A3PE3000-FGG484 - ProASIC3E FPGA 3M Gates 484-BGA | Microchip
부품 번호: A3PE3000-FGG484 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $190.75 | $190.75 |
| 10 | $181.2 | $1,812.00 |
| 100 | $171.6 | $17,160.00 |
| 500 | $162.1 | $81,050.00 |
| 1,000 | $152.6 | $152,600.00 |
A3PE3000-FGG484 개요
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory rather than an external configuration device. Within the programmable logic hierarchy - FPGA -> field-programmable gate array -> programmable SoC/programmable logic device - flash FPGAs occupy the single-chip niche: they power up instantly, require no boot PROM, and offer inherent security against configuration readback compared with SRAM FPGAs.
Key features include non-volatile flash programming (single-chip solution, low total cost of ownership), reprogrammability for in-field updates, abundant advanced features such as embedded block RAM, and the large 341 I/O count that suits wide bus interfaces. The ProASIC3E variant adds up to 2 Mbit of embedded RAM and PLL support, targeting system-level integration.
Technically, the fabric uses a sea-of-gates architecture with VersNet routing and flash switch elements, eliminating volatile configuration and its associated power-up glitch risk. The 130 nm CMOS process with 1.5 V core keeps static power moderate, while the FBGA-484 footprint provides dense, high-speed interconnect for DDR-class interfaces.
Typical applications include industrial automation controllers, communications and networking line cards, medical instrumentation, military/aerospace secure systems, and test equipment, where instant-on operation and configuration security are valued.
A key design consideration: ProASIC3E FGG484 parts are RoHS lead-free (FGG suffix), whereas FG484 variants are not - verify soldering compatibility before substitution.
This page synthesizes distributor pricing, drop-in alternatives within the ProASIC3/3E family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3PE3000-FGG484 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000-FGG484 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, RoHS Status, System Gates, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000-FGG484I
✅ 드롭인✓ 재고 있음
$1451.56 / 개
데이터시트 보기 →A3PE3000-FG484
✅ 드롭인✓ 재고 있음
$139.75 / 개
데이터시트 보기 →A3PE3000L-FGG484M
✅ 드롭인✓ 재고 있음
$298 / 개
데이터시트 보기 →A3PE3000L-1FGG484
✅ 드롭인✓ 재고 있음
$134 / 개
데이터시트 보기 →A3PE3000L-FGG484I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000-FGG484 최대 정격 & 전기적 특성
| Family | ProASIC3E |
| System Gates | 3000000 gates |
| Logic Cells | 75264 |
| User I/O | 341 |
| Total RAM Bits | 516096 |
| Maximum Operating Frequency | 231 MHz |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Program Memory Type | Flash (non-volatile) |
| 실장 유형 | Surface Mount |
| 패키지 | 484-BGA (FBGA-484), 23 x 23 mm, 1 mm pitch, 2.23 mm height |
| RoHS 상태 | RoHS Compliant (FGG lead-free variant) |
| Supplier Device Package | 484-FBGA |
| Programming Support | Microchip Libero SoC design suite |
A3PE3000-FGG484 484-fbga 핀 구성 가이드
A3PE3000-FGG484(484-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000-FGG484.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000-FGG484 적합 용도: 6 애플리케이션s: Industrial Automation Control, Communications and Networking Line Cards, Medical Instrumentation, Secure Military and Aerospace Systems, Test and Measurement Equipment, Display and Video Interface Bridging.
Industrial Automation Control
The A3PE3000-FGG484 fits industrial automation controllers that need wide parallel I/O and deterministic real-time logic. Its 341 user I/Os support sensor and actuator buses without external fanout logic, while the 231 MHz fabric handles real-time PWM, motion profiles, and safety interlock functions. The flash-based non-volatile configuration means the controller starts instantly at power-up with no boot PROM and no configuration download delay - valuable on factory equipment that cycles power frequently. Place the FPGA between a host processor and field I/O, using its 516096 RAM bits as FIFO buffering. Unlike SRAM FPGAs, the single-chip configuration removes an external flash failure point, improving mean time between failures in harsh environments.
추천
Communications and Networking Line Cards
In networking line cards, the A3PE3000-FGG484 provides glueless interconnection between MACs, framers, and backplane interfaces. The 341 I/O count supports wide parallel buses such as POS-PHY and UTOPIA-class interfaces, and the embedded 516096 RAM bits implement packet FIFOs and descriptor rings. Its 231 MHz performance accommodates line-rate byte processing at OC-3/OC-12 class speeds, and PLL support eases clock domain management. Because ProASIC3E configures instantly from flash, line cards enumerate within milliseconds of power application, simplifying hot-swap power sequencing compared with SRAM FPGAs that need an external configuration device. Verify bank I/O voltage rails against the peer-device signaling standard before layout.
추천
Medical Instrumentation
Medical diagnostic equipment benefits from the A3PE3000-FGG484's combination of configuration security and instant-on behavior. The flash fabric cannot be read back through standard JTAG facilities in the same way SRAM bitstreams can, aiding design protection in commercial instrumentation. Its 75264 logic cells implement acquisition sequencing, filter pipelines, and interface logic between ADCs and a host CPU, while 341 I/Os connect front-end modules across a 23 x 23 mm footprint that suits compact benchtop enclosures. The 1.5 V core at 130 nm keeps static power moderate for fanless designs. Designers should implement power-good supervision and follow Microchip's power-up guidelines for multi-rail sequencing.
