical enclosure investment.
Recommended
Communications Line-Card Glue Logic
Telecom and datacom line cards commonly need a deterministic bridge between processors, PHYs, and backplane connectors, and the A3P125-2PQG208 fills this role with instant-on availability - the fabric is live before the host CPU completes reset, allowing it to perform bus parking, reset distribution, and interrupt management from the first millisecond. The 133 I/Os span multiple banks for 3.3V and 2.5V interfaces to PHY devices, and the 310 MHz speed grade supports clock-domain crossing FIFOs built from the 36,864-bit embedded memory. Because configuration is internal flash, there is no bitstream load delay or external flash failure mode on hot-swappable cards. The 208-PQFP's 0.5 mm pitch escapes cleanly on 4-layer boards typical of line-card designs, keeping layer count and cost down versus BGA-packaged FPGAs.
Recommended
Military and Aerospace Subsystems
ProASIC3 flash FPGAs are widely deployed in defense electronics because the nonvolatile configuration cannot be intercepted during power-up and the device contains no configuration bitstream in external memory to spoof or read. The A3P125-2PQG208 implements sensor preprocessing,Telemetry formatting, and discrete I/O in avionics and rugged ground systems where instant-on is a system requirement, not a convenience. Its sealed-flow 208-PQFP ceramic-compatible footprint lineage and mature 130 nm flash process support long-lifetime programs, and the extended-temperature A3P125-2PQG208I covers -40C to +100C ambient. With 1,500 LEs and deterministic flash-based routing, timing closure is stable across temperature and radiation-tolerant program flows are documented by Microchip for family derivatives. Verify export control and flow requirements before design freeze.
Recommended
Test and Measurement Equipment
Bench and automated test equipment benefits from the A3P125-2PQG208's reprogrammability combined with instant-on configuration: firmware can be updated in-system via JTAG with FlashPro, yet the instrument is fully functional the moment power is applied. The 1,500 logic elements implement pattern generators, trigger comparators, counter/timer arrays, and relay-matrix control, while the 36,864-bit memory block captures event traces and waveform segments. With 133 I/Os in per-bank configurable banks, one device interfaces to 3.3V and 2.5V timing buses and front-panel logic simultaneously. The 310 MHz fabric limit supports nanosecond-class timing resolution in the -2 speed grade. Compared with an MCU-only design, the FPGA's parallel I/O handling removes software latency from the measurement path, improving repeatability and channel-to-channel skew.
Recommended
Secure Embedded Control
Applications such as secure boot managers, license enforcement dongles, and anti-cloning controllers favor flash-based FPGAs because the design lives entirely inside the chip with no external bitstream to copy. The A3P125-2PQG208 implements custom authentication logic, challenge-response engines, and locked state machines whose topology is invisible to probing of board nets. Flash cells retain configuration through power cycles, and Microchip provides design-security features on the ProASIC3 family for flash lock and verification disable. The 1.5V core keeps standby consumption near zero for always-on secure modules, and the 133 I/Os interface to smart-card style contacts, SPI/I2C buses, and tamper-switch inputs. The 208-PQFP's exposed leadframe also simplifies conformal-coating and tamper-evident potting compared with heat-sink-constrained BGA devices.
Recommended
Recommended Products Summary
Engineering reference data for A3P125-2PQG208 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P125-2PQG208I | A3P250-2PQG208 | A3P600-2PQG208 | A3P1000-2PQG208 |
|---|---|---|---|---|---|
| Package | 208-PQFP (PQG208), 28x28 mm | 208-PQFP (PQG208) - same | 208-PQFP (PQG208) - same | 208-PQFP (PQG208) - same | 208-PQFP (PQG208) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 1.5K | 1.5K | 3K | 13K | 24K |
| System Gates | 125K | 125K | 250K | 600K | 1M |
| Embedded Memory | 36864 bits | 36864 bits | 36864 bits | [DATA_NEEDED] | [DATA_NEEDED] |
| Maximum Frequency | 310 MHz (-2) | 310 MHz (-2) | 310 MHz (-2) | 310 MHz (-2) | 310 MHz (-2) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Commercial | Industrial (-40C) | Commercial | Commercial | Commercial |
| Approx. Unit Price (qty 1) | $27.57 as of 2026-08-31 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Single-chip flash configuration, no external boot ROM (vs SRAM FPGAs such as A3P250-2FGG144-class competitors' SRAM parts)
- Industrial temperature option in identical footprint (vs A3P125-2PQG208I)
- Lowest-cost entry to PQG208 ProASIC3 roadmap (vs A3P600-2PQG208)
Design Notes
The PQG208 package has a 0.5 mm pin pitch on a 28x28 mm body. Plan fanout escape routing on at least 4 signal layers: a 0.5 mm pitch PQFP allows one trace between pins at 4/4 mil geometry, but two-trace escapes require 3/3 mil. Define the footprint per the Microchip PQG208 mechanical drawing, not a generic PQFP-208 library part, and include the pin-1 dot and courtyard. Verify I/O bank assignment in Libero SoC before routing so that 3.3V and 2.5V interfaces land in correctly powered banks.
Supply the 1.5V core from a dedicated regulator; do not derive it from I/O rails with resistor dividers. Decouple each VCC/VSSI pin pair with 0.1 uF ceramic capacitors placed within 2 mm of the pin, plus bulk 10 uF per bank. I/O bank VCCI voltages set the bank's logic standard, so power unused banks only if the design assigns I/O there - check the Libero SmartPower report for actual per-bank current before sizing regulators, since flash ProASIC3 standby current is very low but dynamic current scales with toggling rates.
Do not assume temperature range interchangeability: the standard A3P125-2PQG208 is commercial-grade, and substituting the industrial A3P125-2PQG208I later requires a purchasing change even though the footprint is identical. Also, programming requires a FlashPro unit and Microchip Libero SoC - SRAM FPGA JTAG tools will not program ProASIC3 flash cells. Finally, migrate designs to larger family members (A3P250-2PQG208) via recompile and pin-assignment review, not by assuming automatic pin equivalence.
Compliance Information
RoHS compliance per LCSC product listing (C2614910). Obtain REACH, halogen-free, and conflict-minerals declarations directly from Microchip compliance documentation.
