A3PE3000L-1PQG208 - ProASIC3L FPGA 147 I/O | Microchip
MPN: A3PE3000L-1PQG208 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $210.5 | $210.50 |
| 10 | $195.3 | $1,953.00 |
| 100 | $182.75 | $18,275.00 |
| 500 | $171.4 | $85,700.00 |
| 1,000 | $162.9 | $162,900.00 |
Drop-in alternatives for A3PE3000L-1PQG208 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3PE3000L-1PQG208I
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000L-1PQG208Y
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000L-1PQG208 Maximum Ratings & Electrical Characteristics
| Manufacturer Part Number | A3PE3000L-1PQG208 |
| Family | ProASIC3L (ProASIC3E family, low power) |
| System Gates | 3000000 |
| Logic Elements | 35K LEs |
| Number of I/O | 147 |
| Core Voltage | 1.2 V to 1.5 V |
| Operating Supply Voltage | 1.5 V |
| Process Technology | 130 nm flash |
| Maximum Operating Frequency | 892.86 MHz |
| Configuration Memory | Flash (single-chip, reprogrammable) |
| Low Power Feature | Flash*Freeze technology (40% dynamic / 50% static power reduction) |
| Package | 208-BFQFP (PQFP-208) |
| Mounting Style | SMD/SMT |
| Operating Temperature Range | 0C to +70C |
| Packaging | Tray |
| Lead Free | Yes (G suffix) |
A3PE3000L-1PQG208 208-bfqfp (pqfp-208) Pin Configuration Guide
Complete pinout information for A3PE3000L-1PQG208 (208-bfqfp (pqfp-208) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-1PQG208.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-1PQG208 is suitable for 6 applications: Battery-Powered Portable Instrumentation, Industrial Control and Automation, Aerospace and Defense Data Acquisition, Secure Embedded Systems, Glue Logic and Bus Bridging Consolidation, Low-Power IoT Edge Nodes.
Battery-Powered Portable Instrumentation
The A3PE3000L-1PQG208 fits portable instrumentation because its ProASIC3L fabric cuts dynamic power by 40% and static power by 50% versus equivalent ProASIC3 devices, and Flash*Freeze mode lets the system hold I/O and logic state at microamp-scale standby current. With a 1.2 V to 1.5 V core and I/O banks operating as low as 1.2 V, it pairs naturally with single-cell lithium and low-voltage rail architectures, eliminating level shifters. In a typical handheld data logger the FPGA fronts ADCs and sensor interfaces, runs glue logic and timing, and enters Flash*Freeze between acquisition windows; because configuration is flash-based and single-chip, wake-up is instant with no bitstream reload from external memory, saving both power and PCB area.
Recommended
Industrial Control and Automation
In industrial control, the A3PE3000L-1PQG208 consolidates PLC I/O expansion, encoder interfacing, and deterministic state machines into one 3M-gate flash fabric with 147 user I/O, reducing BOM count versus discrete glue logic. The instant-on, single-chip flash configuration matters in factory environments subject to brownouts: the FPGA is functional within microseconds of power restoration without reloading a configuration device. The 130 nm fabric's 892.86 MHz family speed listing gives ample timing margin for multi-channel PWM and quadrature decoding, while the 0C to +70C commercial grade suits cabinet-mounted controllers; for field-exposed hardware the pin-identical -I industrial grade should be specified. Its security advantage - no external bitstream to intercept - protects proprietary control algorithms from cloning on the production floor.
Recommended
Aerospace and Defense Data Acquisition
Defense and aerospace data-acquisition modules value the A3PE3000L-1PQG208 for its combination of flash-based security, instant-on behavior, and the low static power that matters in conduction-cooled, fanless enclosures. The 3M-gate fabric with 147 I/O implements sensor front-end formatting, trigger logic, and telemetry framing, while the single-chip flash configuration removes the external bitstream store that would otherwise be a vulnerability and a reliability liability under vibration. Flash*Freeze lets acquisition pods hold context between mission phases at minimal quiescent draw. The 208-pin PQFP offers gull-wing leads with better board-level inspection and rework characteristics than area-array BGAs, which suits high-reliability assembly flows; specify the -I grade (-40C to +100C) for extended-environment platforms.
Recommended
Secure Embedded Systems
The A3PE3000L-1PQG208 is well suited to secure embedded designs because its configuration bitstream resides in on-chip flash, eliminating the external boot device whose bus traffic can be probed to clone the design - a well-known attack surface of SRAM FPGAs. Designers use the 3M-gate fabric to implement encryption engines, authentication logic, and anti-tamper state machines alongside application logic, with 147 I/O bridging secure processors to external interfaces. Instant-on flash startup means security-critical supervision logic is active before the main processor completes boot, closing power-race windows. Flash*Freeze preserves security context through low-power states without reconfiguration. The 130 nm flash process and reprogrammability support in-field key and feature updates through authenticated update flows.
