A3PE3000-2FGG896 - 3M-Gate ProASIC3E Flash FPGA | Microchip
부품 번호: A3PE3000-2FGG896 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $189 | $189.00 |
| 10 | $175 | $1,750.00 |
| 100 | $158 | $15,800.00 |
| 500 | $142 | $71,000.00 |
| 1,000 | $128 | $128,000.00 |
A3PE3000-2FGG896 개요
A flash-based FPGA stores its configuration in on-chip flash memory rather than SRAM, so the device configures instantly at power-up with no external boot PROM. Within the programmable logic hierarchy (FPGA -> programmable logic device -> semiconductor), flash FPGAs sit apart from SRAM FPGAs because they are single-chip, non-volatile, and inherently secure against bitstream interception - a key reason ProASIC3E is widely adopted as an ASIC replacement in avionics, networking, and industrial systems.
Key features include a 1.5V core supply (1.425V to 1.575V operating range), support for optional soft ARM support per the ProASIC3E datasheet, and the speed-grade -2 performance bin. The device supports voltage-referenced I/O standards with one VREF pin assigned per I/O minibank.
Architecturally, the ProASIC3E fabric uses VersTiles with abundant embedded SRAM and flash memory resources, fabricated in CMOS technology. Flash switching elements keep static power low and eliminate configuration time, giving deterministic single-chip startup that SRAM FPGAs cannot match without auxiliary configuration devices.
Typical applications include avionics and defense systems requiring bitstream security, networking and communications line cards, industrial control backplanes, and consumer high-volume designs migrating from ASIC where NRE cost matters.
A key design consideration: the FG256/FG484 packages are footprint-compatible, and the G suffix in FGG indicates RoHS-compliant construction, so footprint reuse across the ProASIC3E family simplifies migration between densities.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3PE3000-2FGG896 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000-2FGG896 (동일 폼 팩터 및 풋프린트) — 차이점: Family, Package, Operating Temperature, Configuration Memory, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000-FGG896
✅ 드롭인✓ 재고 있음
$340 / 개
데이터시트 보기 →A3PE3000L-FGG896M
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-FGG896I
✅ 드롭인✓ 재고 있음
$139.9 / 개
데이터시트 보기 →A3PE3000L-FG896M
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000-FG896
✅ 드롭인✓ 재고 있음
$129.8 / 개
데이터시트 보기 →A3PE3000L-1FGG896I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000-2FGG896 최대 정격 & 전기적 특성
| Family | ProASIC3E |
| Number of System Gates | 3,000,000 |
| Number of I/Os | 620 |
| Supply Voltage (Core) | 1.425 V to 1.575 V (1.5 V nominal) |
| Speed Grade | -2 |
| 패키지 | 896-BGA / 896-FBGA (31x31 mm, 1.0 mm ball pitch) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to 85C (TJ) |
| Configuration Memory | On-chip Flash (non-volatile, single chip) |
| Technology | CMOS flash |
| Soft ARM Support | Optional (per ProASIC3E datasheet) |
| Packaging | Tray |
| RoHS 상태 | ROHS3 Compliant (G suffix) |
| Manufacturer Lead Time | 8 weeks |
| Product Status | Active |
A3PE3000-2FGG896 896-bga / 896-fbga (31x31 mm, 1.0 mm ball pitch) 핀 구성 가이드
A3PE3000-2FGG896(896-bga / 896-fbga (31x31 mm, 1.0 mm ball pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000-2FGG896.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000-2FGG896 적합 용도: 6 애플리케이션s: Avionics and Defense Systems, Networking and Communications Line Cards, ASIC Prototyping and Low-Volume ASIC Replacement, Industrial Control and Automation Backplanes, Secure and Encrypted Data Systems, Medical Imaging and Instrumentation.
Avionics and Defense Systems
The A3PE3000-2FGG896 fits avionics designs because its on-chip flash configuration eliminates the external boot device - a common corruption and attack surface in SRAM FPGA systems. The 3,000,000-gate fabric and 620 user I/Os integrate bus interfaces, ARINC-style glue logic, and data-path functions in one chip, reducing component count in certified platforms. Its 1.5V core keeps dynamic power manageable in conduction-cooled enclosures. Deployed between backplane receivers and processing boards, it adds no configuration latency at power-up, meeting deterministic startup expectations. For extended-temperature flight decks, substitute the pin-compatible A3PE3000-2FGG896I rated to -40C. The trade-off versus SRAM FPGAs is lower top-end fabric speed, acceptable for interface and control roles rather than DSP-heavy signal chains.
추천
Networking and Communications Line Cards
In networking and communications equipment, the A3PE3000-2FGG896 serves as high-density glue logic: it bridges switch ASICs to PHYs, handles backplane framing, and implements board management controllers. Its 620 I/Os in a single 31x31 mm 896-FBGA replace dozens of discrete logic devices, cutting BOM cost and board area on dense line cards. The flash fabric powers up configured before the host CPU resets, letting the FPGA perform early-stage power sequencing and I2C rail monitoring - a task SRAM FPGAs cannot do without external configuration. The -2 speed grade supports mid-rate LVCMOS/LVTTL interfaces; verify timing for the fastest SerDes-class paths, which this family does not target. Low static power from flash switching elements reduces line-card standby draw.
