A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
부품 번호: A3PE3000L-FGG324I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.35 | $823.50 |
| 100 | $74.9 | $7,490.00 |
| 500 | $68.2 | $34,100.00 |
| 1,000 | $62.65 | $62,650.00 |
A3PE3000L-FGG324I 개요
A flash FPGA is a field-programmable gate array that stores its configuration in on-chip nonvolatile flash memory rather than an external configuration PROM. Within the power-management hierarchy of programmable logic, ProASIC3L sits in the low-power segment: unlike SRAM FPGAs it is Instant On, single-chip, and secure, because no bitstream is loaded at power-up.
Key features include the 130nm CMOS flash process, a 1.2 V to 1.5 V core voltage option, Flash*Freeze technology that dramatically cuts dynamic and static power, and reprogrammability without an external boot device. These attributes reduce total cost of ownership and board complexity.
Architecturally, the device integrates flash-based logic elements plus embedded SRAM blocks totaling 516 kbit, supporting pipelined datapaths, FIFOs, and small soft-core processor systems. Performance is sufficient for glue logic consolidation, interface bridging, and control-plane designs at moderate clock rates.
Typical applications include industrial automation controllers, portable and battery-powered instruments, communications line cards, and medical monitoring equipment where low standby power is decisive.
Design consideration: exploit Flash*Freeze mode to hold state while cutting power during idle periods; plan I/O banking and 1.2 V core rail sequencing early in layout.
This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing tiers, drop-in same-package alternatives, and practical design notes in one place.
드롭인 대체품: A3PE3000L-FGG324I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000L-FGG324I (동일 폼 팩터 및 풋프린트) — 차이점: Family, Package, Operating Temperature, Process Technology, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000L-FGG324
✅ 드롭인✓ 재고 있음
$86.15 / 개
데이터시트 보기 →A3PE3000L-FG324I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-1FGG324I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000-FGG324I
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →A3PE3000-2FGG324
✅ 드롭인✓ 재고 있음
$216 / 개
데이터시트 보기 →A3PE1500-2FGG324I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3PE3000L-FGG324I 최대 정격 & 전기적 특성
| Family | ProASIC3L (Flash FPGA) |
| System Gates | 3,000,000 |
| Total RAM Bits | 516096 |
| User I/O | 221 |
| Core Voltage | 1.2 V to 1.5 V |
| Process Technology | 130 nm CMOS |
| 패키지 | 324-BGA FBGA (19x19 mm) |
| 실장 유형 | Surface Mount (SMD) |
| 동작 온도 | -40C to +100C (industrial) |
| Technology Features | Nonvolatile Flash, Instant On, Flash*Freeze |
| Configuration | Single-chip, no external boot PROM |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| RoHS 상태 | RoHS Compliant |
| Number of Package Balls | 324 |
A3PE3000L-FGG324I 324 핀 구성 가이드
A3PE3000L-FGG324I(324 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000L-FGG324I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000L-FGG324I 적합 용도: 6 애플리케이션s: Industrial Automation and Control, Battery-Powered Portable Instruments, Communications Line Cards and Bridging, Medical Monitoring Equipment, Security and Surveillance Systems, Aerospace and Rugged Telemetry.
Industrial Automation and Control
The A3PE3000L-FGG324I fits industrial controller and I/O consolidation designs because its 3 million gates absorb glue logic, encoders, and protocol bridges that would otherwise need several ASSPs, while 221 user I/Os connect sensors, actuators, and field buses on one chip. The nonvolatile flash fabric is Instant On, so the FPGA is functional within milliseconds of the 24 V industrial rail rising, and its configuration cannot be corrupted by brown-outs. In typical use, the device bridges RS-485, SPI, and parallel peripherals under a small soft-core controller, with the 516,096 RAM bits buffering FIFO traffic. The industrial -40C to +100C rating matches cabinet-mounted electronics, and the 324-FBGA (19x19 mm) fits standard module form factors.
추천
Battery-Powered Portable Instruments
Portable and battery-powered instruments benefit directly from the Flash*Freeze technology of the A3PE3000L-FGG324I: the FPGA can retain its entire state while cutting dynamic and static power during idle periods, a mode that SRAM FPGAs cannot match without losing configuration. The 1.2 V to 1.5 V core rail allows the lowest-power operating point, and the single-chip nonvolatile design removes the external configuration PROM and its standby current entirely. The 324-FBGA (19x19 mm) footprint suits handheld enclosures, while the 221 user I/Os drive displays, touch keys, and sensor front-ends. The 3M gate capacity handles DSP-style filtering between the battery-backed microcontroller and the analog front end, extending battery life measurably in duty-cycled measurement nodes.
추천
Communications Line Cards and Bridging
In telecom and datacom line cards, the A3PE3000L-FGG324I serves as an interface bridge that converts between backplane protocols and PHY devices. Its 221 user I/Os support multiple LVCMOS and selected I/O standards across several banks, letting one device terminate parallel PHY ports, status buses, and management interfaces simultaneously. The 516,096 RAM bits implement elastic buffers and FIFOs that de-skew asynchronous clock domains, a core requirement in line-card designs. The nonvolatile Instant-On fabric brings the card ready before host polling, reducing boot enumeration time, and Flash*Freeze drops the idle-line power between traffic bursts. The industrial temperature rating covers outside-plant and uncooled remotes, and the 19x19 mm package density simplifies high-layer-count PCB real estate planning.