Recommended
Glue Logic and Bus Bridging Consolidation
For ASIC prototyping, legacy bus interfaces, and mixed-voltage system glue logic, the A3PE3000L-1PQG208 replaces dozens of 74-series devices, PALs, and FIFOs with one reprogrammable 3M-gate device. The 147 user I/O and I/O banks operating at 1.2 V to 1.5 V core with flexible I/O standards let it bridge legacy 5 V-tolerant style peripherals (with proper level shifting) and modern low-voltage buses on one chip. Because the flash fabric is reprogrammable in-system, interface bugs found during system integration are fixed with a bitstream update rather than a PCB spin, directly lowering total cost of ownership - a headline Microchip benefit for the ProASIC3 family. The 892.86 MHz family speed listing provides generous timing headroom for wide parallel buses.
Recommended
Low-Power IoT Edge Nodes
IoT edge nodes that must sense continuously yet sleep aggressively use the A3PE3000L-1PQG208 as the always-on sensor hub: its Flash*Freeze technology maintains I/O and logic state at drastically reduced power (40% lower dynamic, 50% lower static than standard ProASIC3), while the 1.2 V-capable I/O connects directly to modern sensor rails. The 35K logic elements implement threshold detection, protocol formatting, and cryptographic pre-processing before waking a host microcontroller, minimizing wake cycles that dominate node energy budgets. Flash configuration gives instant-on after battery insertion or solar power return with no boot delay. The 208-PQFP suits moderate-volume prototyping and rework-friendly assembly, though BGA package variants of the same die offer smaller footprints for production Miniaturization.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-1PQG208 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-1PQG208I | A3PE3000L-1PQG208Y |
|---|---|---|---|
| Package | 208-BFQFP (PQFP-208) | 208-BFQFP (PQFP-208) - same | 208-BFQFP (PQFP-208) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 |
| Number of I/O | 147 | 147 | 147 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Temperature Range | 0C to +70C | -40C to +100C (industrial) | 0C to +70C (commercial) |
| Flash*Freeze Low Power Mode | Yes (40% dynamic / 50% static reduction) | Yes | Yes |
| Drop-in Compatibility | - | 100% pin-to-pin, bitstream portable | 100% pin-to-pin, bitstream portable |
Key Differentiators
- Extended industrial temperature rating in identical footprint (vs A3PE3000L-1PQG208I)
- Flash*Freeze power reduction vs standard ProASIC3 (vs A3PE3000 (non-L))
- Single-chip secure flash configuration (vs SRAM FPGAs (e.g., Lattice XP2 in other packages))
Design Notes
The A3PE3000L-1PQG208 requires a 1.2 V to 1.5 V core supply; running the core at 1.5 V maximizes speed but raises static power, while 1.2 V minimizes power for cost-sensitive designs. Per the ProASIC3L datasheet (DS50003268), Flash*Freeze mode cuts static power by 50% versus standard ProASIC3 - architect your firmware to enter Flash*Freeze aggressively between active windows. Estimated: at 1.5 V core on a 3M-gate flash fabric, core current in active mode is on the order of tens of milliamps; verify against the datasheet power estimator (SmartPower) for your specific utilization before sizing the 1.5 V regulator.
The 208-pin PQFP has 0.5 mm pitch gull-wing leads. Keep input decoupling capacitors (at least one 0.1 uF per supply pin group plus bulk 10 uF) within 5 mm of the corresponding VCC/GND pin pairs to counter the higher lead inductance of PQFP versus BGA. Route the four JTAG pins (TDI, TDO, TMS, TCK) to a standard header for FlashPro programming and boundary-scan test. Because PQFP-208 is a fine-pitch QFP, specify an inspection-capable assembly process (AOI) and follow the datasheet land-pattern recommendation exactly.
Do not confuse the commercial A3PE3000L-1PQG208 (0C to +70C) with the -I industrial variant when building extended-temperature hardware - they are pin-identical but thermally graded, and substituting the commercial part in a -40C system risks out-of-spec timing. Also note the part is programmed only with Microchip Libero SoC and FlashPro tools; no third-party vendor supports ProASIC3L fabric. Finally, monitor Microchip PCNs: a product change notification (CAAN-02OLLE763) affecting legacy FPGA assembly sites has been issued, so re-verify date codes when qualifying second sources.
Compliance Information
G suffix denotes Microchip lead-free (Pb-free) option; related Mouser listings for A3PE3000 PQ208 identify lead-free parts. RoHS/REACH certificate should be confirmed from Microchip product page or CoC.
