Microchip Technology
A3PE3000L-FG896M - 3M-Gate Low-Power Flash FPGA | Microchip
부품 번호: A3PE3000L-FG896M ✓ 활성
재고 있음
영업일 기준 1~3일 내 발송
1.2 V / 1.5 V Vdss
896-ball FBGA (FG896) Package
On-chip flash (nonvolatile, single-chip) Memory
문의하기
가격 문의
MOQ: 1 |
가격 업데이트: 2026-09-02
볼륨 가격
| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1 | $1.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
ℹ️ 모든 가격은 USD 기준입니다
A3PE3000L-FG896M 개요
The Microchip (formerly Microsemi/Actel) A3PE3000L-FG896M is a 3-million-gate ProASIC3L low-power flash FPGA with 75,264 logic cells and 620 user I/O, fabricated on a 130nm CMOS flash process and housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package operating from a 1.2V/1.5V core supply.
A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions that do not require an external configuration PROM, power up instantly, and are inherently more secure because the bitstream is not stored externally. Within the power management hierarchy of programmable logic, the ProASIC3L family sits as Microchip's low-power variant of the ProASIC3/ProASIC3E families, adding Flash*Freeze technology.
Key differentiating features include Flash*Freeze technology, which allows the device to enter an ultra-low-power sleep mode while retaining state and waking in microseconds; 1.2V to 1.5V core operation for reduced dynamic and static power; single-chip reprogrammable flash configuration; Schmitt-trigger option on single-ended inputs; and weak pull-up/pull-down support on I/O.
Technically, the device uses a sea-of-gates flash architecture with versatile logic elements, embedded block RAM, and supports IEEE 1149.1 (JTAG) boundary scan testing. The pin-compatible package strategy across the ProASIC3L family (except PQ208) allows design migration between density grades without PCB rework.
Typical applications include military and aerospace systems, industrial automation, portable instrumentation, and low-power embedded control where nonvolatile single-chip configuration and minimal standby power are essential.
Design consideration: the M temperature grade suffix indicates a military-grade screening level; verify supply sequencing and use Microchip Libero SoC design tools for implementation.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions that do not require an external configuration PROM, power up instantly, and are inherently more secure because the bitstream is not stored externally. Within the power management hierarchy of programmable logic, the ProASIC3L family sits as Microchip's low-power variant of the ProASIC3/ProASIC3E families, adding Flash*Freeze technology.
Key differentiating features include Flash*Freeze technology, which allows the device to enter an ultra-low-power sleep mode while retaining state and waking in microseconds; 1.2V to 1.5V core operation for reduced dynamic and static power; single-chip reprogrammable flash configuration; Schmitt-trigger option on single-ended inputs; and weak pull-up/pull-down support on I/O.
Technically, the device uses a sea-of-gates flash architecture with versatile logic elements, embedded block RAM, and supports IEEE 1149.1 (JTAG) boundary scan testing. The pin-compatible package strategy across the ProASIC3L family (except PQ208) allows design migration between density grades without PCB rework.
Typical applications include military and aerospace systems, industrial automation, portable instrumentation, and low-power embedded control where nonvolatile single-chip configuration and minimal standby power are essential.
Design consideration: the M temperature grade suffix indicates a military-grade screening level; verify supply sequencing and use Microchip Libero SoC design tools for implementation.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3PE3000L-FG896M — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000L-FG896M (동일 폼 팩터 및 풋프린트) — 차이점: Family, Package, Configuration Memory, Process Technology, RoHS Status.
Microchip Technology
Family: ProASIC3E
Package: 896-BGA / 896-FBGA (31x31 mm, 1.0 mm ball pitch)
Configuration Memory: On-chip Flash (non-volatile, single chip)
비교 대상: A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3E
Package: 896-BGA (FBGA)
Configuration Memory: Flash (non-volatile, reprogrammable)
비교 대상: A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3L (Flash FPGA)
Package: 896-ball FBGA
Process Technology: 130 nm Flash
비교 대상: A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3L
Package: 896-ball FBGA
Configuration Memory: Nonvolatile flash (single-chip, Instant On)
비교 대상: A3PE3000L-FG896M →
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청A3PE3000L-FG896M 최대 정격 & 전기적 특성
| Family | ProASIC3L (ProASIC3EL) |
| Equivalent Gates | 3,000,000 |
| Logic Cells | 75,264 |
| User I/O | 620 |
| Process Technology | 130 nm CMOS flash |
| Core Voltage | 1.2 V / 1.5 V |
| 패키지 | 896-ball FBGA (FG896) |
| 실장 유형 | Surface Mount |
| Configuration Memory | On-chip flash (nonvolatile, single-chip) |
| Low-Power Technology | Flash*Freeze |
| JTAG Boundary Scan | IEEE 1149.1 |
| Input Type Option | Schmitt trigger on single-ended inputs |
| Pull Resistors | Weak pull-up / pull-down |
| Temperature Grade | M (military screening per suffix) |
A3PE3000L-FG896M 896-ball fbga (fg896) 핀 구성 가이드
A3PE3000L-FG896M(896-ball fbga (fg896) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000L-FG896M.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000L-FG896M 적합 용도: 3 애플리케이션s: 임베디드 시스템, IoT 기기, 산업 제어.
임베디드 시스템
A3PE3000L-FG896M을(를) 사용한 임베디드 애플리케이션의 핵심 처리.
IoT 기기
A3PE3000L-FG896M을(를) 기반으로 한 스마트 연결 기기.
산업 제어
A3PE3000L-FG896M을(를) 사용한 자동화 및 제어 시스템.
이 제품에 대한 FAQ가 없습니다.
엔지니어링 참조 데이터: A3PE3000L-FG896M — 비교, 설계 지침 및 규정 준수 정보.
규정 준수 정보
RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown
Compliance data not present in the provided web data.
데이터 검증일: 2026-09-02
— XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터
관련 부품 & 용어
Microchip Technology
Actel Corporation
Microsemi Corporation
A3PE3000L-FG896M
ProASIC3L
flash FPGA
field-programmable gate array
Flash*Freeze technology
896-ball FBGA
IEEE 1149.1 JTAG
130nm CMOS
SRAM FPGA
low-power FPGA
military FPGA
boundary scan
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