A3PE3000-2FG484I - ProASIC3E FPGA 3M Gates | Microchip
부품 번호: A3PE3000-2FG484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.3 | $823.00 |
| 100 | $74.1 | $7,410.00 |
| 500 | $66.8 | $33,400.00 |
| 1,000 | $59.6 | $59,600.00 |
A3PE3000-2FG484I 개요
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. Unlike ASICs, FPGAs are reprogrammable, allowing design changes without costly mask revisions. The ProASIC3E family uses flash-based configuration cells, which are non-volatile, meaning the device retains its configuration when power is removed, eliminating the need for external boot memory and providing instant-on capability. This makes it a secure, single-chip solution in the programmable logic hierarchy, positioned between CPLDs and high-end SRAM-based FPGAs.
Key features of the A3PE3000-2FG484I include 3 million system gates, 75,264 logic cells (CLBs), 516,096 bits of embedded RAM, and 341 user I/Os. It supports up to 310 MHz system performance and is fabricated in 130nm flash technology. The device includes advanced features such as programmable I/O standards, clock conditioning circuits (CCC/PLL), and an abundance of routing resources. Its flash-based architecture provides inherent security against reverse engineering and configuration bitstream interception, a critical advantage over SRAM-based FPGAs.
Technically, the ProASIC3E family integrates a flash switch fabric that is programmed at the factory or in the field. The device supports multiple I/O standards including LVCMOS, LVTTL, PCI, and differential standards like LVDS and LVPECL. It includes up to 6 PLLs and 6 CCCs for clock management. The 130nm process technology balances performance and power, with a core voltage of 1.5V and low static power consumption. The 484-pin FBGA package (23x23 mm, 1.0 mm pitch) provides excellent thermal and electrical characteristics for high-density designs.
Typical applications include industrial automation, communications infrastructure, medical imaging, aerospace and defense systems, and consumer electronics. The device is ideal for implementing glue logic, bus interfaces, protocol controllers, and DSP functions. Its non-volatile, secure configuration makes it suitable for applications requiring high reliability and anti-tamper features, such as encryption engines and secure boot controllers.
When designing with this FPGA, consider the power supply decoupling: place 0.1uF and 10uF capacitors close to each VCC and GND pin to minimize noise. Also, use the dedicated programming pins (TCK, TMS, TDI, TDO) for in-system programming via JTAG. The device supports both JTAG and SPI flash programming, allowing flexible configuration updates.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3PE3000-2FG484I.
드롭인 대체품: A3PE3000-2FG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000-2FG484I (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, RoHS Status, System Gates, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000-2FGG484I
✅ 드롭인✓ 재고 있음
$89.4 / 개
데이터시트 보기 →A3PE3000-2FG484
✅ 드롭인✓ 재고 있음
$152 / 개
데이터시트 보기 →A3PE3000-2FGG484
✅ 드롭인✓ 재고 있음
$28.9 / 개
데이터시트 보기 →A3PE3000-1FG484I
✅ 드롭인✓ 재고 있음
$125 / 개
데이터시트 보기 →A3PE3000-1FGG484I
✅ 드롭인✓ 재고 있음
$1336.6 / 개
데이터시트 보기 →A3PE3000-2FG484I 최대 정격 & 전기적 특성
| Family | ProASIC3E |
| Total System Gates | 3,000,000 |
| Logic Cells (CLBs) | 75,264 |
| RAM Bits | 516,096 |
| User I/O Count | 341 |
| Maximum System Performance | 310 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm |
| 패키지 | 484-pin FBGA (23x23 mm, 1.0 mm pitch) |
| 실장 유형 | Surface Mount |
| 동작 온도 범위 | -40C to +100C (industrial) |
| Configuration Type | Flash-based (non-volatile) |
| I/O Standards Supported | LVCMOS, LVTTL, PCI, LVDS, LVPECL, etc. |
| PLLs / CCCs | 6 / 6 |
| RoHS 상태 | Compliant |
A3PE3000-2FG484I 484-pin fbga (23x23 mm, 1.0 mm pitch) 핀 구성 가이드
A3PE3000-2FG484I(484-pin fbga (23x23 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000-2FG484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000-2FG484I 적합 용도: 6 애플리케이션s: Industrial Automation, Communications Infrastructure, Medical Imaging, Aerospace and Defense, Consumer Electronics, Automotive Electronics.
Industrial Automation
The A3PE3000-2FG484I is ideal for industrial automation systems such as PLCs, motor control, and robotics. Its 3M gates and 341 I/Os allow implementation of complex control logic, communication interfaces (Ethernet, CAN, RS-485), and sensor fusion. The flash-based, non-volatile configuration ensures instant-on operation and high reliability in harsh environments. With 310 MHz performance, it can handle real-time processing tasks, while the 1.5V core reduces power consumption. The industrial temperature grade (-40C to +100C) makes it suitable for factory floors and outdoor installations. Its secure configuration prevents unauthorized access, protecting intellectual property in competitive industrial markets.