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Medical Monitoring Equipment
Medical monitoring devices such as bedside vitals monitors and portable diagnostic units use the A3PE3000L-FGG324I to unify sensor interfacing, filtering, and display logic on one low-power chip. The flash fabric is Instant On and single-chip, supporting the fast power-up that clinical workflows demand, and its inherent configuration security keeps the firmware image off external buses. With 3 million gates, the device implements multi-channel IIR/FIR filtering for ECG/SpO2 front ends, while 516,096 RAM bits buffer waveform samples for burst transfer to the host. Flash*Freeze trims consumption between sampling windows, valuable in battery-backup scenarios. The -40C to +100C industrial rating exceeds typical medical ambient requirements with margin, and the RoHS-compliant, lead-free 324-FBGA meets equipment environmental directives.
추천
Security and Surveillance Systems
Security and surveillance infrastructure, including IP camera sensor bridging and access-control panels, uses the A3PE3000L-FGG324I as a deterministic logic hub. Its 221 user I/Os interface image sensors, IR receivers, relay drivers, and Ethernet PHY sidebands, consolidating functions that would otherwise occupy a CPLD plus glue logic. The nonvolatile flash configuration removes the boot-time vulnerability window of SRAM FPGAs, which matters in tamper-sensitive installations, and the fabric operates immediately on power restore after outages. The 3M gate capacity supports video pre-processing pipelines such as motion detection windows and OSD overlay logic, with the 516,096-bit SRAM handling line buffers. Flash*Freeze keeps idle cameras within energy budgets mandated for always-on sites, and the industrial temperature range covers outdoor enclosures.
추천
Aerospace and Rugged Telemetry
The ProASIC3L architecture originates from Microsemi's aerospace-focused line (including Military ProASIC3/EL variants with Flash*Freeze), making the A3PE3000L-FGG324I appropriate for rugged telemetry, UAV payload control, and avionics support logic. Nonvolatile flash is inherently more resistant to configuration upset at power transitions than SRAM fabric, and the Instant-On property lets payload logic be ready the moment power is applied during short flight windows. The 221 user I/Os connect telemetry encoders, sensor buses, and redundant discrete lines, while the 3M gates implement encoding/decoding pipelines. The -40C to +100C industrial grade suits uncooled payload bays, and the lead-free, RoHS-compliant 324-FBGA withstands vibration-typical BGA mounting with standard underfill practices on flight boards.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE3000L-FGG324I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000L-FGG324 | A3PE3000L-FG324I | A3PE3000-FGG324I | A3PE3000-2FGG324 | A3PE1500-2FGG324I |
|---|---|---|---|---|---|---|
| Package | 324-BGA FBGA (19x19 mm) | 324-BGA FBGA - same | 324-BGA FBGA - same | 324-BGA FBGA - same | 324-BGA FBGA - same | 324-BGA FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 1,500,000 |
| User I/O | 221 | 221 | 221 | 221 | 221 | 221 |
| Flash*Freeze Low-Power Mode | Yes (ProASIC3L) | Yes | Yes | No (ProASIC3E) | No (ProASIC3E) | No (ProASIC3E) |
| Operating Temperature | -40C to +100C | Commercial grade (higher, no I suffix) | -40C to +100C | -40C to +100C | Commercial grade | -40C to +100C |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
주요 차별점
- Flash*Freeze technology for idle power reduction (vs A3PE3000-FGG324I)
- Industrial temperature screening (vs A3PE3000L-FGG324)
- Double the logic capacity of the lower-density socket-mate (vs A3PE1500-2FGG324I)
설계 노트
Plan dual core-voltage operation early: the ProASIC3L core supports 1.2 V (lowest power) to 1.5 V (highest performance). Estimated: dropping the core from 1.5 V to 1.2 V reduces core dynamic power roughly proportionally to V^2, i.e. a 1.2^2/1.5^2 = 64% ratio, about 36% savings for identical switching activity - verify with the Libero power calculator for your netlist. Flash*Freeze entry should be exercised in firmware with defined wake latency testing, since state is retained but I/O behavior changes while frozen.
The 324-FBGA (19x19 mm, 1.0 mm-class ball pitch) requires controlled-impedance PCB design with via-in-pad or dogbone fanout on all 324 balls. Dedicate solid power planes for the 1.2/1.5 V core and I/O rails, and place bulk plus 0.1 uF decoupling capacitors under the package footprint. Ball-map assignment must come from the DS50003268 datasheet chapter - do not copy from other ProASIC3 packages, because the FGG324 I/O bank assignment is package-specific.
Do not confuse ordering codes: FGG324 (lead-free, RoHS) vs FG324 differ in ball/lead finish and compliance documentation, and the I suffix is what guarantees -40C to +100C screening. Also verify fabric utilization before choosing the A3PE1500 cross-option - it is the same FGG324 footprint but 1.5M gates vs 3M, so designs near capacity will not fit. Finally, the ProASIC3E (non-L) parts in the same package lack Flash*Freeze; porting a power-sensitive design onto them changes the idle power budget.
규정 준수 정보
RoHS Compliant and Lead Free per distributor listings (digchip, FindIC). REACH, halogen-free, and conflict-minerals status not stated in retrieved data.
