A3PE3000L-1FGG324 - 3M-Gate Low-Power Flash FPGA | Microchip
부품 번호: A3PE3000L-1FGG324 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $63.1 | $631.00 |
| 100 | $57.8 | $5,780.00 |
| 500 | $52.4 | $26,200.00 |
| 1,000 | $47.95 | $47,950.00 |
A3PE3000L-1FGG324 개요
A field-programmable gate array (FPGA) is a reprogrammable semiconductor device that implements user-defined digital logic through a configurable fabric of logic elements, routing resources, and I/O cells. The ProASIC3L family belongs to the nonvolatile flash FPGA class within the broader power-management and programmable-logic hierarchy: flash FPGA -> FPGA -> programmable logic IC -> digital integrated circuit. Unlike SRAM-based FPGAs, its flash cells are nonvolatile, so the device powers up instantly without an external configuration PROM.
Key features include the ProASIC3L low-power fabric with Flash*Freeze technology for dramatic dynamic power reduction, a 1.2 V to 1.5 V core voltage range, single-chip secure operation, and reprogrammability without boot-time configuration delay. The device targets total-cost-of-ownership-sensitive designs by removing the need for configuration flash and external power-cycling circuitry.
Architecturally, the A3PE3000L uses a 130 nm CMOS flash process with 75264 logic cells organized in VersaTile clusters, allowing each tile to act as a logic function, registered logic, or small memory. The fabric supports high performance while the L-variant leverages low-power process and core operation for portable and power-constrained systems.
Typical applications include industrial automation control, portable and battery-powered instrumentation, secure military and aerospace subsystems, and communications line-card glue logic, where nonvolatile instant-on configuration and low standby power are essential.
Design consideration: the 324-ball FBGA requires careful PCB layout with appropriate via-in-pad or dog-bone fanout, and core voltage selection (1.2 V vs 1.5 V) must match speed-grade requirements.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3PE3000L-1FGG324 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000L-1FGG324 (동일 폼 팩터 및 풋프린트) — 차이점: Family, Package, Operating Temperature, Configuration Memory, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000L-1FGG324I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-FGG324
✅ 드롭인✓ 재고 있음
$86.15 / 개
데이터시트 보기 →A3PE3000L-FGG324I
✅ 드롭인✓ 재고 있음
$62.65 / 개
데이터시트 보기 →A3PE3000L-1FG324I
✅ 드롭인✓ 재고 있음
$135 / 개
데이터시트 보기 →A3PE3000-2FGG324
✅ 드롭인✓ 재고 있음
$216 / 개
데이터시트 보기 →A3PE3000-FGG324I
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →A3PE3000L-1FGG324 최대 정격 & 전기적 특성
| Family | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 |
| Logic Elements | 35K LEs |
| Logic Cells (CLBs) | 75264 |
| User I/O | 221 |
| Core Voltage | 1.2 V to 1.5 V |
| Process Technology | 130 nm CMOS flash |
| Technology | Nonvolatile Flash (Instant On) |
| 패키지 | 324-ball FBGA (FGG324) |
| 실장 유형 | Surface Mount |
| Speed Grade | -1 |
| Special Features | Flash*Freeze low-power technology |
| Reprogrammability | Yes (in-system reprogrammable flash) |
| Configuration | Single-chip, no external configuration device required |
| Lead Free Status | Lead Free |
| RoHS 상태 | RoHS Compliant |
A3PE3000L-1FGG324 324-ball fbga (fgg324) 핀 구성 가이드
A3PE3000L-1FGG324(324-ball fbga (fgg324) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000L-1FGG324.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000L-1FGG324 적합 용도: 6 애플리케이션s: Industrial Automation Control, Portable and Battery-Powered Instruments, Secure Military and Aerospace Subsystems, Communications Line Cards and Networking, Medical and Diagnostic Equipment, Test and Measurement Instrumentation.
Industrial Automation Control
In PLC I/O modules, motor-control interfaces, and factory-floor sensing nodes, the A3PE3000L-1FGG324 provides 3 million gates of glue logic, interface bridging, and sequencing with 221 user I/Os to absorb multiple legacy ASSP functions. Its nonvolatile flash fabric is Instant On, so a line restart after power loss requires no configuration download - critical for equipment uptime. With a 1.2 V core and Flash*Freeze technology, idle cabinets cut dynamic power dramatically between production cycles. Placed between backplane connectors and local controllers, the FPGA terminates parallel buses and translates to modern serial links; the trade-off versus a microcontroller is higher flexibility at the cost of RTL design effort.
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Portable and Battery-Powered Instruments
Handheld test instruments, data loggers, and field meters benefit from the A3PE3000L-1FGG324's low-power ProASIC3L fabric: the 1.2 V core minimizes static consumption, and Flash*Freeze mode retains register and SRAM state while the device sleeps, enabling near-instant wake-up between measurement bursts. The 221 user I/Os drive LCD segments, keypads, and sensor interfaces without an external CPLD. Because the flash configuration is on-chip, no boot current is spent loading a bitstream, extending battery budget compared with SRAM FPGAs. Designers should budget I/O banking so active interfaces share banks powered during Flash*Freeze-adjacent operation, and verify wake-up timing against the Microchip datasheet AC tables.
