A3PE3000-FGG896 - ProASIC3E 3M-Gate Flash FPGA 896-BGA | Microchip
MPN: A3PE3000-FGG896 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $445 | $4,450.00 |
| 100 | $405 | $40,500.00 |
| 500 | $372 | $186,000.00 |
| 1,000 | $340 | $340,000.00 |
Drop-in alternatives for A3PE3000-FGG896 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000-FGG896I
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$135.2 / Unit
View Datasheet →A3PE3000L-FGG896M
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View Datasheet →A3PE3000L-FGG896I
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$139.9 / Unit
View Datasheet →A3PE3000L-1FGG896M
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$432 / Unit
View Datasheet →A3PE3000L-1FGG896I
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View Datasheet →A3PE3000-FGG896 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E (Flash FPGA) |
| System Gates | 3000000 |
| Logic Elements | 35000 |
| CLBs | 75264 |
| Total Memory Bits | 516096 |
| User I/O | 620 |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| Configuration Type | Flash (non-volatile, single-chip) |
| Package | 896-ball FBGA (FGG896) |
| Mounting Type | Surface Mount |
| Packaging | Tray |
A3PE3000-FGG896 896-ball fbga (fgg896) Pin Configuration Guide
Complete pinout information for A3PE3000-FGG896 (896-ball fbga (fgg896) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-FGG896.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-FGG896 is suitable for 6 applications: Industrial Control and Automation, Networking and Communications Equipment, Avionics and Defense Subsystems, ASIC Replacement and Prototyping, Computing and Server Board Management, Wireless and RF Baseband Support.
Industrial Control and Automation
The A3PE3000-FGG896 fits industrial control backplanes and automation controllers because its 620 user I/Os handle dense fieldbus, sensor, and actuator interfaces, while 3 million system gates absorb glue logic, PWM engines, and protocol bridges in one device. Flash configuration means the controller is live immediately at power-up with no configuration PROM delay, improving fault-recovery time on factory floors. Placed between power and I/O banks with proper 1.5V core regulation, it consolidates multiple CPLDs and ASSPs; the trade-off is 130nm-class speed, so hard real-time loops above roughly 200 MHz system clock need architectural partitioning rather than raw frequency headroom.
Recommended
Networking and Communications Equipment
In switch, router, and wireless infrastructure boards, the A3PE3000-FGG896 serves as system fabric glue logic, interfacing MACs, PHYs, and backplane connectors with its 620 I/Os and 516096 memory bits for packet buffering FIFOs. Its non-volatile flash configuration simplifies power-sequencing design in rack systems where every millisecond of boot time matters, and the 3M-gate capacity implements address decoding, status aggregation, and bridging that would otherwise consume several smaller devices. The 231 MHz system performance supports common line-card housekeeping functions; for deep-packet processing, pair it with dedicated network processors rather than soft cores to stay within timing closure.
Recommended
Avionics and Defense Subsystems
Avionics designers choose the A3PE3000-FGG896 because Actel/Microchip flash FPGAs have a long heritage in aerospace platforms where configuration read-back protection and instant-on behavior are required. The single-chip flash architecture eliminates the external configuration stream that could be intercepted or corrupted under radiation or tampering scenarios, and 3 million gates implement sensor aggregation, ARINC-style interface logic, and built-in-test controllers. The 620 I/Os support redundant bus interfaces across an 896-ball FBGA with robust mechanical attachment. Verify the specific temperature and qualification grade ordering code against the program's environmental specification before design freeze.
Recommended
ASIC Replacement and Prototyping
The ProASIC3E family was explicitly positioned by Microchip as a cost-effective ASIC replacement for consumer, networking, computing, and avionics markets, and the A3PE3000-FGG896 is the family's largest member. Its 3 million system gates and 75264 CLBs provide enough capacity to prototype mid-size ASIC designs or bridge production gaps while a mask-ROM ASIC is fabricated, and the 516096 memory bits absorb embedded RAM blocks without external SRAM. Because configuration is on-chip flash, prototype boards boot like final ASIC hardware, easing firmware integration. Watch die-level utilization: place-and-route typically targets under 80 percent fabric utilization for reliable timing closure.