추천
Communications Infrastructure
In communications infrastructure, the A3PE3000-2FG484I excels in implementing protocol controllers, packet processing, and interface bridging. Its 516,096 bits of RAM provide ample buffering for data packets, while 341 I/Os support multiple high-speed interfaces like LVDS and LVPECL. The 310 MHz system performance enables line-rate processing for Gigabit Ethernet and other protocols. The device's low power consumption is critical for densely populated network equipment. Its non-volatile configuration ensures secure boot and prevents bitstream tampering, which is essential for network security. The 484-pin FBGA package offers good signal integrity for high-speed PCB designs.
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Medical Imaging
The A3PE3000-2FG484I is well-suited for medical imaging systems such as ultrasound, MRI, and CT scanners. Its 3M gates can implement image processing algorithms, sensor interfaces, and display controllers. The 516,096 bits of RAM support frame buffering and line storage. The device's high reliability and long-term availability are critical for medical devices with extended lifecycles. The flash-based configuration provides instant-on capability, reducing startup time in critical diagnostic equipment. The industrial temperature grade ensures operation in controlled clinical environments. Its secure configuration protects proprietary imaging algorithms from reverse engineering.
추천
Aerospace and Defense
The A3PE3000-2FG484I is a trusted choice for aerospace and defense applications due to its flash-based, non-volatile configuration that provides inherent security against reverse engineering and tampering. It is used in avionics, radar, electronic warfare, and secure communication systems. The 3M gates and 341 I/Os enable complex signal processing and interface management. The device's radiation-tolerant characteristics (though not fully rad-hard) make it suitable for certain space applications. Its instant-on capability is crucial for mission-critical systems. The industrial temperature grade and high reliability meet military standards. The 484-pin FBGA package offers robust mechanical integrity for harsh environments.
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Consumer Electronics
In consumer electronics, the A3PE3000-2FG484I can be used in smart home hubs, gaming peripherals, and multimedia devices. Its 3M gates provide ample logic for implementing user interfaces, protocol stacks, and audio/video processing. The 1.5V core and low power consumption extend battery life in portable devices. The flash-based configuration allows field updates via JTAG or SPI, enabling feature upgrades. The device's small footprint (23x23 mm) fits compact PCBs. Its non-volatile configuration eliminates the need for external configuration memory, reducing BOM cost. The industrial temperature grade ensures reliable operation in various consumer environments.
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Automotive Electronics
The A3PE3000-2FG484I is suitable for automotive applications such as infotainment systems, advanced driver-assistance systems (ADAS), and body control modules. Its 3M gates can implement video processing, sensor fusion, and communication interfaces (CAN, LIN, FlexRay). The device's flash-based configuration provides instant-on capability, essential for safety-critical systems. The industrial temperature grade (-40C to +100C) covers automotive under-hood and cabin environments. Its high reliability and long-term availability meet automotive quality requirements. The secure configuration protects against unauthorized modifications, enhancing vehicle security. The 484-pin FBGA package is suitable for automotive PCBs with proper thermal management.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE3000-2FG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000-2FGG484I | A3PE3000-2FG484 | A3PE3000-2FGG484 | A3PE3000-1FG484I | A3PE3000-1FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Total System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | 75,264 | 75,264 | 75,264 | 75,264 | 75,264 |
| RAM Bits | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 |
| User I/O Count | 341 | 341 | 341 | 341 | 341 | 341 |
| Maximum System Performance | 310 MHz | 310 MHz | 310 MHz | 310 MHz | 250 MHz | 250 MHz |
| Operating Temperature Range | -40C to +100C | -40C to +100C | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +100C |
주요 차별점
- Industrial temperature grade (-40C to +100C) (vs A3PE3000-2FG484)
- Higher speed grade (310 MHz) (vs A3PE3000-1FG484I)
- Tin-lead finish for legacy processes (vs A3PE3000-2FGG484I)
설계 노트
The A3PE3000-2FG484I requires a 1.5V core supply and separate I/O supply voltages (typically 1.5V, 1.8V, 2.5V, or 3.3V depending on I/O standard). Use a dedicated voltage regulator for the core and ensure adequate decoupling: place 0.1uF and 10uF capacitors close to each VCC and GND pin. The total power consumption depends on logic utilization and toggle rate; estimate using the Microchip power calculator. For high-speed designs, consider using multiple power planes to minimize noise.
For the 484-pin FBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance (e.g., 50 ohm single-ended, 100 ohm differential). Place decoupling capacitors on the bottom side directly under the FPGA to minimize loop inductance. Follow the layout guidelines in the Microchip ProASIC3E user guide for optimal signal integrity. Ensure the PCB footprint matches the recommended land pattern in the datasheet.
A common pitfall is forgetting to connect the JTAG programming pins (TCK, TMS, TDI, TDO) to a header for in-system programming. Also, ensure the VCCPLL pins are properly connected to the PLL supply voltage (1.5V) and decoupled. Do not leave unused I/O pins floating; configure them as inputs with pull-ups or as outputs to avoid excessive current draw. Verify that the configuration voltage (VCC) is within the specified range to prevent programming failures.
규정 준수 정보
The -2FG484I has tin-lead finish, so it is not lead-free. RoHS compliance is indicated by the 'G' suffix in the part number; this part does not have the 'G', so it is not RoHS-compliant. For RoHS-compliant version, use A3PE3000-2FGG484I.
