A3PE600-2FGG484I - 600K-Gate ProASIC3E Flash FPGA | Microchip
부품 번호: A3PE600-2FGG484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
A3PE600-2FGG484I 개요
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory cells rather than SRAM. This places the A3PE600 within the FPGA hierarchy of programmable logic devices, sitting above CPLDs in gate count and below high-end SRAM FPGAs, and contrasts with SRAM FPGAs by needing no external configuration PROM: the single-chip solution boots instantly at power-up, which also reduces total bill-of-materials cost and improves system security.
Key features of the A3PE600-2FGG484I include non-volatile FlashX3 processing on a 130 nm CMOS process, single 1.5V core operation, system performance up to approximately 231 MHz, and optional soft ARM support per the ProASIC3E family datasheet. The ProASIC3E family adds embedded flash memory (up to 270 Kbit in this density class, 110592 bits cited by distributors) and supports low-cost ASIC replacement in single-chip designs with reprogrammability.
Architecturally, the device uses the Actel/Microchip ProASIC3E sea-of-von Neumann fabric with versatile logic elements, embedded SRAM blocks, and flash configuration cells. The -2 speed grade denotes the fastest commercial binning for this density, and the FG484 package provides 1.0 mm pitch balls for surface-mount assembly.
Typical applications include networking and communications line cards, avionics and industrial control logic integration, and consumer or computing systems seeking ASIC-like integration without NRE masks.
Design consideration: flash FPGAs cannot be reconfigured as frequently in-circuit as SRAM FPGAs, so plan design iterations through the Libero SoC toolchain and JTAG programming accordingly.
This page synthesizes distributor pricing context, same-brand drop-in package variants, and practical design notes not found in the manufacturer datasheet, with pricing references as of 2026-09-02.
드롭인 대체품: A3PE600-2FGG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE600-2FGG484I (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Memory, Operating Temperature, Family, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE600-2FGG484
✅ 드롭인✓ 재고 있음
$45.6 / 개
데이터시트 보기 →A3PE600-FGG484I
✅ 드롭인✓ 재고 있음
$44.03 / 개
데이터시트 보기 →A3PE600-FG484I
✅ 드롭인✓ 재고 있음
$86.1 / 개
데이터시트 보기 →A3PE600-FGG484
✅ 드롭인✓ 재고 있음
$53.7 / 개
데이터시트 보기 →A3PE600L-FGG484M
✅ 드롭인✓ 재고 있음
$79.9 / 개
데이터시트 보기 →A3PE600-2FGG484I 최대 정격 & 전기적 특성
| Family | ProASIC3E Flash FPGA |
| System Gates | 600000 |
| Logic Elements (CLBs) | 13824 |
| User I/Os (max, FG484) | 270 |
| Speed Grade | -2 |
| Core Supply Voltage | 1.5 V |
| Technology | 130 nm Flash CMOS |
| Max System Frequency | 231 MHz |
| Embedded Memory | Embedded flash family; 110592 (bits, per distributor listing) |
| Configuration Memory | On-chip flash (single-chip, non-volatile) |
| Soft CPU Support | Optional soft ARM support |
| 패키지 | FBGA-484 (PBGA484, 23 x 23 mm, 1.0 mm pitch, 2.23 mm height) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (Industrial) |
| Terminal Form | Ball |
| Number of Terminals | 484 |
| Packaging | Tray |
A3PE600-2FGG484I fbga-484 (pbga484, 23 x 23 mm, 1.0 mm pitch, 2.23 mm height) 핀 구성 가이드
A3PE600-2FGG484I(fbga-484 (pbga484, 23 x 23 mm, 1.0 mm pitch, 2.23 mm height) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE600-2FGG484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE600-2FGG484I 적합 용도: 6 애플리케이션s: Networking and Communications Line Cards, Avionics and Aerospace Control Systems, Industrial Automation and Motor Control Interfaces, ASIC Prototyping and Low-Volume ASIC Replacement, Medical Diagnostic and Monitoring Equipment, Test and Measurement Instrument Modules.