Recommended
Computing and Server Board Management
Server and storage platform boards use the A3PE3000-FGG896 as a board-management FPGA handling hot-swap control, slot presence detection, voltage monitoring aggregation, and fan control across 620 I/Os. Flash configuration guarantees the management logic is operational before host CPUs release reset, which is essential for power-good sequencing in multi-rail servers. The 516096 memory bits buffer event logs and sensor histories, and the 231 MHz fabric speed easily handles management-bus polling. The low-power A3PE3000L variant is attractive here since management FPGAs run continuously, so static power savings compound across always-on chassis.
Recommended
Wireless and RF Baseband Support
Wireless infrastructure and RF equipment leverage the A3PE3000-FGG896 for baseband framing, filter coefficient storage, and RF module sequencing, using the 3M-gate fabric for digital down-conversion helpers and the 620 I/Os to connect multiple transceiver chains. Flash configuration keeps RF calibration state machines available at power-up without boot devices, shortening link-establishment time in repeaters and small-cell hardware. The 516096 memory bits hold lookup tables for gain and frequency compensation. For wideband signal paths, keep high-speed serial interfaces on dedicated transceiver devices and use the FPGA for control and moderate-rate parallel data to respect 130nm timing limits.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-FGG896 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000-FGG896I | A3PE3000L-FGG896M | A3PE3000L-1FGG896I |
|---|---|---|---|---|
| Package | 896-ball FBGA (FGG896) | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA - same |
| Brand | Microchip Technology (Actel) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3000000 | 3000000 | 3000000 | 3000000 |
| Logic Elements | 35000 | 35000 | 35000 | 35000 |
| User I/O | 620 | 620 | 620 | 620 |
| Max System Frequency | 231 MHz | 231 MHz | [DATA_NEEDED] | Lower (speed grade -1) [DATA_NEEDED: exact MHz] |
| Power Class | Standard ProASIC3E | Standard | Low power (L variant) | Low power (L variant) |
| Temperature Grade | [DATA_NEEDED: temperature grade suffix] | Industrial (-40C to +100C class) | [DATA_NEEDED] | Industrial |
Key Differentiators
- Standard speed grades for maximum timing margin (vs A3PE3000L-1FGG896I)
- Lower static power option within same footprint (vs A3PE3000-FGG896I)
- Non-volatile single-chip flash configuration (vs SRAM FPGAs of similar density)
Design Notes
The A3PE3000-FGG896 core operates at 1.5V and flash FPGAs draw core current that scales strongly with clock activity and utilization. Estimated: at 75264 CLBs with moderate toggling activity, core current can reach multiple amperes, so size the 1.5V rail regulator and power-plane copper for worst-case static plus dynamic estimates from Microchip's power calculator in Libero SoC. Decouple each VCC core ball group with 0.1uF ceramics plus bulk capacitance near the package. Verify I/O bank voltage grouping before finalizing rail count.
Escape routing a 0.8mm-pitch-class 896-ball FBGA typically requires at least 8-10 PCB layers with via-in-pad or dog-bone fanout. Plan I/O bank assignment early using the datasheet ball map so that high-speed interfaces land on banks with appropriate I/O standards, and reserve escape channels for the 620 user I/Os. Place bulk decoupling capacitors on the underside of the BGA footprint to minimize loop inductance. A daisy-chain JTAG access point must reach all boundary-scan devices for production test.
Although flash configuration removes the external boot PROM, designers frequently still violate power sequencing by enabling I/O bank rails after the core in ways that back-drive pads; follow the ProASIC3E datasheet power-up requirements exactly. Second, timing closure with the 231 MHz family limit requires meeting static timing after place-and-route - do not assume source-synchronous interfaces close at the headline frequency. Third, when substituting low-power L variants, recompile against the correct speed-grade files rather than assuming binary compatibility of the timing report.
Compliance Information
Microchip offers lead-free/RoHS-compliant ordering options for ProASIC3E FGG896 parts, but exact RoHS/REACH status for this ordering code was not stated in the retrieved data; confirm on the Microchip product status page.