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Secure Military and Aerospace Subsystems
ProASIC3L flash FPGAs are widely deployed in defense electronics because the single-chip, nonvolatile configuration eliminates the bitstream theft risk of external configuration PROMs, and the 130 nm flash process supports Microchip's security features for design protection. The A3PE3000L-1FGG324's 3M gates implement protocol engines, bus interfaces (MIL-STD-style parallel buses, UART/SPI bridges), and system controllers in one device, while the industrial-temperature A3PE3000L-1FGG324I variant covers extended environments. Instant-On behavior suits turret controllers and avionics LRUs that must be ready at power application. Designers should use Libero SoC security tooling and follow Microchip's defense application notes for reliable design flow.
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Communications Line Cards and Networking
In telecom and enterprise-network line cards, the A3PE3000L-1FGG324 handles backplane glue logic, LED/PHY supervision, hot-swap sequencing, and low-speed protocol conversion. The 3M-gate fabric absorbs CAM-control interfaces, I2C/SPI masters, and board-management state machines, while 221 I/Os connect to connectors, transceivers, and status planes. Flash*Freeze lets standby line cards drop dynamic power while retaining link state, easing chassis thermal budgets; the 1.2 V core reduces switching losses versus 1.5 V operation. Because the fabric is nonvolatile, a rebooted card resumes operation instantly without a configuration controller. Timing closure at speed grade -1 is straightforward for these sub-100 MHz state-machine workloads.
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Medical and Diagnostic Equipment
Portable diagnostics, patient monitors, and bench-top analyzers use the A3PE3000L-1FGG324 to interface sensor front ends, drive displays, and sequence measurement engines. The low-power fabric supports battery and cart-based operation, while the single-chip flash configuration avoids external memory that would otherwise add a failure point in regulated medical devices. Flash*Freeze keeps patient data latched between sampling windows, and Instant-On start-up shortens the time from power switch to ready screen - a user-experience and emergency-response benefit. The 3M-gate capacity implements DSP-lite preprocessing (filters, thresholds) ahead of the host processor. Verify I/O ESD and isolation requirements against IEC-60601 system-level goals during design.
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Test and Measurement Instrumentation
Bench instruments, automated test equipment (ATE), and protocol analyzers rely on the A3PE3000L-1FGG324 for timing generators, trigger matrices, and bus emulation across its 221 I/Os. The 3M-gate VersaTile fabric implements deep counters, pattern generators, and per-channel delay lines with deterministic, Instant-On startup - useful for calibration routines that run before an OS boots. Flash*Freeze maintains instrument state during idle periods on portable analyzers, and the 1.2 V core keeps shelf-mode current low. Compared with an MCU + CPLD stack, the single FPGA reduces BOM spread and yields deterministic timing skew. Route high-fanout clocks with balanced trees and verify setup/hold with Libero timing reports.
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추천 제품 요약
엔지니어링 참조 데이터: A3PE3000L-1FGG324 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000L-1FGG324I | A3PE3000L-FGG324 | A3PE3000L-1FG324I | A3PE3000-2FGG324 |
|---|---|---|---|---|---|
| Package | 324-ball FBGA (FGG324) | 324-ball FBGA (FGG324) - same | 324-ball FBGA (FGG324) - same | 324-ball FBGA (FG324) - same footprint, lead-finish variant | 324-ball FBGA (FGG324) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family | ProASIC3L (low power) | ProASIC3L | ProASIC3L | ProASIC3L | ProASIC3E (performance) |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 221 | 221 | 221 | 221 | 221 |
| Speed Grade | -1 | -1 | standard (faster) | -1 | -2 (faster) |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | Yes | No |
| Temperature Grade | Commercial | Industrial | Commercial | Industrial | Commercial |
| RoHS / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free |
주요 차별점
- Flash*Freeze ultra-low-power mode with state retention (vs A3PE3000-2FGG324)
- Lowest dynamic power via -1 speed grade at 1.2 V core (vs A3PE3000L-FGG324)
- Extended-temperature availability in identical footprint (vs A3PE3000L-1FGG324I)
설계 노트
The 324-ball FBGA (1.0 mm ball pitch class) demands a disciplined fanout strategy: use via-in-pad for power/ground balls or dog-bone escapes on perimeter signal balls, and define a 4+ layer stackup with dedicated core/GND planes. Escape routing density limits outer two rows to conventional traces; inner rows must escape through vias. Follow the Microchip ProASIC3L datasheet (DS50003268) package section and Microchip FPGA PCB layout application notes for ball map, keepouts, and land-pattern dimensions before finalizing the footprint.
Power the A3PE3000L core at 1.2 V for lowest dynamic power or up to 1.5 V for higher performance; the -1 speed grade typically permits 1.2 V core operation, but confirm the DC characteristics table in the datasheet for your grade. Provide separate regulated rails for core, I/O banks (VCCI), and the programming/Flash*Freeze supplies (VPT), with 10 uF bulk plus 0.1 uF high-frequency decoupling per bank. Sequencing requirements for multi-rail flash FPGAs are relaxed versus SRAM FPGAs, but verify the datasheet power-up specification to avoid configuration errors.
Do not confuse the FG vs FGG suffix: FGG324 uses a lead-free ball finish required for RoHS lines, while FG324 shares the same footprint but different ball metallurgy - verify solder-profile compatibility with your lead-free reflow profile. Also, instantiating Flash*Freeze requires the FLASH_FREEZE pin to be connected and the feature enabled in Libero SoC; leaving it unconnected forfeits the flagship low-power benefit. Finally, designs written for ProASIC3E (A3PE3000) must be re-verified before targeting the L variant.
규정 준수 정보
RoHS compliant and lead free per distributor listings (DigChip, Mouser, DigiKey). REACH, halogen-free, and conflict-minerals status not stated in provided data - request manufacturer declarations.
