A3P600-FG484 - ProASIC3 600K-Gate Flash FPGA, 484-BGA | Microchip
부품 번호: A3P600-FG484 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.2 | $722.00 |
| 100 | $66.4 | $6,640.00 |
| 500 | $61.1 | $30,550.00 |
| 1,000 | $56.3 | $56,300.00 |
A3P600-FG484 개요
A flash-based FPGA stores its configuration in on-chip flash cells rather than the SRAM lookup tables used by Xilinx or Intel (Altera) devices. Because configuration is non-volatile, the A3P600 powers up instantly with no external boot PROM, no configuration controller, and no bitstream exposure during power-up - a major advantage for security-sensitive and high-reliability systems. In the programmable logic hierarchy, the A3P600 sits in the mid-density tier of the ProASIC3 family, above the A3P250 and below the A3P1000.
Key features include single-chip, single-voltage operation (1.425 V to 1.575 V core), support for optional soft ARM Cortex-M1 processor cores, abundant 18-kbit embedded block SRAM, and reprogrammability without a separate configuration device. The flash fabric also delivers inherently low static power and better SEU robustness than SRAM-based competitors.
Architecturally, the device is built from VersaTiles - a fine-grained logic tile that can act as a three-input LUT, a D-flip-flop, or a latch with enable - interconnected by segmented routing. Clock resources support multiple PLLs and clock-conditioning circuits for source-synchronous interfaces up to 231 MHz.
Typical applications include industrial automation controllers, medical instrumentation, military/aerospace subsystems (where the related RTAX radiation-tolerant family is used), communications bridging, and secure embedded systems requiring instant-on, tamper-resistant configuration storage.
Design consideration: the 484-FBGA requires careful power-plane design at 1.5 V and attention to simultaneously switching output (SSO) limits; consult the Microchip ProASIC3/E SSO and Pin Placement Guidelines when assigning high-drive I/O banks.
This page synthesizes distributor pricing, drop-in same-footprint alternatives, design notes, and AEO-optimized FAQs not consolidated in the manufacturer datasheet.
드롭인 대체품: A3P600-FG484 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600-FG484 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, System Gates, Core Supply Voltage, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600-FGG484I
✅ 드롭인✓ 재고 있음
$55.3 / 개
데이터시트 보기 →A3P600-FG484I
✅ 드롭인✓ 재고 있음
$25.4 / 개
데이터시트 보기 →A3P600-1FGG484
✅ 드롭인✓ 재고 있음
$52.4 / 개
데이터시트 보기 →A3P600-2FG484
✅ 드롭인✓ 재고 있음
$61.5 / 개
데이터시트 보기 →A3P600L-FG484
✅ 드롭인✓ 재고 있음
$85.9 / 개
데이터시트 보기 →A3P600-1FGG484I
✅ 드롭인✓ 재고 있음
$79.6 / 개
데이터시트 보기 →A3P600-FG484 최대 정격 & 전기적 특성
| Family | ProASIC3 (Flash FPGAs) |
| Total Gates | 600000 gates |
| Number of Registers | 13824 |
| VersaTiles (Logic Elements) | 13824 |
| Maximum User I/O | 235 I/O |
| System Performance | 231 MHz |
| Process Technology | 130 nm, 7-layer metal flash |
| Core Supply Voltage | 1.425 V to 1.575 V |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Embedded Memory | Embedded block SRAM (18 kbit blocks) |
| Soft Processor Support | ARM Cortex-M1 (optional soft core) |
| 패키지 | 484-pin FBGA, 23x23 mm |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (TJ) |
| RoHS 상태 | RoHS3 Compliant (lead-free per FGG variant) |
| Packaging | Tray |
| Programming | In-system programmable via JTAG, no external boot device |
A3P600-FG484 484-pin fbga, 23x23 mm 핀 구성 가이드
A3P600-FG484(484-pin fbga, 23x23 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P600-FG484.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P600-FG484 적합 용도: 6 애플리케이션s: Industrial Automation and Motor Control, Secure Embedded Systems, Communications and Network Bridging, Medical Instrumentation, Aerospace and Defense Subsystems, Test and Measurement Equipment.
Industrial Automation and Motor Control
The A3P600-FG484 fits industrial automation controllers because its 600K gates and 235 user I/Os aggregate encoders, fieldbus transceivers, and sensor arrays on one chip, while the 231 MHz fabric rating handles multi-axis PWM generation and interpolation loops. Its non-volatile flash configuration means a production line restarts instantly after power loss with no external configuration flash to corrupt, improving MTBF. Placed as the main sequencer between a host CPU and power stages, it offloads deterministic tasks; the trade-off is that the 1.5 V core requires a dedicated plane, and high-drive I/O banks must respect Microchip SSO guidelines to limit ground bounce across the 484-FBGA.
추천
Secure Embedded Systems
Flash-based ProASIC3 fabric stores configuration in non-volatile on-chip cells, so the A3P600-FG484 exposes no bitstream on an external bus during power-up - a foundational security property SRAM FPGAs lack. The 600K gates support AES/DES wrappers, secure boot state machines, and an optional ARM Cortex-M1 soft core, all loaded at power-on within microseconds. Single-chip operation removes the configuration PROM, eliminating one attack surface and one failure point. Designers should reserve JTAG programming access behind physical access control and use Microchip's design-security programming options; the trade-off is fabric-level crypto is slower than hardened crypto IP in ASICs.