추천
Secure Military and Aerospace Systems
Flash FPGAs are a preferred choice in defense electronics because the configuration is inherently non-volatile and resistant to readback, removing the configuration-stream interception risk of SRAM FPGAs. The A3PE3000-FGG484 supplies 3M gates and 341 I/Os for sensor interface, bus bridging (MIL-STD-class parallel buses implemented in fabric), and custom protocol engines. Instant-on operation suits platforms with strict time-to-first-fix or time-to-ready requirements, and the single-chip solution reduces board count, mass, and solder-joint failure points. Use Microchip's security-focused application guidance with the ProASIC3E fabric user guide; the industrial temperature FGG484I variant is typically specified where extended temperature ranges are required.
추천
Test and Measurement Equipment
Bench instruments and rack modules use the A3PE3000-FGG484 as a real-time trigger, timing, and acquisition engine. Its 231 MHz fabric supports fine-grained timestamp counters, and the 516096 embedded RAM bits buffer measurement records before host transfer. The 341 I/Os interface to channel front ends, relay matrices, and multiple communication ports simultaneously. Because configuration is flash-resident, the instrument is ready essentially at power-up - a user-visible advantage over SRAM FPGA designs that show a boot delay. Use the exposed JTAG port for in-field feature updates via Microchip Libero SoC and FlashPro programmers, keeping instrument firmware upgradeable without device removal.
추천
Display and Video Interface Bridging
Video and display systems use the A3PE3000-FGG484 as a protocol bridge between panels, camera sensors, and host processors. Wide parallel pixel buses fit comfortably within the 341-I/O budget, and the fabric implements scan conversion, sync generation, and color-space lookup at up to 231 MHz. The 516096 RAM bits hold line buffers for frame-rate conversion, a common requirement between sensor timing and panel timing domains. Flash configuration gives instant video at power-on, avoiding the blank-screen interval typical of SRAM-FPGA designs. Designers must confirm I/O bank voltage compatibility with the chosen LVCMOS/LVTTL signaling levels per the ProASIC3E datasheet, and budget trace length matching on pixel clocks for signal integrity.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE3000-FGG484 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000-FGG484I | A3PE3000-FG484 | A3PE3000L-FGG484M | A3PE3000L-1FGG484 |
|---|---|---|---|---|---|
| Package | 484-BGA (FBGA-484), 23 x 23 mm | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family | ProASIC3E | ProASIC3E | ProASIC3E | ProASIC3EL (low power) | ProASIC3EL (low power) |
| System Gates / Cells | 3M gates / 75264 cells | 3M gates / 75264 cells | 3M gates / 75264 cells | 3M gates / 75264 cells | 3M gates / 75264 cells |
| User I/O | 341 | 341 | 341 | 341 | 341 |
| RoHS / Lead-Free | Yes (FGG lead-free) | Yes | No (leaded finish) | Varies by suffix (per Xecor, differs from standard part) | Yes |
주요 차별점
- Standard ProASIC3E family with full performance characterization (vs A3PE3000L-FGG484M)
- RoHS lead-free ball finish (vs A3PE3000-FG484)
- Highest density of the ProASIC3E family in a compact 23 x 23 mm body (vs A3PE600-2FGG484I)
설계 노트
ProASIC3E devices use a 1.5 V core plus I/O bank rails. Estimated power: at typical utilization of 60% with 341 I/Os toggling at moderate rates, core current commonly runs in the hundreds of milliamps - use Microchip's SmartPower power estimator in Libero SoC with your actual netlist rather than rules of thumb. Provide dedicated 1.5 V regulator with local bulk (47-100 uF) plus per-ball-pair 0.1 uF decoupling. Follow Microchip's power-up sequencing guidance so all rails settle monotonically; flash configuration removes configuration-device sequencing but core/I/O ramp order still matters.
The FBGA-484 uses a 1 mm ball pitch on a 23 x 23 mm body. Plan for a 6-8 layer PCB with via-in-pad or dog-bone escape routing; 0.5 mm hole pitch fanout is standard for 1 mm BGA. Keep the ball-out mapping aligned to the Microchip symbol available from SnapMagic (A3PE3000-FG484 symbol/footprint) to avoid pin-swap rework. Reserve 0.1 uF decoupling on a grid beneath the package and tie the thermal pattern of ground balls to a solid return plane for signal integrity.
Three frequent substitution mistakes: (1) Confusing FG484 (leaded, non-RoHS) with FGG484 (lead-free) - they are not interchangeable for RoHS assembly. (2) Assuming ProASIC3EL 'L' parts are identical silicon - they are a separate low-power family; re-run timing closure in Libero SoC after substitution. (3) Neglecting speed-grade suffixes in the full MPN ordering code - confirm the complete ordering string (speed and temperature codes) before PO release, as Xecor comparison data shows RoHS codes can differ even within visually similar suffixes.
규정 준수 정보
FGG suffix indicates lead-free/RoHS-compliant ball finish; Xecor data confirms Rohs Code Yes and GREEN package description (23 x 23 mm, 2.23 mm height, 1 mm pitch). REACH, halogen-free, and conflict minerals status not stated in provided data.