Networking and Communications Line Cards
The A3PE600-2FGG484I fits networking and communications equipment where glue logic, bus bridging, and control-plane functions must be integrated at low cost. According to the ProASIC3E family datasheet, this market is a primary target for the family. The 600K-gate capacity and 13,824 CLBs absorb PCI/local bus interfaces, status aggregation, and LED or fan control, while the 270 user I/Os in FBGA-484 cover wide parallel buses with banked I/O standards. The -2 speed grade supports system clocks in the region of 231 MHz, sufficient for backplane control paths. Because configuration is stored in on-chip flash, the line card powers up functional immediately with no host-side configuration controller, reducing BOM cost and improving uptime. Place the FPGA near the connector edge with short trace lengths for high-speed I/O banks and follow the datasheet bank voltage rules.
추천
Avionics and Aerospace Control Systems
Microchip explicitly targets the avionics market with the ProASIC3E family, and the A3PE600-2FGG484I's industrial -40C to +100C rating plus non-volatile flash fabric make it attractive for flight control interfaces, ARINC-style data path adapters, and sensor aggregation. The single-chip flash configuration means no external PROM whose contents could be corrupted by radiation or power glitches during flight, a historic reason Actel/Microchip flash FPGAs dominate avionics glue logic. The 600K-gate fabric implements protocol bridges and voting logic, while 270 user I/Os handle discrete and serial interfaces. Designers should constrain timing conservatively in Libero SoC for the -2 grade across temperature, verify I/O bank voltages against the datasheet, and follow Microchip's ProASIC3E power calculation methodology for thermal budgeting in conduction-cooled enclosures. Extended-temperature screening beyond the standard industrial range should be negotiated with Microchip.
추천
Industrial Automation and Motor Control Interfaces
In factory automation, the A3PE600-2FGG484I integrates encoder interfaces, PWM generators, safety interlock logic, and fieldbus glue logic into one industrial-rated device. The -40C to +100C range tolerates cabinet temperature swings near drives and motor controllers, and the flash fabric boots instantly at machine power-up with no configuration delay, so PLC I/O cards are ready within milliseconds. The 13,824 CLBs implement multi-channel quadrature decoding and current-loop threshold comparators, while the 270 user I/Os handle 24V-domain buffers through external level translators. Because ProASIC3E fabric is flash-based, field firmware updates are performed via JTAG with FlashPro hardware during scheduled maintenance. Designers should provide robust 1.5V core regulation with local 0.1uF and bulk 10uF+ decoupling per the datasheet, isolate I/O banks from noisy ground returns, and validate timing at the -2 speed grade across the full industrial temperature range.
추천
ASIC Prototyping and Low-Volume ASIC Replacement
The ProASIC3E family is positioned by Microchip as a cost-effective ASIC replacement, and the A3PE600-2FGG484I is the entry point of that value proposition: 600,000 gates with zero NRE, no mask charges, and immediate availability. Design teams use one or two of these FPGAs to prototype ASIC control logic, verify RTL on real hardware, and even ship low-volume products directly on the FPGA, since the single-chip flash solution presents no configuration PROM to distinguish it from a masked device in the end system. The -2 speed grade provides the fastest timing closure headroom for ported ASIC netlists, and the 270 user I/Os of FBGA-484 support wide ASIC-style buses. Plan the port by constraining I/O assignments to mirror the intended ASIC pin plan, close timing in Libero SoC at -2, and budget power with Microchip's flash FPGA power estimator; the 23 x 23 mm package fits typical ASIC footprint replacements.
추천
Medical Diagnostic and Monitoring Equipment
Medical diagnostic devices benefit from the A3PE600-2FGG484I's deterministic instant-on behavior and quiet, non-reconfiguring fabric. In benchtop analyzers, patient monitors, and imaging front ends, the FPGA implements sensor timing controllers, ADC framing and deserialization, and isolation-barrier interface logic; the 600K-gate capacity and 13824 CLBs handle these functions with margin, while the FBGA-484's 270 user I/Os support multiple isolated banks. Flash configuration eliminates configuration PROMs that would otherwise add BOM and single points of failure in devices requiring high reliability, and the design stays loaded through power cycling without host intervention. The industrial -40C to +100C range comfortably covers clinical ambient requirements with margin. Designers should follow the datasheet for banked I/O voltages when bridging isolated domains, use the -2 speed grade to close timing for high-rate sample paths, and apply careful PCB ground plane separation beneath the FPGA for analog-adjacent digital noise control.