추천
ASIC Prototyping and Low-Volume ASIC Replacement
Microchip positions the ProASIC3E family as a cost-effective ASIC replacement for consumer, networking, computing, and avionics markets, and the A3PE3000-2FGG896 is the family's high-density member. Design teams use it to prototype RTL before committing mask sets, then keep the same device in low-volume production to avoid ASIC NRE entirely. The 3,000,000 gates accommodate moderately sized ASIC netlists, and single-chip flash configuration means the prototype board matches final product behavior, including instant-on behavior. With 620 I/Os, wide bus interfaces map naturally. Libero SoC supports synthesis and timing closure for the -2 speed grade. The honest trade-off: per-unit cost exceeds masked ASIC above roughly tens of thousands of units, so plan a migration point accordingly.
추천
Industrial Control and Automation Backplanes
Industrial automation backplanes benefit from the A3PE3000-2FGG896's combination of non-volatile configuration and wide I/O count. The device implements fieldbus interfaces, encoder counters, and safety-interlock logic that must be operational immediately at power-up - guaranteed by on-chip flash with no configuration download. The 0C to 85C junction range suits factory-floor enclosures with active cooling, while the 1.5V core keeps dissipation low inside sealed cabinets. Its 620 I/Os connect isolated I/O modules, and banked VCCI supports mixed-voltage levels (5V-tolerant standards per datasheet) for legacy 24V-era sensor racks. For uncooled outdoor cabinets, the pin-compatible low-power A3PE3000L-FGG896M reduces thermal load. Use XAIPART's family alternatives to qualify a second source within the same footprint.
추천
Secure and Encrypted Data Systems
Security-focused systems choose flash FPGAs because the bitstream never leaves the chip: configuration lives in on-chip flash, removing the interception risk of SRAM FPGA bitstream loading. The A3PE3000-2FGG896 implements encryption key handling, secure boot support logic, and tamper-response state machines across its 3,000,000 gates and 620 I/Os. Single-chip construction shrinks the trusted-computing base and simplifies certification evidence for cryptographic modules. Instant-on flash startup lets the FPGA gate sensitive rails before the main CPU releases reset, enforcing board-level power-on policy. Power side-channel and pin-probing considerations still apply at the PCB level, so combine the device with Microchip's design-security application guidance. The -2 speed grade suffices for key-scheduling and interface roles rather than bulk symmetric ciphering at line rate.
추천
Medical Imaging and Instrumentation
Medical imaging front ends - ultrasound beamformers, digital radiography panels, and lab instrumentation - need many I/Os and deterministic startup, both strengths of the A3PE3000-2FGG896. Its 620 user I/Os interface large sensor arrays and multichannel ADCs, while flash configuration ensures the acquisition engine is ready the moment safety interlocks release, without boot-device failure modes. The 3M-gate fabric implements timing generators, filter pre-processing, and camera-link-class interfaces. The 1.5V core and flash switching elements keep fan noise and heat low in quiet clinical environments. For portable battery-powered instruments, the pin-compatible A3PE3000L-FGG896M cuts static power, extending battery runtime. Verify I/O standards against sensor timing requirements in Libero SoC, as the -2 grade targets mid-speed logic rather than multi-gigabit links.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE3000-2FGG896 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000-FGG896 | A3PE3000L-FGG896M | A3PE3000L-FG896M |
|---|---|---|---|---|
| Package | 896-FBGA (31x31 mm) | 896-FBGA - same | 896-FBGA - same | 896-FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/Os | 620 | 620 | 620 | 620 |
| Power Profile | Standard (A3PE3000) | Standard | Low power (L) | Low power (L) |
| RoHS | ROHS3 Compliant | Compliant (G) | Compliant (M) | Compliant (M) |
주요 차별점
- Fastest (-2) speed grade in the 896-FBGA footprint (vs A3PE3000-FGG896)
- Lower operating power than L-variant footprint-mates (vs A3PE3000L-FGG896M)
- RoHS-compliant packaging (vs A3PE3000-FG896)
설계 노트
Estimated: with a 1.5V core at the 1.425V-1.575V allowed range, budget core current using Libero SoC power analysis after place-and-route; flash ProASIC3E static power is far lower than SRAM FPGAs but dynamic power scales with toggle rate. Provide independent VCCI per I/O bank so mixed-voltage standards can be supported, and assign one VREF pin per minibank when using voltage-referenced I/O standards, per the ProASIC3E datasheet.
The 896-FBGA uses a 1.0 mm ball pitch on a 31x31 mm body. Use via-in-pad or dogbone fanout with 0.3 mm finished vias, and verify solder-mask-defined pad geometry against the Microchip package drawing. Ball-map pinout files (CSV/Verilog pin constraints) are distributed through Libero SoC - never hand-derive the 896-ball map. The FG256 and FG484 packages are footprint-compatible per the datasheet, which enables migration without re-layout when density changes.
Do not substitute a non-G FG896 (leaded) part into a RoHS-restricted build - the G suffix denotes RoHS-compliant packaging per the ProASIC3E ordering information. Confirm the speed grade suffix (-2 vs standard/-1) before drop-in swaps within the same package, since timing closure in Libero SoC must be re-run. The commercial-grade part is rated 0C to 85C TJ; industrial applications need the I-suffix variant. Manufacturer lead time is 8 weeks - maintain buffer stock.
규정 준수 정보
ROHS3 Compliant per Microchip USA product data; G suffix indicates RoHS-compliant package per ProASIC3E datasheet ordering information. REACH, halogen-free, and conflict-minerals status not stated in provided data.