추천
Communications and Network Bridging
With 235 I/Os and 231 MHz system performance, the A3P600-FG484 bridges interface protocols - SPI, I2C, UART, parallel buses, and source-synchronous DDR paths - in telecom line cards and network appliances. Embedded 18-kbit block SRAM implements FIFOs and packet buffers for rate adaptation between subsystems, and multiple PLLs condition clocks for synchronous interfaces. Instant-on flash configuration lets the fabric be active before the host SoC completes boot, enabling early link bring-up. Power is a design consideration: static draw is low, but dynamic I/O power on wide parallel buses can dominate, so group switching outputs per the Microchip SSO pin-placement guidelines.
추천
Medical Instrumentation
Medical diagnostic and monitoring equipment benefits from the A3P600-FG484's deterministic instant-on boot (no configuration download delay before acquisition begins), low static power for fanless benchtop enclosures, and 235 I/Os for driving sensor front ends, displays, and communication ports. The 600K-gate fabric implements digital filtering, trigger logic, and an ARM Cortex-M1 soft core for protocol handling around a dedicated analog front end. Reprogrammability allows field firmware updates via JTAG in validated devices. Note the commercial temperature suffix is rated 0C to +85C (TJ); specify the I-variant A3P600-FG484I for mobile or outdoor medical carts.
추천
Aerospace and Defense Subsystems
While radiation-tolerant deployments use Microchip RTAX devices, the flash-based A3P600-FG484 serves commercial-off-the-shelf defense ground equipment, test sets, and avionics support hardware where configuration readback security matters: flash cells cannot be probed through the power-up bitstream the way SRAM FPGAs can. The 600K gates implement bus interfaces (MIL-STD-1553-style framing, ARINC bridges) with 231 MHz headroom, and the single-chip instant-on architecture removes configuration PROMs from vibration-sensitive assemblies. Fabric SEU robustness is better than SRAM by construction, but designers should still add system-level parity or TMR for high-reliability missions.
추천
Test and Measurement Equipment
Bench instruments and automated test fixtures use the A3P600-FG484 as a pattern generator, timing controller, and glueless bridge to USB/PCI-style host interfaces. Its instant-on flash boot means the instrument is ready before the operator finishes setup, and the 235 I/Os drive DUT pin electronics, relays, and level-shifted logic families from one device. Embedded block SRAM captures waveforms or error logs; PLLs generate reference clocks for synchronous sampling. For production ATE racks, the low static power keeps fanless designs quiet. Verify speed-grade timing (consider A3P600-2FG484) when timing paths approach the 231 MHz fabric ceiling.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P600-FG484 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600-FGG484I | A3P600-1FGG484 | A3P600-2FG484 | A3P600L-FG484 |
|---|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm) | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Gate Density | 600,000 gates | 600,000 gates | 600,000 gates | 600,000 gates | 600,000 gates |
| User I/O | 235 | 235 | 235 | 235 | 235 |
| Speed Grade | Standard | Standard | -1 (standard) | -2 (faster) | Standard (low power) |
| Operating Temperature | 0C to +85C (TJ) | -40C to +100C (industrial) | 0C to +85C (TJ) | 0C to +85C (TJ) | 0C to +85C (TJ) |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V (low static power) |
| Configuration | On-chip flash, instant-on, JTAG ISP | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on |
주요 차별점
- True non-volatile instant-on configuration (vs A3PE600-FG484)
- Single-chip solution, no boot PROM (vs SRAM-based FPGAs (e.g., Xilinx Spartan family))
- Extended-temperature drop-in availability (vs A3P600-FGG484I)
설계 노트
The A3P600-FG484 core requires a regulated 1.5 V rail held within 1.425-1.575 V. Use a dedicated low-dropout regulator or buck converter with at least 10% headroom over the estimated dynamic current; flash-based ProASIC3 draws low static current but dynamic I/O power can dominate on wide switching buses. Provide bulk plus per-bank ceramic decoupling at the 484-FBGA VCC ball groups and a solid internal 1.5 V plane to minimize di/dt droop during simultaneous output switching.
The 23x23 mm, 0.8 mm-pitch FBGA needs planned escape routing - dog-bone fanout with 4 signal layers, or microvias-in-pad for higher layer-count boards. Before finalizing I/O bank assignment, consult the Microchip application note 'ProASIC3/E SSO and Pin Placement Guidelines', which contains device-specific tables for A3P600-FG484 that cap the number of simultaneously switching outputs per bus as a function of drive strength and slew rate. Violating these limits causes ground bounce and false clocking on adjacent inputs.
Do not confuse suffix meanings: FG484 vs FGG484 (green/lead-free finish), I-suffix (industrial temperature), digit prefix (speed grade), and L-suffix (low-power core) all describe the same die and pinout, but timing and temperature ratings differ. Also remember JTAG programming pins must be routed to a header even in production - the flash fabric is in-system programmable, and locking out JTAG entirely complicates field upgrades. Verify the exact ordering code at PO time; mixing speed grades on one reel is a common incoming-inspection failure.
규정 준수 정보
Per Microchip USA product data, the ProASIC3 series (e.g., A3P600-FGG484) carries ROHS3 Compliant status with lead-free packaging. Automotive ProASIC3 variants exist as a separate product line (AEC-Q-oriented datasheet DS50003485); the standard commercial A3P600-FG484 itself is not an automotive-qualified ordering code. REACH and conflict-minerals declarations were not found in the provided data.