추천
Test and Measurement Instrument Modules
Instrument-grade timing and trigger logic is a strong fit for the A3PE600-2FGG484I. In oscilloscope front-end modules, arbitrary waveform generator channels, and automated test fixtures, the FPGA provides trigger state machines, time-to-digital correlation, and per-channel calibration logic; the -2 speed grade supports system clock rates in the vicinity of 231 MHz for fine trigger granularity, and 270 user I/Os cover multi-channel probe interfaces on the 1.0 mm-pitch FBGA-484 ball map. Instant-on flash configuration means a measurement module is ready the moment rack power is applied, with no configuration latency that could miss early captures, and no external configuration PROM to fail in the field. Engineering teams should implement synchronous reset discipline, place clock inputs on dedicated GCLK-capable balls per the datasheet, decouple the 1.5V core with 0.1uF per ball cluster plus bulk capacitance, and verify setup/hold margins at -2 across temperature in Libero timing simulation.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE600-2FGG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE600-2FGG484 | A3PE600-FGG484I | A3PE600-FG484I | A3PE600L-FGG484M |
|---|---|---|---|---|---|
| Package | FBGA-484 (23 x 23 mm, 1.0 mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 (FG, leaded finish) | FBGA-484 - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 (low-power die) |
| CLBs | 13824 | 13824 | 13824 | 13824 | 13824 |
| User I/Os (max) | 270 | 270 | 270 | 270 | 270 |
| Configuration | On-chip flash (single-chip, instant-on) | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V (low-power core) |
주요 차별점
- Fastest timing bin in the 600K FG484 family (vs A3PE600-FGG484I)
- Industrial temperature rating for harsh environments (vs A3PE600-2FGG484)
- Lower static power than the L-variant trade in reverse (vs A3PE600L-FGG484M)
- RoHS-compliant green package (vs A3PE600-FG484I)
설계 노트
Estimated: a 600K-gate flash FPGA at 1.5 V core can draw several hundred milliamps of dynamic current at the -2 speed grade under high toggling activity. Budget the 1.5 V rail with a synchronous buck converter rated at 2x estimated worst-case core current, and sequence VCC/VCORE before or together with I/O banks per the ProASIC3E datasheet power-up requirements. Provide 0.1 uF ceramic decoupling at each core supply ball cluster plus at least 22-47 uF bulk per rail. Because flash FPGAs have much lower static power than SRAM FPGAs (no configuration bitstream leakage), static current is typically small, but verify with Microchip's power estimator for your specific design before finalizing the regulator selection.
The FBGA-484 uses a 1.0 mm ball pitch on a 23 x 23 mm body, requiring via-in-pad or dog-bone fanout on at least signal layers with dedicated power/ground planes. Follow the ProASIC3E datasheet PCB land pattern (ball-pad diameter approximately 0.45-0.5 mm) and assign high-speed I/Os to balls with short escape routes. GND balls around each I/O bank should be tied solidly to the ground plane to control return paths. Reflow profile per Microchip's package assembly guidelines, and inspect with X-ray for BGA voiding on prototypes. Keep the exposed routing of GCLK-capable balls short and direct.
The most common error when substituting within the A3PE600 family is assuming all FG484-suffix parts are interchangeable without recompilation: -1 and -2 speed grades differ in timing, and FG (leaded) vs FGG (green) differ in package finish, so always re-run place-and-route in Libero SoC and re-verify the compliance requirement (RoHS vs leaded) before accepting a swap. Also, flash FPGAs do not allow unlimited reconfiguration like SRAM FPGAs - flash endurance is finite, so avoid iterative in-field reprogramming loops. Finally, never leave unused I/O banks at indeterminate voltages; tie bank references per the datasheet to prevent bus contention and excess current.
규정 준수 정보
The G in the FGG package code conventionally denotes Microchip's green (RoHS-compliant, lead-free) package option versus the leaded FG variant, but an explicit RoHS/REACH compliance statement for this MPN was not present in the retrieved data; confirm via Microchip's product page or a distributor certificate.
